ECA EIA-364-93-1997 TP-93 Repeated Wire Connection and Disconnection Test Procedure for Insulation Displacement Contacts (IDC) for Electrical Connectors《TP-93型电气连接件的绝缘替代连接(IDC)的重复的.pdf

《ECA EIA-364-93-1997 TP-93 Repeated Wire Connection and Disconnection Test Procedure for Insulation Displacement Contacts (IDC) for Electrical Connectors《TP-93型电气连接件的绝缘替代连接(IDC)的重复的.pdf》由会员分享，可在线阅读，更多相关《ECA EIA-364-93-1997 TP-93 Repeated Wire Connection and Disconnection Test Procedure for Insulation Displacement Contacts (IDC) for Electrical Connectors《TP-93型电气连接件的绝缘替代连接(IDC)的重复的.pdf（8页珍藏版）》请在麦多课文档分享上搜索。

1、 EIA STANDARD TP-93 Repeated Wire Connection and Disconnection Test Procedure for Insulation Displacement Contacts (IDC) for Electrical Connectors EIA-364-93 July 1997 ANSI/EIA-364-93-1997(R2015) Approved: February 28, 1997 Reaffirmed: March 27, 2015 EIA-364-93NOTICE EIA Engineering Standards and Pu

2、blications are designed to serve the public interest through eliminating misunderstandings between manufacturers and purchasers, facilitating interchangeability and improvement of products, and assisting the purchaser in selecting and obtaining with minimum delay the proper product for his particula

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5、 owner, nor does it assume any obligation whatever to parties adopting the Standard or Publication. This EIA standard is considered to have International Standardization implication, but the International Electrotechnical Commission activity has not progresses to the point where a valid comparison b

6、etween the EIA Standard and the IEC document can be made. This Standard does not purport to address all safety problems associated with its use or all applicable regulatory requirements. It is the responsibility of the user of this Standard to establish appropriate safety and health practices and to

7、 determine the applicability of regulatory limitations before its use. (From Standards Proposal No. 3654, formulated under the cognizance of the CE-2.0 Committee on EIA National Connector and Socket Standards, and reaffirmed per Standards Proposal No. 5346.10). Published by Electronic Components Ind

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