DLA SMD-5962-97563 REV A-1998 MICROCIRCUIT HYBRID ANALOG TO DIGITAL CONVERTER 10-BIT 100 MSPS《100-BIT 100多相串行-并行-串行存贮器类似体对数字转换器混合微电路》.pdf
《DLA SMD-5962-97563 REV A-1998 MICROCIRCUIT HYBRID ANALOG TO DIGITAL CONVERTER 10-BIT 100 MSPS《100-BIT 100多相串行-并行-串行存贮器类似体对数字转换器混合微电路》.pdf》由会员分享,可在线阅读,更多相关《DLA SMD-5962-97563 REV A-1998 MICROCIRCUIT HYBRID ANALOG TO DIGITAL CONVERTER 10-BIT 100 MSPS《100-BIT 100多相串行-并行-串行存贮器类似体对数字转换器混合微电路》.pdf(13页珍藏版)》请在麦多课文档分享上搜索。
1、REVISIONSLTR DESCRIPTION DATE (YR-MO-DA) APPROVEDA Table I, delete; reference output, output voltage test. 98-04-15 K. A. CottongimREV SHEETREVSHEETREV STATUSOF SHEETSREV AAAAAAAAAAAASHEET 12345678910112PMIC N/APREPARED BY Gary Zahn DEFENSE SUPPLY CENTER COLUMBUS P. O. BOX 3990 COLUMBUS, OHIO 43216-
2、5000 STANDARDMICROCIRCUITDRAWINGTHIS DRAWING IS AVAILABLEFOR USE BY ALLDEPARTMENTSAND AGENCIES OF THEDEPARTMENT OF DEFENSEAMSC N/A CHECKED BYMichael C. JonesMICROCIRCUIT, HYBRID, ANALOG TO DIGITALCONVERTER, 10-BIT, 100 MSPSAPPROVED BYKendall A. CottongimDRAWING APPROVAL DATE97-06-24SIZEACAGE CODE672
3、685962-97563REVISION LEVELASHEET 1 OF 12DSCC FORM 2233APR 97 5962-E279-98DISTRIBUTION STATEMENT A. Approved for public release; distribution is unlimited.Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-STANDARDMICROCIRCUIT DRAWINGDEFENSE SUPPLY CENTE
4、R COLUMBUSCOLUMBUS, OHIO 43216-5000SIZEA5962-97563REVISION LEVELASHEET2DSCC FORM 2234APR 971. SCOPE1.1 Scope. This drawing documents five product assurance classes, class D (lowest reliability), class E, (exceptions), class G(lowest high reliability), class H (high reliability), and class K, (highes
5、t reliability) and a choice of case outlines and lead finishesare available and are reflected in the Part or Identifying Number (PIN). When available, a choice of radiation hardnessassurance levels are reflected in the PIN.1.2 PIN. The PIN shall be as shown in the following example:5962 - 97563 01 H
6、 X C G0DG0D G0D G0D G0D G0DG0DG0D G0D G0D G0D G0DG0D G0D G0D G0D G0D G0D Federal RHA Device Device Case Leadstock class designator type class outline finishdesignator (see 1.2.1) (see 1.2.2) designator (see 1.2.4) (see 1.2.5) / (see 1.2.3)/ Drawing number 1.2.1 Radiation hardness assurance (RHA) des
7、ignator. Device classes H and K RHA marked devices shall meet theMIL-PRF-38534 specified RHA levels and shall be marked with the appropriate RHA designator. A dash (-) indicates a non-RHAdevice.1.2.2 Device type(s). The device type(s) shall identify the circuit function as follows:Device type Generi
8、c number Circuit function01 AD9070TD 10-bit, 100 MSPS, analog-to-digital converter1.2.3 Device class designator. This device class designator shall be a single letter identifying the product assurance level asfollows:Device class Device performance documentationD, E, G, H, or K Certification and qua
9、lification to MIL-PRF-385341.2.4 Case outline(s). The case outline(s) shall be as designated in MIL-STD-1835 and as follows:Outline letter Descriptive designator Terminals Package styleX CDIP2-T28 28 Dual-in-line1.2.5 Lead finish. The lead finish shall be as specified in MIL-PRF-38534. Provided by I
10、HSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-STANDARDMICROCIRCUIT DRAWINGDEFENSE SUPPLY CENTER COLUMBUSCOLUMBUS, OHIO 43216-5000SIZEA5962-97563REVISION LEVELASHEET3DSCC FORM 2234APR 971.3 Absolute maximum ratings. 1/Negative supply voltage (V ) . -6 V dcEEAnal
11、og inputs V - 1 V to +1.0 VEEDigital inputs V to 0.0 VEEV , V V to 0.0 VREF IN REF OUT EEDigital output current 20 mAThermal impedances:Junction to case ( ). 8(C/WJCAmbient to case ( ). 43(C/WCAJunction to ambient ( ) 51(C/WJAJunction temperature (T ) +175(CJCase temperature (T ) +150(CCLead tempera
12、ture soldering (10 seconds) +300(CStorage temperature range . -65(C to +150(C1.4 Recommended operating conditions.Negative supply voltage (V ) . -5 V dcEEAmbient operating temperature range . -55(C to +125(C2. APPLICABLE DOCUMENTS2.1 Government specification, standards, and handbook. The following s
13、pecification, standards, and handbook form a part ofthis drawing to the extent specified herein. Unless otherwise specified, the issues of these documents are those listed in theissue of the Department of Defense Index of Specifications and Standards (DoDISS) and supplement thereto, cited in thesoli
14、tation.SPECIFICATIONDEPARTMENT OF DEFENSEMIL-PRF-38534 - Hybrid Microcircuits, General Specification for.STANDARDSDEPARTMENT OF DEFENSEMIL-STD-883 - Test Methods and Procedures for Microelectronics.MIL-STD-973 - Configuration Management.MIL-STD-1835 - Microcircuit Case Outlines.HANDBOOKDEPARTMENT OF
15、 DEFENSEMIL-HDBK-780 - Standard Microcircuit Drawings.(Unless otherwise indicated, copies of the specification, standards, and handbook are available from the StandardizationDocument Order Desk, 700 Robbins Avenue, Building 4D, Philadelphia, PA 19111-5094.)2.2 Order of precedence. In the event of a
16、conflict between the text of this drawing and the references cited herein, the text ofthis drawing takes precedence. Nothing in this document, however, supersedes applicable laws and regulations unless aspecific exemption has been obtained.1/ Stresses above the absolute maximum rating may cause perm
17、anent damage to the device. Extended operation at themaximum levels may degrade performance and affect reliability.Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-STANDARDMICROCIRCUIT DRAWINGDEFENSE SUPPLY CENTER COLUMBUSCOLUMBUS, OHIO 43216-5000SIZE
18、A5962-97563REVISION LEVELASHEET4DSCC FORM 2234APR 973. REQUIREMENTS3.1 Item requirements. The individual item performance requirements for device classes D, E, G, H, and K shall be inaccordance with MIL-PRF-38534. Compliance with MIL-PRF-38534 may include the performance of all tests herein or asdes
19、ignated in the device manufacturers Quality Management (QM) plan or as designated for the applicable device class. Therefore, the tests and inspections herein may not be performed for the applicable device class (see MIL-PRF-38534). Futhermore, the manufacturers may take exceptions or use alternate
20、methods to the tests and inspections herein and notperform them. However, the performance requirements as defined in MIL-PRF-38534 shall be met for the applicable deviceclass.3.2 Design, construction, and physical dimensions. The design, construction, and physical dimensions shall be as specified in
21、MIL-PRF-38534 and herein.3.2.1 Case outline(s). The case outline(s) shall be in accordance with 1.2.4 herein.3.2.2 Terminal connections. The terminal connections shall be as specified on figure 1.3.2.3 Output coding table(s). The output coding table(s) shall be as specified on figure 2.3.2.4 Timing
22、diagram(s). The timing diagram(s) shall be as specified on figure 3.3.3 Electrical performance characteristics. Unless otherwise specified herein, the electrical performance characteristics areas specified in table I and shall apply over the full specified operating temperature range.3.4 Electrical
23、test requirements. The electrical test requirements shall be the subgroups specified in table II. The electricaltests for each subgroup are defined in table I.3.5 Marking of Device(s). Marking of device(s) shall be in accordance with MIL-PRF-38534. The device shall be marked withthe PIN listed in 1.
24、2 herein. In addition, the manufacturers vendor similar PIN may also be marked as listed in QML-38534.3.6 Data. In addition to the general performance requirements of MIL-PRF-38534, the manufacturer of the device describedherein shall maintain the electrical test data (variables format) from the ini
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