DLA SMD-5962-96858 REV C-2008 MICROCIRCUIT DIGITAL ADVANCED HIGH SPEED CMOS OCTAL BUFFER DRIVER WITH THREE STATE OUTPUTS TTL COMPATIBLE INPUTS MONOLITHIC SILICON.pdf

《DLA SMD-5962-96858 REV C-2008 MICROCIRCUIT DIGITAL ADVANCED HIGH SPEED CMOS OCTAL BUFFER DRIVER WITH THREE STATE OUTPUTS TTL COMPATIBLE INPUTS MONOLITHIC SILICON.pdf》由会员分享，可在线阅读，更多相关《DLA SMD-5962-96858 REV C-2008 MICROCIRCUIT DIGITAL ADVANCED HIGH SPEED CMOS OCTAL BUFFER DRIVER WITH THREE STATE OUTPUTS TTL COMPATIBLE INPUTS MONOLITHIC SILICON.pdf（18页珍藏版）》请在麦多课文档分享上搜索。

1、 REVISIONS LTR DESCRIPTION DATE (YR-MO-DA) APPROVED A Changes in accordance with NOR 5962-R348-97. - JAK 97-06-27 Monica L. Poelking B Changes in accordance with NOR 5962-R458-97. - CFS 97-09-12 Monica L. Poelking C Update boilerplate to current MIL-PRF-38535 requirements. - MAA 08-06-02 Thomas M. H

2、ess REV SHEET REV SHEET REV C C C SHEET 15 16 17 REV C C C C C C C C C C C C C C REV STATUS OF SHEETS SHEET 1 2 3 4 5 6 7 8 9 10 11 12 13 14 PMIC N/A PREPARED BY RICK OFFICER CHECKED BY RAJESH PITHADIA DEFENSE SUPPLY CENTER COLUMBUS COLUMBUS, OHIO 43218 - 3990 http:/www.dscc.dla.mil APPROVED BY RAYM

3、OND MONNIN DRAWING APPROVAL DATE 96-08-15 MICROCIRCUIT, DIGITAL, ADVANCED HIGH SPEED CMOS, OCTAL BUFFER/DRIVER WITH THREE STATE OUTPUTS, TTL COMPATIBLE INPUTS, MONOLITHIC SILICON SIZE A CAGE CODE 67268 5962-96858 STANDARD MICROCIRCUIT DRAWING THIS DRAWING IS AVAILABLE FOR USE BY ALL DEPARTMENTS AND

4、AGENCIES OF THE DEPARTMENT OF DEFENSE AMSC N/A REVISION LEVEL C SHEET 1 OF 17 DSCC FORM 2233 APR 97 5962-E404-08 Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHSSIZE A 5962-96858 STANDARD MICROCIRCUIT DRAWING DEFENSE SUPPLY CENTER COLUMBUS COLUMBUS, OHIO

5、43218 - 3990 REVISION LEVEL C SHEET 2 DSCC FORM 2234 APR 97 1. SCOPE 1.1 Scope. This drawing documents two product assurance class levels consisting of high reliability (device classes Q and M) and space application (device class V). A choice of case outlines and lead finishes are available and are

6、reflected in the Part or Identifying Number (PIN). When available, a choice of Radiation Hardness Assurance (RHA) levels is reflected in the PIN. 1.2 PIN. The PIN is as shown in the following example: 5962 - 96858 01 Q R A Federal RHA Device Device Case Lead stock class designator type class outline

7、 finish designator (see 1.2.1) (see 1.2.2) designator (see 1.2.4) (see 1.2.5) / (see 1.2.3) / Drawing number 1.2.1 RHA designator. Device classes Q and V RHA marked devices meet the MIL-PRF-38535 specified RHA levels and are marked with the appropriate RHA designator. Device class M RHA marked devic

8、es meet the MIL-PRF-38535, appendix A specified RHA levels and are marked with the appropriate RHA designator. A dash (-) indicates a non-RHA device. 1.2.2 Device type(s). The device type(s) identify the circuit function as follows: Device type Generic number Circuit function 01 54AHCT541 Octal buff

9、er/driver with three-state outputs, TTL compatible inputs. 1.2.3 Device class designator. The device class designator is a single letter identifying the product assurance level as follows: Device class Device requirements documentation M Vendor self-certification to the requirements for MIL-STD-883

10、compliant, non-JAN class level B microcircuits in accordance with MIL-PRF-38535, appendix A. Q or V Certification and qualification to MIL-PRF-38535 1.2.4 Case outline(s). The case outline(s) are as designated in MIL-STD-1835 and as follows: Outline letter Descriptive designator Terminals Package st

11、yle R GDIP1-T20 or CDIP2-T20 20 Dual-in-line S GDFP2-F20 or CDFP3-F20 20 Flat pack 2 CQCC1-N20 20 Square leadless chip carrier 1.2.5 Lead finish. The lead finish is as specified in MIL-PRF-38535 for device classes Q and V or MIL-PRF-38535, appendix A for device class M. Provided by IHSNot for Resale

12、No reproduction or networking permitted without license from IHSSIZE A 5962-96858 STANDARD MICROCIRCUIT DRAWING DEFENSE SUPPLY CENTER COLUMBUS COLUMBUS, OHIO 43218 - 3990 REVISION LEVEL C SHEET 3 DSCC FORM 2234 APR 97 1.3 Absolute maximum ratings. 1/ 2/ 3/ Supply voltage range (VCC) -0.5 V dc to +7.

13、0 V dc DC input voltage range (VIN) -0.5 V dc to +7.0 V dc 4/ DC output voltage range (VOUT) . -0.5 V dc to VCC+ 0.5 V dc 4/ DC input clamp current (IIK) (VINVCC). 20 mA Continuous output current (IOUT) (VOUT= 0.0 V to VCC) 25 mA Continuous current through VCCor GND 75 mA Maximum power dissipation a

14、t TA= +55C (in still air) (PD ) 700 mW Storage temperature range (TSTG) . -65C to +150C Lead temperature (soldering, 10 seconds). +300C Thermal resistance, junction-to-case (JC) . See MIL-STD-1835 Junction temperature (TJ) +150C 1.4 Recommended operating conditions. 2/ 3/ 5/ Supply voltage range (VC

15、C) +4.5 V dc to +5.5 V dc Minimum high level input voltage (VIH). +2.0 V Maximum low level input voltage (VIL) +0.8 V Input voltage range (VIN) +0.0 V dc to 5.5 V Output voltage range (VOUT). +0.0 V dc to VCCMaximum high level output current (IOH) -8 mA Maximum low level output current (IOL) +8 mA M

16、aximum input rise or fall rate (t/V) 20 ns/V Case operating temperature range (TC). -55C to +125C 1/ Stresses above the absolute maximum rating may cause permanent damage to the device. Extended operation at the maximum levels may degrade performance and affect reliability. 2/ Unless otherwise noted

17、, all voltages are referenced to GND. 3/ The limits of the parameters specified herein shall apply over the full specified VCCrange and case temperature range of -55C to +125C. Unused inputs must be held high or low 4/ The input and output voltage ratings may be exceeded provided that the input and

18、output current ratings are observed. 5/ Unused inputs must be held high or low to prevent them from floating. Provided by IHSNot for Resale-,-,-SIZE A 5962-96858 STANDARD MICROCIRCUIT DRAWING DEFENSE SUPPLY CENTER COLUMBUS COLUMBUS, OHIO 43218 - 3990 REVISION LEVEL C SHEET 4 DSCC FORM 2234 APR 97 2.

19、 APPLICABLE DOCUMENTS 2.1 Government specification, standards, and handbooks. The following specification, standards, and handbooks form a part of this drawing to the extent specified herein. Unless otherwise specified, the issues of these documents are those cited in the solicitation. or contract D

20、EPARTMENT OF DEFENSE SPECIFICATION MIL-PRF-38535 - Integrated Circuits, Manufacturing, General Specification for. DEPARTMENT OF DEFENSE STANDARDS MIL-STD-883 - Test Method Standard Microcircuits. MIL-STD-1835 - Interface Standard Electronic Component Case Outlines. DEPARTMENT OF DEFENSE HANDBOOKS MI

21、L-HDBK-103 - List of Standard Microcircuit Drawings. MIL-HDBK-780 - Standard Microcircuit Drawings. (Copies of these documents are available online at http:/assist.daps.dla.mil/quicksearch/ or from the Standardization Document Order Desk, 700 Robbins Avenue, Building 4D, Philadelphia, PA 19111-5094.

22、) 2.2 Non-Government publications. The following document(s) form a part of this document to the extent specified herein. Unless otherwise specified, the issues of these documents are those cited in the solicitation or contract. ELECTRONIC INDUSTRIES ALLIANCE (EIA) JESD 7A - Standard for Description

23、 of 54/74HCXXXX and 54/74HCTXXXX High-Speed CMOS Devices. (Copies of these documents are available online at http:/www.eia.org/ or from the Electronic Industries Alliance, 2500 Wilson Boulevard, Arlington, VA 22201-3834.) 2.3 Order of precedence. In the event of a conflict between the text of this d

24、rawing and the references cited herein, the text of this drawing takes precedence. Nothing in this document, however, supersedes applicable laws and regulations unless a specific exemption has been obtained. 3. REQUIREMENTS 3.1 Item requirements. The individual item requirements for device classes Q

25、 and V shall be in accordance with MIL-PRF-38535 and as specified herein or as modified in the device manufacturers Quality Management (QM) plan. The modification in the QM plan shall not affect the form, fit, or function as described herein. The individual item requirements for device class M shall

26、 be in accordance with MIL-PRF-38535, appendix A for non-JAN class level B devices and as specified herein. 3.2 Design, construction, and physical dimensions. The design, construction, and physical dimensions shall be as specified in MIL-PRF-38535 and herein for device classes Q and V or MIL-PRF-385

27、35, appendix A and herein for device class M. 3.2.1 Case outlines. The case outlines shall be in accordance with 1.2.4 herein. 3.2.2 Terminal connections. The terminal connections shall be as specified on figure 1. 3.2.3 Truth table. The truth table shall be as specified on figure 2. 3.2.4 Block or

28、Logic diagram. The block or logic diagram shall be as specified on figure 3. 3.2.5 Ground bounce load circuit and waveforms. The ground bounce load circuit and waveforms shall be as specified on figure 4. 3.2.6 Switching waveforms and test circuit. The switching waveforms and test circuit shall be a

29、s specified on figure 5. Provided by IHSNot for Resale-,-,-SIZE A 5962-96858 STANDARD MICROCIRCUIT DRAWING DEFENSE SUPPLY CENTER COLUMBUS COLUMBUS, OHIO 43218 - 3990 REVISION LEVEL C SHEET 5 DSCC FORM 2234 APR 97 3.3 Electrical performance characteristics and post-irradiation parameter limits. Unles

30、s otherwise specified herein, the electrical performance characteristics and post-irradiation parameter limits are as specified in table I and shall apply over the full case operating temperature range. 3.4 Electrical test requirements. The electrical test requirements shall be the subgroups specifi

31、ed in table II. The electrical tests for each subgroup are defined in table I. 3.5 Marking. The part shall be marked with the PIN listed in 1.2 herein. In addition, the manufacturers PIN may also be marked. For packages where marking of the entire SMD PIN number is not feasible due to space limitati

32、ons, the manufacturer has the option of not marking the “5962-“ on the device. For RHA product using this option, the RHA designator shall still be marked. Marking for device classes Q and V shall be in accordance with MIL-PRF-38535. Marking for device class M shall be in accordance with MIL-PRF-385

33、35, appendix A. 3.5.1 Certification/compliance mark. The certification mark for device classes Q and V shall be a “QML“ or “Q“ as required in MIL-PRF-38535. The compliance mark for device class M shall be a “C“ as required in MIL-PRF-38535, appendix A. 3.6 Certificate of compliance. For device class

34、es Q and V, a certificate of compliance shall be required from a QML-38535 listed manufacturer in order to supply to the requirements of this drawing (see 6.6.1 herein). For device class M, a certificate of compliance shall be required from a manufacturer in order to be listed as an approved source

35、of supply in MIL-HDBK-103 (see 6.6.2 herein). The certificate of compliance submitted to DSCC-VA prior to listing as an approved source of supply for this drawing shall affirm that the manufacturers product meets, for device classes Q and V, the requirements of MIL-PRF-38535 and herein or for device

36、 class M, the requirements of MIL-PRF-38535, appendix A and herein. 3.7 Certificate of conformance. A certificate of conformance as required for device classes Q and V in MIL-PRF-38535 or for device class M in MIL-PRF-38535, appendix A shall be provided with each lot of microcircuits delivered to th

37、is drawing. 3.8 Notification of change for device class M. For device class M, notification to DSCC-VA of change of product (see 6.2 herein) involving devices acquired to this drawing is required for any change that affects this drawing. 3.9 Verification and review for device class M. For device cla

38、ss M, DSCC, DSCCs agent, and the acquiring activity retain the option to review the manufacturers facility and applicable required documentation. Offshore documentation shall be made available onshore at the option of the reviewer. 3.10 Microcircuit group assignment for device class M. Device class

39、M devices covered by this drawing shall be in microcircuit group number 36 (see MIL-PRF-38535, appendix A). Provided by IHSNot for Resale-,-,-SIZE A 5962-96858 STANDARD MICROCIRCUIT DRAWING DEFENSE SUPPLY CENTER COLUMBUS COLUMBUS, OHIO 43218 - 3990 REVISION LEVEL C SHEET 6 DSCC FORM 2234 APR 97 TABL

40、E I. Electrical performance characteristics. Limits 3/ Test and MIL-STD-883 test method 1/ Symbol Test conditions 2/ -55C TC +125C +4.5 V VCC +5.5 V unless otherwise specified VCCGroup A subgroups Min Max Unit IOH= -50 A 1, 2, 3 4.40 1 3.94 High level output voltage 3006 VOHFor all inputs affecting

41、output under test, VIN= 2.0 V or 0.8 VFor all other inputs, VIN= VCCor GND IOH= -8 mA 4.5 V 2, 3 3.80 V IOL= +50 A 1, 2, 3 0.1 1 0.36 Low level output voltage 3007 VOLFor all inputs affecting output under test, VIN= 2.0 V or 0.8 VFor all other inputs, VIN= VCCor GND IOL= +8 mA 4.5 V 2, 3 0.44 V 1 +0

42、.1 Input current high 3010 IIHFor input under test, VIN= VCCFor all other inputs, VIN= VCCor GND 5.5 V 2, 3 +1.0 A 1 -0.1 Input current low 3009 IILFor input under test, VIN= GND For all other inputs, VIN= VCCor GND 5.5 V 2, 3 -1.0 A 1 +0.25 Three-state output leakage current high 3021 IOZH 4/ VOUT=

43、 VCC5.5 V 2, 3 +2.5 A 1 -0.25 Three-state output leakage current low 3020 IOZL 4/ VOUT= GND 5.5 V 2, 3 -2.5 A 1 4.0 Quiescent supply current 3005 ICCFor all inputs, VIN= VCCor GND IOUT= 0.0 A 5.5 V 2, 3 40.0 A 1 1.35 Quiescent supply current delta, TTL input levels 3005 ICC5/ For input at 3.4 V Othe

44、r inputs at VCCor GND 5.5 V 2, 3 1.50 mA Input capacitance 3012 CINTC= +25C, VIN= VCCor GND See 4.4.1c 5.0 V 4 10.0 pF Output capacitance 3012 COUTTC= +25C, VOUT= VCCor GND See 4.4.1c 5.0 V 4 10.0 pF Power dissipation capacitance CPD6/ CL= 50 pF minimum f = 1 MHz See 4.4.1c 5.0 V 4 14.0 pF See footn

45、otes at end of table. Provided by IHSNot for Resale-,-,-SIZE A 5962-96858 STANDARD MICROCIRCUIT DRAWING DEFENSE SUPPLY CENTER COLUMBUS COLUMBUS, OHIO 43218 - 3990 REVISION LEVEL C SHEET 7 DSCC FORM 2234 APR 97 TABLE I. Electrical performance characteristics - Continued. Limits 3/ Test and MIL-STD-88

46、3 test method 1/ Symbol Test conditions 2/ -55C TC +125C +4.5 V VCC +5.5 V unless otherwise specified VCCGroup A subgroups Min Max Unit VOLP7/ 5.0 V 4 1.80 V Low level ground bounce noise VOLV7/ 5.0 V 4 -1.60 V VOHP7/ 5.0 V 4 0.80 V High level VCCbounce noise VOHV7/ VIH= VCC, VIL= 0.0 V TA= +25C See

47、 4.4.1d See figure 4 5.0 V 4 -1.20 V Functional test 3014 8/ VIH= 2.0 V, VIL= 0.8 V Verify output VOSee 4.4.1b 4.5 V and 5.5 V 7, 8 L H 9 6.0 CL= 15 pF minimum See figure 5 10/ 4.5 V and 5.5 V 10, 11 1.0 6.5 9 8.5 tPLH, 9/ CL= 50 pF minimum See figure 5 4.5 V and 5.5 V 10, 11 1.0 9.5 ns 9 5.5 CL= 15

48、 pF minimum See figure 5 10/ 4.5 V and 5.5 V 10, 11 1.0 6.5 9 8.5 Propagation delay time, Am to Ym 3003 tPHL 9/ CL= 50 pF minimum See figure 5 4.5 V and 5.5 V 10, 11 1.0 9.5 ns 9 7.0 CL= 15 pF minimum See figure 5 10/ 4.5 V and 5.5 V 10, 11 1.0 8.0 9 10.0 tPZH, 9/ CL= 50 pF minimum See figure 5 4.5 V and 5.5 V 10, 11 1.0 12.0 ns 9 7.0 CL= 15 pF minimum See figure 5 10/ 4.5 V and 5.5 V 10, 11 1.0 8.0 9 10.0 Propagation delay time, output enable _ OEm to Ym 3003 tPZL 9 CL= 50 pF minimum See figure 5 4.5 V and 5.5 V 10, 11 1.0 12.0 ns See footnotes at en