DLA SMD-5962-95693 REV E-2010 MICROCIRCUIT LINEAR RADIATION HARDENED CMOS MULTIPLEXER DEMULTIPLEXER WITH ACTIVE OVERVOLTAGE PROTECTION MONOLITHIC SILICON.pdf
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1、 REVISIONS LTR DESCRIPTION DATE (YR-MO-DA) APPROVED A Changes in accordance with NOR 5962-R001-99 98-10-8 R. Monnin B Change conditions for input leakage current an overvoltage leakage current in table I. Editorial changes throughout. - lgt 99-02-24 R. Monnin C Make change to descriptive designator
2、as specified in 1.2.4. - ro 99-04-28 R. Monnin D Make changes to access time and enable delay waveforms as specified under figure 3. - ro 00-07-19 R. Monnin E Redraw. Update drawing to current requirements. - drw 10-11-09 Charles F. SaffleTHE ORIGINAL FIRST PAGE OF THIS DRAWING HAS BEEN REPLACED REV
3、 SHET REV E E E E E E E E E E SHEET 15 16 17 18 19 20 21 22 23 24 REV STATUS REV E E E E E E E E E E E E E E OF SHEETS SHEET 1 2 3 4 5 6 7 8 9 10 11 12 13 14 PMIC N/A PREPARED BY Sandra Rooney DLA LAND AND MARITIME COLUMBUS, OHIO 43218-3990 http:/www.dscc.dla.mil STANDARD MICROCIRCUIT DRAWING THIS D
4、RAWING IS AVAILABLE FOR USE BY ALL DEPARTMENTS AND AGENCIES OF THE DEPARTMENT OF DEFENSE CHECKED BY Sandra Rooney APPROVED BY Michael A. Frye MICROCIRCUIT, LINEAR, RADIATION HARDENED CMOS, MULTIPLEXER/DEMULTIPLEXER WITH ACTIVE OVERVOLTAGE PROTECTION, MONOLITHIC SILICON DRAWING APPROVAL DATE 96-02-27
5、 AMSC N/A REVISION LEVEL E SIZE A CAGE CODE 67268 5962-95693 SHEET 1 OF 24 DSCC FORM 2233 APR 97 5962-E023-11 Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-STANDARD MICROCIRCUIT DRAWING SIZE A 5962-95693 DLA LAND AND MARITIME COLUMBUS, OHIO 43218-3
6、990 REVISION LEVEL E SHEET 2 DSCC FORM 2234 APR 97 1. SCOPE 1.1 Scope. This drawing documents two product assurance class levels consisting of high reliability (device classes Q and M) and space application (device class V). A choice of case outlines and lead finishes are available and are reflected
7、 in the Part or Identifying Number (PIN). When available, a choice of Radiation Hardness Assurance (RHA) levels is reflected in the PIN. 1.2 PIN. The PIN is as shown in the following example: 5962 D 95693 01 V X A Federal stock class designator RHA designator (see 1.2.1) Device type (see 1.2.2)Devic
8、e class designatorCase outline (see 1.2.4) Leadfinish (see 1.2.5) / (see 1.2.3) / Drawing number 1.2.1 RHA designator. Device classes Q and V RHA marked devices meet the MIL-PRF-38535 specified RHA levels and are marked with the appropriate RHA designator. Device class M RHA marked devices meet the
9、MIL-PRF-38535, appendix A specified RHA levels and are marked with the appropriate RHA designator. A dash (-) indicates a non-RHA device. 1.2.2 Device types. The device types identify the circuit function as follows: Device type Generic number Circuit function 01 HS546RH Radiation hardened DI single
10、 16-channel MUX/DEMUX with active overvoltage protection 02 HS547RH Radiation hardened DI differential 8-channel MUX/DEMUX with active overvoltage protection 1.2.3 Device class designator. The device class designator is a single letter identifying the product assurance level as follows: Device class
11、 Device requirements documentation M Vendor self-certification to the requirements for MIL-STD-883 compliant, non-JAN class level B microcircuits in accordance with MIL-PRF-38535, appendix A Q or V Certification and qualification to MIL-PRF-38535 1.2.4 Case outline. The case outline is as designated
12、 in MIL-STD-1835 as follows: Outline letter Descriptive designator Terminals Package style X GDIP1-T28 or CDIP2-T28 28 Dual-in-line 1.2.5 Lead finish. The lead finish is as specified in MIL-PRF-38535 for device classes Q and V or MIL-PRF-38535, appendix A for device class M. Provided by IHSNot for R
13、esaleNo reproduction or networking permitted without license from IHS-,-,-STANDARD MICROCIRCUIT DRAWING SIZE A 5962-95693 DLA LAND AND MARITIME COLUMBUS, OHIO 43218-3990 REVISION LEVEL E SHEET 3 DSCC FORM 2234 APR 97 1.3 Absolute maximum ratings. 1/ Supply voltage between +V and -V . +44 V Supply vo
14、ltage between +V and ground . +22 V Supply voltage between -V and ground . -25 V Digital input overvoltage +VEN, +VA. +VSUPPLY+ 4 V -VEN, -VA. -VSUPPLY 4 V Analog input overvoltage +VS. +VSUPPLY+ 20 V -VS-VSUPPLY 20 V Continuous current, S or D (pulsed at 1 ms, 10 percent duty cycle max) 40 mA Stora
15、ge temperature range -65C to +150C Maximum power dissipation at TA= 125C (PD) . 1 W 2/ Thermal resistance, junction-to-case (JC) 18C/W Thermal resistance, junction-to-ambient (JA) 50C/W Lead temperature (soldering, 10 seconds) . +275C Junction temperature (TJ) . +175C 1.4 Recommended operating condi
16、tions. Operating supply voltage (VSUPPLY) . 15 V Analog input voltage (VS) VSUPPLYLogic low level (VAL) . 0 V to +0.8 V Logic high level (VAH) +4 V to +VSUPPLYMax RMS current, S or D . 8 mA Ambient operating temperature range (TA) . -55C to +125C 1.5 Radiation features. Maximum total dose available
17、(dose rate = 50 300 rads (Si)/s) . 10 Krads (Si) Dose rate upset (20 ns pulse) . 3/ Dose rate burnout . 3/ Dose rate latch-up 4/ 2. APPLICABLE DOCUMENTS 2.1 Government specification, standards, and handbooks. The following specification, standards, and handbooks form a part of this drawing to the ex
18、tent specified herein. Unless otherwise specified, the issues of these documents are those cited in the solicitation or contract. DEPARTMENT OF DEFENSE SPECIFICATION MIL-PRF-38535 - Integrated Circuits, Manufacturing, General Specification for. DEPARTMENT OF DEFENSE STANDARDS MIL-STD-883 - Test Meth
19、od Standard Microcircuits. MIL-STD-1835 - Interface Standard Electronic Component Case Outlines. _ 1/ Stresses above the absolute maximum rating may cause permanent damage to the device. Extended operation at the maximum levels may degrade performance and affect reliability. 2/ If device power excee
20、ds package dissipation capability, provide heat sinking or derate linearly (the derating is based on JA) at the rate of 20 mW/C for case outline X. 3/ Values to be specified when testing is completed. 4/ Devices use dielectrically isolated (DI) technology and latch-up is not physically possible. Pro
21、vided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-STANDARD MICROCIRCUIT DRAWING SIZE A 5962-95693 DLA LAND AND MARITIME COLUMBUS, OHIO 43218-3990 REVISION LEVEL E SHEET 4 DSCC FORM 2234 APR 97 DEPARTMENT OF DEFENSE HANDBOOKS MIL-HDBK-103 - List of Standar
22、d Microcircuit Drawings. MIL-HDBK-780 - Standard Microcircuit Drawings. (Copies of these documents are available online at https:/assist.daps.dla.mil/quicksearch/ or from the Standardization Document Order Desk, 700 Robbins Avenue, Building 4D, Philadelphia, PA 19111-5094.) 2.2 Order of precedence.
23、In the event of a conflict between the text of this drawing and the references cited herein, the text of this drawing takes precedence. Nothing in this document, however, supersedes applicable laws and regulations unless a specific exemption has been obtained. 3. REQUIREMENTS 3.1 Item requirements.
24、The individual item requirements for device classes Q and V shall be in accordance with MIL-PRF-38535 and as specified herein or as modified in the device manufacturers Quality Management (QM) plan. The modification in the QM plan shall not affect the form, fit, or function as described herein. The
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