DLA SMD-5962-89826 REV F-2007 MICROCIRCUIT HYBRID DIGITAL DUAL CHANNEL 12 VOLT DRIVER-RECEIVER《双信道12伏特驱动器-接收器的数字混合微型电路》.pdf
《DLA SMD-5962-89826 REV F-2007 MICROCIRCUIT HYBRID DIGITAL DUAL CHANNEL 12 VOLT DRIVER-RECEIVER《双信道12伏特驱动器-接收器的数字混合微型电路》.pdf》由会员分享,可在线阅读,更多相关《DLA SMD-5962-89826 REV F-2007 MICROCIRCUIT HYBRID DIGITAL DUAL CHANNEL 12 VOLT DRIVER-RECEIVER《双信道12伏特驱动器-接收器的数字混合微型电路》.pdf(23页珍藏版)》请在麦多课文档分享上搜索。
1、 REVISIONS LTR DESCRIPTION DATE (YR-MO-DA) APPROVED A Change in accordance with NOR 5962-R117-94. 92-02-10 K. A. Cottongim B Added device types 07 and 08. Added additional waveform to figure 4. Made technical changes to table I. Renumber figures from 1, 2, 3, and 4 to 1, 2, and 3. Redrew entire docu
2、ment. 94-06-24 K. A. Cottongim C Change in accordance with NOR 5962-R022-96. 95-12-19 K. A. Cottongim D Added device type 09 with CAGE 88739. Added device type 10 with CAGE 57363. Added case outlines U and Z to figure 1. Redrew entire document. 96-02-22 K. A. Cottongim E Correct paragraphs 4.2.a.2.
3、and 4.3.3.b.2 and add TA. Table I, correct the note numbering sequence throughout the table. 05-02-22 Raymond Monnin F Table I; changed the maximum limit for ICC1-SB, ICC1-25, ICC1-50, and ICC1-100 from 25 mA to 60 mA for device type 03, 04, and 10. Editorial changes throughout. -sld 07-05-04 Robert
4、 M.Heber REV SHEET REV F F F F F F F SHEET 15 16 17 18 19 20 21 REV STATUS REV F F F F F F F F F F F F F F OF SHEETS SHEET 1 2 3 4 5 6 7 8 9 10 11 12 13 14 PMIC N/A PREPARED BY Gary Zahn STANDARD MICROCIRCUIT DRAWING CHECKED BY Robert M. Heber DEFENSE SUPPLY CENTER COLUMBUS COLUMBUS, OHIO 43218-3990
5、 http:/www.dscc.dla.mil APPROVED BY William K. Heckman MICROCIRCUIT, HYBRID, DIGITAL, DUAL CHANNEL, 12 VOLT, DRIVER-RECEIVER THIS DRAWING IS AVAILABLE FOR USE BY ALL DEPARTMENTS AND AGENCIES OF THE DEPARTMENT OF DEFENSE DRAWING APPROVAL DATE 91-01-25 AMSC N/A REVISION LEVEL F SIZE A CAGE CODE 67268
6、5962-89826 SHEET 1 OF 21 DSCC FORM 2233 APR 97 5962-E364-07Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-STANDARD MICROCIRCUIT DRAWING SIZE A 5962-89826 DEFENSE SUPPLY CENTER COLUMBUS COLUMBUS, OHIO 43218-3990 REVISION LEVEL F SHEET 2 DSCC FORM 223
7、4 APR 97 1. SCOPE 1.1 Scope. This drawing describes device requirements for class H hybrid microcircuits to be processed in accordance with MIL-PRF-38534 and a choice of case outlines and lead finishes are available and are reflected in the Part or Identifying Number (PIN). 1.2 PIN. The PIN shall be
8、 as shown in the following example: 5962-89826 01 X X Drawing number Device type Case outline Lead finish (see 1.2.1) (see 1.2.2) (see 1.2.3) 1.2.1 Device type(s). The device type(s) identify the circuit function as follows: Coupling transformer turns ratio: Device types Generic number Circuit funct
9、ion 1/ Transformer Direct 01 BUS-63127II, BUS-63128II Low power, dual channel, 1:0.6 1:0.83 driver-receiver 02 ARX3419 “ 1:0.707 1:1 03 NHI-1502 1:0.7 1:1 04 NHI-1523 “ 1:0.57 1:0.8 05 FC1553721 1:1.66 1:1.2 06 CT1589D “ 1:0.707 1:1 07 FC1553722 “ 2/ 1:1.66 1:1.2 08 FC1553726 “ 1:0.707 1:1 09 ARX343
10、3 1:0.707 1:1 10 NHI-1522 “ 2/ 1:0.57 1:0.8 1.2.2 Case outline(s). The case outline(s) are as designated in MIL-STD-1835 and as follows: Outline letter Descriptive designator Terminals Package style U See figure 1 28 Dual-in-line X See figure 1 36 Dual-in-line Y See figure 1 36 Flat package Z See fi
11、gure 1 28 Flat package 1.2.3 Lead finish. The lead finish shall be as specified in MIL-PRF-38534. 1/ Receiver standby low, compatible with manchester encoder-decoder described in Standard Microcircuit Drawing (SMD) 78029. 2/ Receiver standby high, compatible with Smiths manchester encoder-decoder. P
12、rovided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-STANDARD MICROCIRCUIT DRAWING SIZE A 5962-89826 DEFENSE SUPPLY CENTER COLUMBUS COLUMBUS, OHIO 43218-3990 REVISION LEVEL F SHEET 3 DSCC FORM 2234 APR 97 1.3 Absolute maximum ratings. Supply voltage range:
13、 VCC(devices 02, 03, 04, 06, 09, and 10) -0.3 V dc to +18 V dc VEE(devices 01, 02, 05, 06, 07, 08, and 09). +0.3 V dc to -18 V dc VCC1(all devices) -0.3 V dc to +7 V dc Logic input voltage range. -0.3 V dc to VCC1Receiver differential voltage. 40 VP-PReceiver common mode voltage range . -10 V dc to
14、+10 V dc Driver peak output current: (devices 01, 03, 04, 06, and 10) . 200 mA (devices 05, 07, 08, and 09) . 250 mA (device 02) 400 mA Power dissipation (PD) at TC= +125C: (device 01) 3 W (device 02) 2 W 3/ 4/ 5/ (devices 03, 04, and 10). 0.96 W 3/ (devices 05, 07, and 08). 2 W 3/ (devices 06 and 0
15、9) 3 W Storage temperature range -65C to +150C Lead temperature (soldering, 10 seconds). +300C Junction temperature (TJ): (devices 01, 03, 04, 05, 06, 07, 08, and 10) . +160C (devices 02 and 09) +167C Thermal resistance, junction-to-case (JC): (device 01. 7.0C/W (devices 02 and 09) 88C/W (devices 03
16、, 04, and 10). 8.8C/W (devices 05, 07, and 08). 18C/W (device 06) 80C/W Thermal resistance, junction-to-ambiemt (JA): (device 01. 27.0C/W (devices 02 and 09) 108C/W (devices 03, 04, and 10). 28.8C/W (devices 05, 07, and 08). 35C/W (device 06) 80C/W 1.4 Recommended operating conditions. Supply voltag
17、e range: VCC(devices 02, 03, 04, 06, 09, and 10) +11.4 V dc to +12.6 V dc VEE(devices 01, 02, 05, 06, 07, 08, and 09). -11.2 V dc to -12.6 V dc VCC1(all devices) +4.5 V dc to +5.5 V dc Logic input voltage range. 0 V dc to +5 V dc Receiver differential voltage: (devices 01, 05, 07, 08) 30 VP-P(device
18、s 02, 03, 04, 06, 09, and 10) . 40 VP-PReceiver common mode voltage range: (devices 01, 02, 05, 07, and 08) . -5 V dc to +5 V dc (devices 03, 04, 06, 09, and 10) . -10 V dc to +10 V dc Driver peak output current: (devices 01, 03, 04, 05, 06, 07, 08, 09, and 10) . 220 mA (device 02) 350 mA Serial dat
19、a rate 1.0 MHz maximum Junction temperature (TJ): (devices 01, 03, 04, 05, 07, 08, 09, and 10) . +150C (devices 02 and 06) +160C Case operating temperature range (TC). -55C to +125C 3/ One channel transmitting at 100 percent duty cycle and the second channel is at standby. 4/ Worst case operating ju
20、nction temperature when case is held to +125C. 5/ Maximum junction temperature rise above case temperature for the hottest die at 100 percent transmitting duty cycle shall be 42C. Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-STANDARD MICROCIRCUIT
21、DRAWING SIZE A 5962-89826 DEFENSE SUPPLY CENTER COLUMBUS COLUMBUS, OHIO 43218-3990 REVISION LEVEL F SHEET 4 DSCC FORM 2234 APR 97 2. APPLICABLE DOCUMENTS 2.1 Government specification, standards, and handbooks. The following specification, standards, and handbooks form a part of this drawing to the e
22、xtent specified herein. Unless otherwise specified, the issues of these documents are those cited in the solicitation or contract. DEPARTMENT OF DEFENSE SPECIFICATION MIL-PRF-38534 - Hybrid Microcircuits, General Specification for. DEPARTMENT OF DEFENSE STANDARDS MIL-STD-883 - Test Method Standard M
23、icrocircuits. MIL-STD-1835 - Interface Standard for Electronic Component Case Outlines. DEPARTMENT OF DEFENSE HANDBOOKS MIL-HDBK-103 - List of Standard Microcircuit Drawings. MIL-HDBK-780 - Standard Microcircuit Drawings. MIL-HDBK-1553 - Multiplex Applications Handbook. (Copies of these documents ar
24、e available online at http:/assist.daps.dla.mil/quicksearch/ or http:/assist.daps.dla.mil or from the Standardization Document Order Desk, 700 Robbins Avenue, Building 4D, Philadelphia, PA 19111-5094.) 2.2 Order of precedence. In the event of a conflict between the text of this drawing and the refer
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