DLA DSCC-VID-V62 12649-2013 MICROCIRCUIT LINEAR 400 MHz TO 6 GHz BROADBAND QUADRATURE MODULATOR MONOLITHIC SILICON.pdf
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1、 REVISIONS LTR DESCRIPTION DATE APPROVED Prepared in accordance with ASME Y14.24 Vendor item drawing REV PAGE REV PAGE REV STATUS OF PAGES REV PAGE 1 2 3 4 5 6 7 8 9 10 11 PMIC N/A PREPARED BY Phu H. Nguyen DLA LAND AND MARITIME COLUMBUS, OHIO 43218-3990 http:/www.landandmaritime.dla.mil/ Original d
2、ate of drawing YY MM DD CHECKED BY Phu H. Nguyen TITLE MICROCIRCUIT, LINEAR, 400 MHz TO 6 GHz BROADBAND QUADRATURE MODULATOR , MONOLITHIC SILICON 13-01-08 APPROVED BY Thomas M. Hess SIZE A CODE IDENT. NO. 16236 DWG NO. V62/12649 REV PAGE 1 OF 11 AMSC N/A 5962-V035-13 Provided by IHSNot for ResaleNo
3、reproduction or networking permitted without license from IHS-,-,-DLA LAND AND MARITIME COLUMBUS, OHIO SIZE A CODE IDENT NO. 16236 DWG NO. V62/12649 REV PAGE 2 1. SCOPE 1.1 Scope. This drawing documents the general requirements of a high performance 400 MHz to 6 GHz broadband quadrature modulator mi
4、crocircuit, with an operating temperature range of -55C to +105C. 1.2 Vendor Item Drawing Administrative Control Number. The manufacturers PIN is the item of identification. The vendor item drawing establishes an administrative control number for identifying the item on the engineering documentation
5、: V62/12649 - 01 X E Drawing Device type Case outline Lead finish number (See 1.2.1) (See 1.2.2) (See 1.2.3) 1.2.1 Device type(s). Device type Generic Circuit function 01 ADL5375-EP 400 MHz to 6 GHz broadband quadrature modulator 1.2.2 Case outline(s). The case outlines are as specified herein. Outl
6、ine letter Number of pins JEDEC PUB 95 Package style X 24 JEDEC MO-220-WGGD Lead Frame Chip Scale Package 1.2.3 Lead finishes. The lead finishes are as specified below or other lead finishes as provided by the device manufacturer: Finish designator Material A Hot solder dip B Tin-lead plate C Gold p
7、late D Palladium E Gold flash palladium Z Other Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-DLA LAND AND MARITIME COLUMBUS, OHIO SIZE A CODE IDENT NO. 16236 DWG NO. V62/12649 REV PAGE 3 1.3 Absolute maximum ratings. 1/ Supply voltage, VPOS . 5.5
8、V IBBP, IBBN, QBBP, QBBN . 0 V to 2 V LOIP and LOIN 13 dBm Internal power dissipation . 1500 mW JA(Exposed paddle soldered down) 54 C/W 2/ Operating temperature range: . -55C to +105C Storage temperature range . -65C to 150C Maximum junction temperature 150C 2. APPLICABLE DOCUMENTS JEDEC SOLID STATE
9、 TECHNOLOGY ASSOCIATION (JEDEC) JEP95 Registered and Standard Outlines for Semiconductor Devices JESD51-2 Integrated Circuits Thermal Test Method Environment Conditions Natural Convection (Still Air) (Copies of these documents are available online at http:/www.jedec.org or from JEDEC Solid State Tec
10、hnology Association, 3103 North 10th Street, Suite 240S, Arlington, VA 22201.) 3. REQUIREMENTS 3.1 Marking. Parts shall be permanently and legibly marked with the manufacturers part number as shown in 6.3 herein and as follows: A. Manufacturers name, CAGE code, or logo B. Pin 1 identifier C. ESDS id
11、entification (optional) 3.2 Unit container. The unit container shall be marked with the manufacturers part number and with items A and C (if applicable) above. 3.3 Electrical characteristics. The maximum and recommended operating conditions and electrical performance characteristics are as specified
12、 in 1.3, and table I herein. 3.4 Design, construction, and physical dimension. The design, construction, and physical dimensions are as specified herein. 1/ Stresses beyond those listed under “absolute maximum ratings” may cause permanent damage to the device. These are stress ratings only, and func
13、tional operation of the device at these or any other conditions beyond those indicated under “recommended operating conditions” is not implied. Exposure to absolute maximum rated conditions for extended periods may affect device reliability. 2/ Per JEDC standard JESD 51-2. Provided by IHSNot for Res
14、aleNo reproduction or networking permitted without license from IHS-,-,-DLA LAND AND MARITIME COLUMBUS, OHIO SIZE A CODE IDENT NO. 16236 DWG NO. V62/12649 REV PAGE 4 3.5 Diagrams. 3.5.1 Case outline. The case outline shall be as shown in 1.2.2 and figure 1. 3.5.2 Terminal connections. The terminal c
15、onnections shall be as shown in figure 2. 3.5.3 Terminal function. The terminal function shall be as shown in figure 3. 3.5.4 Functional block diagram. The functional block diagram shall be as shown in figure 4. 3.5.5 Return Loss of LOIP (LOIN AC-Coupled to Ground) S11 and RFOUT S22 from 450 MHz to
16、6000 MHz. The Return Loss of LOIP (LOIN AC-Coupled to Ground) S11 and RFOUT S22 from 450 MHz to 6000 MHz shall be as shown in figure 5. Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-DLA LAND AND MARITIME COLUMBUS, OHIO SIZE A CODE IDENT NO. 16236 D
17、WG NO. V62/12649 REV PAGE 5 TABLE I. Electrical performance characteristics. 1/ Test Test conditions 2/ Limits Unit Min Typ Max Operating frequency range Low frequency 400 MHz High frequency 6000 LO = 450 MHz Output power, POUTVIQ= 1 V p-p differential 0.85 dBm Modulator voltage gain RF output divid
18、ed by baseband input voltage -3.1 dB Output P1dB 9.6 dBm Output return loss -16.4 dB Carrier feedthrough -47.5 dBm Sideband suppression -37.6 dBc Quadrature error 1.7 Degrees I/Q amplitude balance 0.07 dB Second Harmonic POUT (fLO+ (2 x fBB), POUT= 0.85 dBm -75.9 dBc Third Harmonic POUT (fLO+ (3 x f
19、BB), POUT= 0.85 dBm -51.5 dBc Output IP2 f1BB = 3.5 MHz, f2BB = 4.5 MHz, baseband I/Q amplitude per tone = 0.5 V p-p differential 65.4 dBm Output IP3 26.6 Noise floor I/Q inputs = 0 V differential with a dc bias only, 20 MHz carrier offset -160.5 dBm/Hz LO = 900 MHz Output power, POUTVIQ= 1 V p-p di
20、fferential 0.75 dBm Modulator voltage gain RF output divided by baseband input voltage -3.2 dB Output P1dB 9.6 dBm Output return loss -15.7 dB Carrier feedthrough -45.1 dBm Sideband suppression -52.8 dBc Quadrature error 0.01 Degrees I/Q amplitude balance 0.07 dB Second Harmonic POUT (fLO+ (2 x fBB)
21、, POUT= 0.75 dBm -75.8 dBc Third Harmonic POUT (fLO+ (3 x fBB), POUT= 0.75 dBm -50.7 dBc Output IP2 f1BB = 3.5 MHz, f2BB = 4.5 MHz, baseband I/Q amplitude per tone = 0.5 V p-p differential 62.6 dBm Output IP3 25.9 Noise floor I/Q inputs = 0 V differential with a dc bias only, 20 MHz carrier offset -
22、160.0 dBm/Hz LO = 1900 MHz Output power, POUTVIQ= 1 V p-p differential 0.53 dBm Modulator voltage gain RF output divided by baseband input voltage -3.4 dB Output P1dB 9.9 dBm Output return loss -16.2 dB Carrier feedthrough -40.3 dBm Sideband suppression -50.2 dBc Quadrature error 0.02 Degrees I/Q am
23、plitude balance 0.07 dB Second Harmonic POUT (fLO+ (2 x fBB), POUT= 0.53 dBm -67.9 dBc Third Harmonic POUT (fLO+ (3 x fBB), POUT= 0.53 dBm -51.8 dBc See footnote at end of table. Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-DLA LAND AND MARITIME C
24、OLUMBUS, OHIO SIZE A CODE IDENT NO. 16236 DWG NO. V62/12649 REV PAGE 6 TABLE I. Electrical performance characteristics - Continued. 1/ Test Test conditions 2/ Limits Unit Min Typ Max Output IP2 f1BB = 3.5 MHz, f2BB = 4.5 MHz, baseband I/Q amplitude per tone = 0.5 V p-p differential 62.6 dBm Output I
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