CISPR 17-2011 Methods of measurement of the suppression characteristics of passive EMC filtering devices《无源EMC滤波装置抑制特性的测量方法》.pdf

《CISPR 17-2011 Methods of measurement of the suppression characteristics of passive EMC filtering devices《无源EMC滤波装置抑制特性的测量方法》.pdf》由会员分享，可在线阅读，更多相关《CISPR 17-2011 Methods of measurement of the suppression characteristics of passive EMC filtering devices《无源EMC滤波装置抑制特性的测量方法》.pdf（136页珍藏版）》请在麦多课文档分享上搜索。

1、 CISPR 17 Edition 2.0 2011-06 INTERNATIONAL STANDARD NORME INTERNATIONALE Methods of measurement of the suppression characteristics of passive EMC filtering devices Mthodes de mesure des caractristiques dantiparasitage des dispositifs de filtrage CEM passifs CISPR 17:2011INTERNATIONAL SPECIAL COMMIT

2、TEE ON RADIO INTERFERENCE COMIT INTERNATIONAL SPCIAL DES PERTURBATIONS RADIOLECTRIQUES colourinsideTHIS PUBLICATION IS COPYRIGHT PROTECTED Copyright 2011 IEC, Geneva, Switzerland All rights reserved. Unless otherwise specified, no part of this publication may be reproduced or utilized in any form or

3、 by any means, electronic or mechanical, including photocopying and microfilm, without permission in writing from either IEC or IECs member National Committee in the country of the requester. If you have any questions about IEC copyright or have an enquiry about obtaining additional rights to this p

4、ublication, please contact the address below or your local IEC member National Committee for further information. Droits de reproduction rservs. Sauf indication contraire, aucune partie de cette publication ne peut tre reproduite ni utilise sous quelque forme que ce soit et par aucun procd, lectroni

5、que ou mcanique, y compris la photocopie et les microfilms, sans laccord crit de la CEI ou du Comit national de la CEI du pays du demandeur. Si vous avez des questions sur le copyright de la CEI ou si vous dsirez obtenir des droits supplmentaires sur cette publication, utilisez les coordonnes ci-apr

6、s ou contactez le Comit national de la CEI de votre pays de rsidence. IEC Central Office 3, rue de Varemb CH-1211 Geneva 20 Switzerland Email: inmailiec.ch Web: www.iec.ch About the IEC The International Electrotechnical Commission (IEC) is the leading global organization that prepares and publishes

7、 International Standards for all electrical, electronic and related technologies. About IEC publications The technical content of IEC publications is kept under constant review by the IEC. Please make sure that you have the latest edition, a corrigenda or an amendment might have been published. Cata

8、logue of IEC publications: www.iec.ch/searchpub The IEC on-line Catalogue enables you to search by a variety of criteria (reference number, text, technical committee,). It also gives information on projects, withdrawn and replaced publications. IEC Just Published: www.iec.ch/online_news/justpub Stay

9、 up to date on all new IEC publications. Just Published details twice a month all new publications released. Available on-line and also by email. Electropedia: www.electropedia.org The worlds leading online dictionary of electronic and electrical terms containing more than 20 000 terms and definitio

10、ns in English and French, with equivalent terms in additional languages. Also known as the International Electrotechnical Vocabulary online. Customer Service Centre: www.iec.ch/webstore/custserv If you wish to give us your feedback on this publication or need further assistance, please visit the Cus

11、tomer Service Centre FAQ or contact us: Email: csciec.ch Tel.: +41 22 919 02 11 Fax: +41 22 919 03 00 A propos de la CEI La Commission Electrotechnique Internationale (CEI) est la premire organisation mondiale qui labore et publie des normes internationales pour tout ce qui a trait llectricit, llect

12、ronique et aux technologies apparentes. A propos des publications CEI Le contenu technique des publications de la CEI est constamment revu. Veuillez vous assurer que vous possdez ldition la plus rcente, un corrigendum ou amendement peut avoir t publi. Catalogue des publications de la CEI: www.iec.ch

13、/searchpub/cur_fut-f.htm Le Catalogue en-ligne de la CEI vous permet deffectuer des recherches en utilisant diffrents critres (numro de rfrence, texte, comit dtudes,). Il donne aussi des informations sur les projets et les publications retires ou remplaces. Just Published CEI: www.iec.ch/online_news

14、/justpub Restez inform sur les nouvelles publications de la CEI. Just Published dtaille deux fois par mois les nouvelles publications parues. Disponible en-ligne et aussi par email. Electropedia: www.electropedia.org Le premier dictionnaire en ligne au monde de termes lectroniques et lectriques. Il

15、contient plus de 20 000 termes et dfinitions en anglais et en franais, ainsi que les termes quivalents dans les langues additionnelles. Egalement appel Vocabulaire Electrotechnique International en ligne. Service Clients: www.iec.ch/webstore/custserv/custserv_entry-f.htm Si vous dsirez nous donner d

16、es commentaires sur cette publication ou si vous avez des questions, visitez le FAQ du Service clients ou contactez-nous: Email: csciec.ch Tl.: +41 22 919 02 11 Fax: +41 22 919 03 00 CISPR 17 Edition 2.0 2011-06 INTERNATIONAL STANDARD NORME INTERNATIONALE Methods of measurement of the suppression ch

17、aracteristics of passive EMC filtering devices Mthodes de mesure des caractristiques dantiparasitage des dispositifs de filtrage CEM passifs INTERNATIONAL ELECTROTECHNICAL COMMISSION COMMISSION ELECTROTECHNIQUE INTERNATIONALE XB ICS 33.100.01 PRICE CODE CODE PRIX ISBN 978-2-88912-526-5 INTERNATIONAL

18、 SPECIAL COMMITTEE ON RADIO INTERFERENCE COMIT INTERNATIONAL SPCIAL DES PERTURBATIONS RADIOLECTRIQUES Registered trademark of the International Electrotechnical Commission Marque dpose de la Commission Electrotechnique Internationale colourinside 2 CISPR 17 IEC:2011 CONTENTS FOREWORD . 6 INTRODUCTIO

19、N . 8 1 Scope . 9 2 Normative references . 9 3 Terms, definitions and abbreviations 9 3.1 Terms and definitions 9 3.2 Abbreviations 12 4 Classification of EMC filtering devices 12 4.1 Insertion loss . 14 4.1.1 Insertion loss calculation . 14 4.1.2 Asymmetrical (common) mode . 14 4.1.3 Symmetrical (d

20、ifferential) mode . 14 4.1.4 Unsymmetrical mode . 14 4.2 Impedance 14 4.3 S-parameters . 15 4.3.1 General . 15 4.3.2 Two-port S-parameters 15 4.3.3 Four-port S-parameters 16 5 Insertion loss measurement 17 5.1 General . 17 5.2 Measurement set-up 18 5.2.1 General . 18 5.2.2 Test equipment 18 5.2.3 As

21、ymmetrical (common mode) test circuit 19 5.2.4 Symmetrical (differential mode) test circuit 19 5.2.5 Unsymmetrical test circuit 20 5.3 Measurement methods (procedure) . 21 5.3.1 General . 21 5.3.2 Measurement without bias . 22 5.3.3 Measurement with bias 22 5.4 Calibration and verification 23 5.4.1

22、General . 23 5.4.2 Validation of test set-up without bias . 23 5.4.3 Validation of test set-up with bias 24 5.5 Uncertainty 26 6 Impedance measurement . 26 6.1 General . 26 6.2 Direct method 26 6.2.1 Measurement set-up and procedure 26 6.2.2 Calibrations of the test set-up 27 6.2.3 Measurement uncer

23、tainty 27 6.3 Indirect method . 27 6.3.1 Measurement set-up and procedure 27 6.3.2 Calibration of the test set-up 29 6.3.3 Measurement uncertainty 29 7 S-parameter measurement 30 CISPR 17 IEC:2011 3 7.1 Measurement set-up and procedure 30 7.1.1 General . 30 7.1.2 Test fixture 31 7.2 Calibration of t

24、est set-up . 36 7.3 Measurement uncertainties . 36 8 Presentation of results 36 8.1 General . 36 8.2 Insertion loss . 37 8.3 Impedance 37 8.4 S-parameters . 37 Annex A (normative) Uncertainty estimation for the measurement of the suppression characteristics of EMC filtering devices 38 Annex B (infor

25、mative) Examples of test boxes for insertion loss measurement . 43 Annex C (informative) Insertion loss test methods with non-50 systems . 47 Annex D (informative) Realization of the buffer-network for insertion loss measurement . 49 Annex E (informative) Insertion loss measurement General discussio

26、n . 51 Annex F (informative) Set-up for impedance measurement 54 Annex G (informative) S-parameter measurement of common-mode choke coils 59 Annex H (informative) Measurement set-up for S-parameters of a DUT without wire leads 64 Bibliography 66 Figure 1 Measurement arrangement for S-parameters of a

27、 two-terminal device 15 Figure 2 Measurement arrangement for S-parameters of a three-terminal device . 15 Figure 3 Measurement arrangement for four-port S-parameters 16 Figure 4 Test circuit for insertion loss measurement (example: 4-line-filter) . 18 Figure 5 Test circuit for asymmetrical insertion

28、 loss measurement (example: 4-line-filter) . 19 Figure 6 Test circuit for symmetrical insertion loss measurement (example: 4-line-filter) . 20 Figure 7 Test circuit for unsymmetrical insertion loss measurement (example: 4-line filter) . 21 Figure 8 Test circuit for insertion loss measurement without

29、 bias . 22 Figure 9 Test circuit for insertion loss measurement with bias 22 Figure 10 Test circuit for verification of measurement circuit without bias 23 Figure 11 Test circuit for verification of measurement circuit with bias . 25 Figure 12 One-port measurement of a two-terminal device 28 Figure

30、13 S-parameter measurements for evaluating the impedance of a device in a series connection 28 Figure 14 S-parameter measurements for evaluating the impedance of a device in a shunt connection. 28 Figure 15 Two-port S-parameter measurement set-up 30 Figure 16 An alternative measurement system specif

31、ically for the insertion loss of a DUT (using a combination of tracking generator and measuring receiver) 31 Figure 17 Symbolic expressions . 32 Figure 18 Test fixture for a two-terminal device (series connection) . 32 4 CISPR 17 IEC:2011 Figure 19 Test fixture for a two-terminal device (shunt conne

32、ction) 33 Figure 20 Test fixture for a three-terminal filter 33 Figure 21 Test fixture for a two-terminal device with leads . 34 Figure 22 Test fixture for a three-terminal filter with leads 35 Figure 23 Test fixture for a core device 35 Figure 24 Example of the standards for TRL calibration . 36 Fi

33、gure B.1 Design of typical test box for general-purpose filters . 43 Figure B.2 3D view of typical test box for general purpose filters . 44 Figure B.3 Design of typical test box for feedthrough components . 45 Figure B.4 3D view of typical test box for feedthrough components 45 Figure C.1 Test circ

34、uit 47 Figure D.1 Example of connecting buffer-networks for test with bias 49 Figure E.1 Test circuit for insertion loss measurement, reference measurement (filter replaced by a short circuit) . 51 Figure E.2 Test circuit for insertion loss measurement, measurement of filter under test . 52 Figure F

35、.1 Measurement set-up for a leaded device (DUT) 54 Figure F.2 Four-terminal test fixture for a leaded device (DUT) 55 Figure F.3 Measurement set-up for an SMD . 55 Figure F.4 Clamp-type test fixture 56 Figure F.5 Coaxial test fixture for an SMD . 56 Figure F.6 Press-type test fixture for an SMD. 57

36、Figure F.7 Connection for CMCC measurement . 57 Figure F.8 Test fixture and measurement set-up for an SMD common-mode choke coil 58 Figure G.1 Common-mode choke coil 59 Figure G.2 Set-up for measurements of common-mode characteristics 59 Figure G.3 Test fixture for an SMD. 60 Figure G.4 Test fixture

37、 for a leaded device 60 Figure G.5 Set-up for measurements of differential-mode characteristics . 61 Figure G.6 Test fixture for an SMD. 61 Figure G.7 Test fixture for a leaded device . 61 Figure G.8 Set-up for measurement of four-port S-parameters . 62 Figure G.9 Test fixture for the four-port S-pa

38、rameters of an SMD . 62 Figure G.10 Test fixture for the four-port S-parameters of a leaded device . 63 Figure H.1 S-parameters measurement of a DUT without leads 64 Figure H.2 Procedure for TRL calibration . 65 Table 1 Examples of EMC filtering devices 13 Table 2 Conditions and target values for va

39、lidation of test set-up without bias . 24 Table 3 Conditions and target values for validation of test set-up with bias 25 Table A.1 Measurement uncertainty of insertion loss (example) . 40 Table A.2 Measurement uncertainty of impedance (example) . 41 Table A.3 Measurement uncertainties of |S21| and

40、|S12| (example) 41 Table A.4 Measurement uncertainties of |S11| and |S22| (example) 41 CISPR 17 IEC:2011 5 Table D.1 Specifications of the elements of buffer-networks 50 6 CISPR 17 IEC:2011 INTERNATIONAL ELECTROTECHNICAL COMMISSION _ METHODS OF MEASUREMENT OF THE SUPPRESSION CHARACTERISTICS OF PASSI

41、VE EMC FILTERING DEVICES FOREWORD 1) The International Electrotechnical Commission (IEC) is a worldwide organization for standardization comprising all national electrotechnical committees (IEC National Committees). The object of IEC is to promote international co-operation on all questions concerni

42、ng standardization in the electrical and electronic fields. To this end and in addition to other activities, IEC publishes International Standards, Technical Specifications, Technical Reports, Publicly Available Specifications (PAS) and Guides (hereafter referred to as “IEC Publication(s)”). Their p

43、reparation is entrusted to technical committees; any IEC National Committee interested in the subject dealt with may participate in this preparatory work. International, governmental and non-governmental organizations liaising with the IEC also participate in this preparation. IEC collaborates close

44、ly with the International Organization for Standardization (ISO) in accordance with conditions determined by agreement between the two organizations. 2) The formal decisions or agreements of IEC on technical matters express, as nearly as possible, an international consensus of opinion on the relevan

45、t subjects since each technical committee has representation from all interested IEC National Committees. 3) IEC Publications have the form of recommendations for international use and are accepted by IEC National Committees in that sense. While all reasonable efforts are made to ensure that the tec

46、hnical content of IEC Publications is accurate, IEC cannot be held responsible for the way in which they are used or for any misinterpretation by any end user. 4) In order to promote international uniformity, IEC National Committees undertake to apply IEC Publications transparently to the maximum ex

47、tent possible in their national and regional publications. Any divergence between any IEC Publication and the corresponding national or regional publication shall be clearly indicated in the latter. 5) IEC itself does not provide any attestation of conformity. Independent certification bodies provid

48、e conformity assessment services and, in some areas, access to IEC marks of conformity. IEC is not responsible for any services carried out by independent certification bodies. 6) All users should ensure that they have the latest edition of this publication. 7) No liability shall attach to IEC or it

49、s directors, employees, servants or agents including individual experts and members of its technical committees and IEC National Committees for any personal injury, property damage or other damage of any nature whatsoever, whether direct or indirect, or for costs (including legal fees) and expenses arising out of the publication, u