ASTM F1512-1994(2003) Standard Practice for Ultrasonic C-Scan Bond Evaluation of Sputtering Target-Backing Plate Assemblies《溅射目标垫板部件的超声波C扫描粘结评定标准规程》.pdf

《ASTM F1512-1994(2003) Standard Practice for Ultrasonic C-Scan Bond Evaluation of Sputtering Target-Backing Plate Assemblies《溅射目标垫板部件的超声波C扫描粘结评定标准规程》.pdf》由会员分享，可在线阅读，更多相关《ASTM F1512-1994(2003) Standard Practice for Ultrasonic C-Scan Bond Evaluation of Sputtering Target-Backing Plate Assemblies《溅射目标垫板部件的超声波C扫描粘结评定标准规程》.pdf（4页珍藏版）》请在麦多课文档分享上搜索。

1、Designation: F 1512 94 (Reapproved 2003)Standard Practice forUltrasonic C-Scan Bond Evaluation of SputteringTarget-Backing Plate Assemblies1This standard is issued under the fixed designation F 1512; the number immediately following the designation indicates the year oforiginal adoption or, in the c

2、ase of revision, the year of last revision. A number in parentheses indicates the year of last reapproval. Asuperscript epsilon (e) indicates an editorial change since the last revision or reapproval.1. Scope1.1 This practice describes a method for ultrasonic mappingof the soundness of a bond joinin

3、g a sputtering target to itssupporting backing plate. The results of the examination maybe used in predicting the target-backing plate assemblyssuitability for use. Accept/reject standards are not specified;these are subject to agreement between target supplier and user,depending upon the applicatio

4、n requirements.1.2 This standard is intended to be used with PracticeE 1001.1.3 The method reveals unbonded areas 0.125 in. (3 mm) indiameter and larger. The technique permits, for example,unambiguous quantitative measurement of the voided area insolder bonds.1.3.1 This technique may also show regio

5、ns in which bondintegrity is marginally degraded by imperfect adhesion, forexample, areas in which oxide inclusion has inhibited thedevelopment of full bond strength. Evaluation of indications ofdegraded bond areas may vary in rigor from purely subjectiveto semiquantitative. Target supplier and user

6、 must agree uponthe means used to display and grade partially bonded areas.1.4 This practice is applicable to assemblies having planarbonds in which the design provides at least one flat planeparallel to the bond that may be used as the entry/exit surfacefor ultrasonic excitation.1.5 Only the immers

7、ion pulse-echo method is covered.1.6 Evaluation by this method is intended to be nondestruc-tive. For target assemblies that would be degraded by immer-sion in demineralized water, for example, for porous targetmaterials, the test should be considered a destructive one.1.7 This practice is applicabl

8、e to bonding methods that usea filler material to join the target and backing plate. Theseinclude solder, epoxy, and braze bonds.1.8 The values stated in inch-pound units are to be regardedas the standard. The values given in parentheses are forinformation only.1.9 This standard does not purport to

9、address all of thesafety concerns, if any, associated with its use. It is theresponsibility of the user of this standard to establish appro-priate safety and health practices and determine the applica-bility of regulatory limitations prior to use.2. Referenced Documents2.1 ASTM Standards:2E 127 Prac

10、tice for Fabricating and Checking AluminumAlloy Ultrasonic Standard Reference BlocksE 428 Practice for Fabrication and Control of Steel Refer-ence Blocks Used in Ultrasonic InspectionE 1001 Practice for Detection and Evaluation of Disconti-nuities by the Immersed Pulse-Echo Ultrasonic MethodUsing Lo

11、ngitudinal WavesE 1316 Terminology for Nondestructive Examinations2.2 American Society for Nondestructive Testing Standard:ASNT Recommended Practice SNT-TC-1A for PersonnelQualification and Certification in Nondestructive Testing33. Terminology3.1 Definitions:3.1.1 For definitions of terms used in t

12、his practice seePractice E 1001 and Terminology E 1316.4. Summary of Practice4.1 This practice describes a preferred means of applyingPractice E 1001 to obtain a two dimensional map of the flawsin a sputtering target-backing plate bond. The target-backingplate assembly is immersed in demineralized w

13、ater, used as acouplant, and the target-backing plate joint is scanned ultra-sonically.1This practice is under the jurisdiction of ASTM Committee F01 on Electronicsand is the direct responsibility of Subcommittee F01.17 on Sputter Metallization.Current edition approved April 15, 1994. Published June

14、 1994.2For referenced ASTM standards, visit the ASTM website, www.astm.org, orcontact ASTM Customer Service at serviceastm.org. For Annual Book of ASTMStandards volume information, refer to the standards Document Summary page onthe ASTM website.3Available from the American Society for Nondestructive

15、 Testing, 1711 Arlin-gate Plaza, P.O. Box 28518, Columbus, OH 43228-0518.1Copyright ASTM International, 100 Barr Harbor Drive, PO Box C700, West Conshohocken, PA 19428-2959, United States.5. Significance and Use5.1 This practice supplements Practice E 1001 by indicatingspecific equipment choices and

16、 test arrangements appropriatefor evaluating sputtering target bonds.5.2 The bond between sputtering target and its supportingbacking plate is a critical reliability element in a sputterdeposition system. A bond must have high thermal conductiv-ity to provide adequate target cooling during sputterin

17、g. Thetarget-backing plate joint must also have strength enough towithstand the shear stresses caused by differential thermalexpansion between target and backing plate.5.3 Flaws in a bond, for example, voids in the joiningmaterial, degrade bond performance. An inadequate bond mayfail in service, pot

18、entially causing catastrophic separation ofthe target from the backing plate. Assurance of sound bonds isan important concern among users of sputtering equipment.5.4 Ultrasonic testing is accepted as an efficient method forevaluating target bonds, but differences in technique inhibitintercomparison

19、of results from one laboratory to another. Thispractice is intended to promote uniformity in use so thatspecifications for bond integrity may be universally applied.5.5 The C-span display of ultrasonic test data is a directmethod for visually demonstrating bond character. PracticeE 1001 upon which t

20、his practice is modeled, however, does notaddress C-scan display. Instructions specific to the C-scandisplay mode are indicated in this practice. In other respectsthis practice is a section by section commentary on PracticeE 1001.6. Apparatus6.1 Electronic EquipmentProvide electronic equipment ingen

21、eral conformance with the requirements of Practice E 1001,6.1. It is recommended that 5 or 10 Mhz frequency be used fortesting sputtering target bonds. The equipment and its cathode-ray tube (CRT) display, operating in the A-scan mode, shouldbe capable of producing echo amplitudes of at least 60 % o

22、ffull scale, with the noise level no greater than 20 % of fullscale, using an 0.125-in. (3-mm) diameter flat-bottom test holein a reference block (6.7) simulating the assembly under test.Note that for C-scan mapping of target bonds the A-scan modeis used for assisting in the setup only. A-scan data

23、are notcollected or reported.6.1.1 C-scan Plotter/Data Acquisition SystemThe C-scanpresentation is a mapping of the reflected ultrasound pulseintensity (peak voltage) from the target/backing plate interfaceas a function of position. Modulations of the reflected inten-sity“ indications” are indicativ

24、e of variations in the metallur-gical bond between target and backing plate. The electronicsystem may be equipped with a plotter to make C-scan mapson-line as the search unit traces a raster pattern over the testarticles surface.6.1.1.1 Suitable plotters may use an electric discharge penand conducti

25、ve paper; a mechanical or electrical linkage causesthe pen to traverse the paper in synchronism with the searchunits raster of the test article. The density of the pen trace ismade proportional to the reflected ultrasonic pulse from thetarget/backing plate interface. Alternatively, a computer-basedd

26、ata acquisition system may be used in which the gatedreflected signal is sampled at a rate sufficient to characterize thearea-modulated ultrasonic reflectance of the bond interface.These data may be plotted off-line to provide an equivalentC-scan map.6.1.1.2 It is intended that the C-scan plotter be

27、 set to makea full-sized map of the bonded area. If a scaling factor otherthan 1:1 is used the enlargement/reduction factor may bedetermined from the reference block scan (see 8.2.3.1, 8.3.3,and 9.1.1).6.1.2 PlotterThe plotter system must be capable of re-solving the reference block calibration indi

28、cations (6.7) withcontrast sufficient to permit unambiguous identification by theunaided eye under ordinary room lighting conditions.6.1.3 Data Acquisition SystemThe data system must becapable of displaying a C-scan mode plot of the referenceblock calibration indications (6.7) with contrast and reso

29、lutionsufficient to permit unambiguous identification by unaided eyeunder ordinary room lighting conditions. A sampling rate of atleast 50/in. (2/ mm) of search unit travel is recommended.Display of the ultrasonic maps features in contrasting colorsmay be used to enhance visibility.6.2 Voltage Regul

30、atorProvide if necessary, in accordancewith Practice E 1001 (6.2).6.3 Search UnitsUse round, immersion type, single ele-ment, straight-beam (longitudinal), focused search units. Thefocal length must be sufficiently long that the beam minimumarea may be focused at the target-backing plate interface.S

31、earch units 0.375 to 0.500 in. (9.5 to 12.5 mm) in diameter,tuned at 5 or 10 Mhz operating frequency, with focal length (inwater) of 2 to 4 in. (50 to 100 mm) have proved satisfactory formost applications.6.4 AlarmNot applicable for this determination.6.4.1 Gate SynchronizationSet the electronic gat

32、e syn-chronization to lock onto the top surface echo pulse from thetest article (not the primary excitation pulse) as reference. Setthe gate delay and width to capture the echo pulse from thetarget/backing plate interface.6.5 Manipulating Equipment, should conform to PracticeE 1001 (6.5).6.6 TankPro

33、vide tank in accordance with Practice E 1001(6.6).6.7 Reference BlocksUltrasonic reference blocks, oftencalled test blocks, are used to standardize the ultrasonicequipment and to evaluate indications received from disconti-nuities in the test part.6.7.1 It is mandatory that test blocks specifically

34、made forsputtering target testing be provided for this procedure. Blocksshould be designed, manufactured, and tested in conformancewith Practices E 127 and E 428.6.7.2 Test blocks must be 1.5 in. (38 mm) square ordiameter, or larger. In order to duplicate the target-backingplate assembly, test block

35、s must be made of the same materials,that is, having the same acoustic properties as the article underthe test, of the same thicknesses, and joined in the same manneras the target assembly to be evaluated.6.7.2.1 It is critical for test block credibility that the bondingof target and backing plate m

36、aterials be sound in areas notpurposefully altered to provide calibration indications (6.7.4,F 1512 94 (2003)26.7.5). New test blocks should be surveyed using the method ofSection 8 after laminating. Imperfect bonds should be re-worked or the test blocks discarded.6.7.3 The top surface finish of the

37、 test blocks must be thesame as the article under test.6.7.4 Three precision flat bottomed holes, arranged in apattern as illustrated in Fig. 1 must be drilled from the backside of the test block. The diameters of the holes are 0.125,0.250 and 0.500 in. (3, 6, and 13 mm). The holes shall be deepenou

38、gh to penetrate the bond interface, 60.005 in. (60.13mm). After drilling, the holes must be cleaned, tested, andsealed as described in Practices E 127 and E 428.6.7.5 Additional purposeful discontinuities may be providedto simulate areas in which the metallurgical bond is degradedby oxide inclusions

39、 or residual contamination on the bondedsurfaces. Whether such artifacts will be provided, and theirnature, should be agreed upon in advance by the parties to theevaluation. The validity of purposefully degraded areas inreference blocks for simulating actual bond flaws must beverified, for example,

40、by tensile tests, metallographic exami-nation of bond interface sections, or by other means.7. General Examination Requirements7.1 Material ConditionPerform the ultrasonic bond teston finished target-backing plate assemblies. Baking the assem-bly to dry it after immersion, and final cleanup and pack

41、aging,are usual steps required to prepare the test article for deliveryto a user.7.2 CoverageThe bonded area should be scanned.7.3 Ultrasonic FrequencyUse 10 Mhz for most applica-tions.8. Procedure8.1 Examination (Scanning) System Setup:8.1.1 TankImmerse the part to be inspected, referenceblocks, an

42、d search unit in tank filled with demineralized water.Make sure that the couplant water is clean and deaerated toeliminate attenuation of the sound beam, to improve the signalto noise ratio, and to minimize contamination of the sputteringtarget. Do not add corrosion inhibitors or wetting agents.Remo

43、ve air bubbles that collect on the test article, referenceblocks, and search unit.8.1.1.1 Generally the test article will be mounted in the tanktarget side up. In this orientation the target face is the entryplane for ultrasonic pulses. In special cases better results maybe obtained by mounting targ

44、et side down. The reference blockconstruction must duplicate the target assembly orientation.8.1.2 Reference Block SelectionUse reference blocks du-plicating the target-backing plate construction. All inspectionsare conducted in the far field portion of the sound beam.8.1.3 Search Unit AdjustmentFol

45、low the instructions ofPractice E 1001 (8.1.3) to adjust the search unit so thatmaximum echo amplitude is received from the sound-entrysurface. Adjust the distance from the search unit to test articlesurface so that the target-backing plate interface is at the beamfocus. This is accomplished by maxi

46、mizing the pulse echosignal from the bond interface.8.1.4 Water PathFollow the instructions of PracticeE 1001 (8.1.4). For most applications it is sufficient that thewater path be uniform across the surface of the test article to60.05 in. (61.3 mm).8.2 Initial Scanning Standardization:8.2.1 Scan Ind

47、exUse a scan index of 0.020 in. (0.5 mm).8.2.2 Distance-Amplitude RelationshipNot applicable tothis determination.8.2.3 Scanning Gain DeterminationPlace the referenceblock next to the test article, and at the same height. Set theCRT display in the A-scan mode and adjust gain and gatesettings to capt

48、ure the echo signal from reference blocksreflector holes.8.2.3.1 C-Scan Plotter SystemScan the reference block,readjusting the gain settings as necessary to provide a clearlyresolved image of the three reflector holes (6.7). Ideally, theholes will be saturated black against a slightly grey back-grou

49、nd. Make further refinements of the gain and gate settingsas necessary to provide adequate visual contrast for additionalindications, if incorporated into the reference blocks (6.7.5).8.2.3.2 Digital Data Acquisition SystemActivate the dataacquisition system. Scan the reference block to compile a datafile. Print a C-scan map. Adjust controls as necessary toprovide a clearly resolved image of all reference block indica-tions (6.7).8.2.4 Alarm SettingNot applicable for this determination.8.3 Initial Scanning Procedure:8.3.1 Scanning SpeedSet scan speed at the