ASTM D5109-1999(2004) Standard Test Methods for Copper-Clad Thermosetting Laminates for Printed Wiring Boards《印刷线路板用铜覆层热固层压材料的标准试验方法》.pdf

《ASTM D5109-1999(2004) Standard Test Methods for Copper-Clad Thermosetting Laminates for Printed Wiring Boards《印刷线路板用铜覆层热固层压材料的标准试验方法》.pdf》由会员分享，可在线阅读，更多相关《ASTM D5109-1999(2004) Standard Test Methods for Copper-Clad Thermosetting Laminates for Printed Wiring Boards《印刷线路板用铜覆层热固层压材料的标准试验方法》.pdf（8页珍藏版）》请在麦多课文档分享上搜索。

1、Designation: D 5109 99 (Reapproved 2004)An American National StandardStandard Test Methods forCopper-Clad Thermosetting Laminates for Printed WiringBoards1This standard is issued under the fixed designation D 5109; the number immediately following the designation indicates the year oforiginal adopti

2、on or, in the case of revision, the year of last revision. A number in parentheses indicates the year of last reapproval. Asuperscript epsilon (e) indicates an editorial change since the last revision or reapproval.1. Scope1.1 These test methods cover the procedures for testingcopper-clad laminates

3、produced from fiber-reinforced, thermo-setting polymeric materials intended for fabrication of printedwiring boards.1.2 This standard does not purport to address all of thesafety concerns, if any, associated with its use. It is theresponsibility of the user of this standard to establish appro-priate

4、 safety and health practices and determine the applica-bility of regulatory limitations prior to use. For specific hazardstatements, see 7.2.1, 8.1, and 11.3.1.1.3 Metric units are the preferred units for these testmethods. Inch-pound units, where shown, are presented forinformation only.1.4 The pro

5、cedures appear in the following sections:Procedure SectionReferenced Documents 2Conditioning 4Dielectric Breakdown Voltage Parallel to Laminations 13Dimensional Instability 19Dissipation Factor 14Flammability Rating Test 16Flexural Strength, Flatwise at Elevated Temperature 15Flexural Strength, Flat

6、wise at Room Temperature 15Oven Blister Test 17Peel Strength Test at Elevated Temperature 10Peel Strength Test at Room Temperature 9Permittivity 14Pin Holes in Copper Surface 20Purity of Copper 5Scratches in Copper Surface 21Solder Float Test 8Solvent Resistance 7Surface Resistivity 11Volume Resisti

7、vity 11Terminology 3Thickness a positive value is growth.100 after etch LW! 2 OLW!# 4 OLW!# (2)19.5.2 Compute the arithmetic average from the three setsof “after etch” measurements. This average is the test measure-ment for dimensional instability due to etch on one specimen.Repeat the calculation f

8、or each specimen. The average of thethree test measurements is the test result for dimensionalchange due to etch for the lengthwise direction.19.5.3 For the crosswise direction dimensional instabilityafter etch, repeat the calculations of 19.5.1 and 19.5.2 usingappropriate crosswise direction dimens

9、ions.19.5.4 For the after etch and bake dimensional instabilityvalues repeat the calculations of 19.5.1 and 19.5.2 using thedimensional data obtained after etch and bake on each speci-men and in each of the two directions.19.6 ReportReport the following information:19.6.1 Complete identification of

10、the laminate,19.6.2 The lengthwise dimensional instability after etch, %,19.6.3 The lengthwise dimensional instability after etch andbake, %,19.6.4 The crosswise dimensional instability after etch, %,19.6.5 The crosswise dimensional instability after etch andbake, %, and19.6.6 Any deviations from th

11、e procedures set forth in thesetest methods.19.7 Precision and Bias:19.7.1 This test has been in use for many years, but noinformation has been presented to ASTM upon which to basea statement of precision. No activity has been planned todevelop such information.19.7.2 This test method has no bias be

12、cause the value fordimensional instability is determined solely in terms of this testmethod itself.20. Keywords20.1 copper-clad laminate; dielectric breakdown parallel tolaminations; dimensional instability; dissipation factor; fiberreinforced; flexural strength; industrial laminate; laminate;oven b

13、lister; peel strength; permittivity; printed circuit boards;printed wiring boards; rigid laminate; solder float; surfaceresistivity; thermoset; thickness variation; trace; twist; volumeresistivity; warp; water absorptionASTM International takes no position respecting the validity of any patent right

14、s asserted in connection with any item mentionedin this standard. Users of this standard are expressly advised that determination of the validity of any such patent rights, and the riskof infringement of such rights, are entirely their own responsibility.This standard is subject to revision at any t

15、ime by the responsible technical committee and must be reviewed every five years andif not revised, either reapproved or withdrawn. Your comments are invited either for revision of this standard or for additional standardsand should be addressed to ASTM International Headquarters. Your comments will

16、 receive careful consideration at a meeting of theresponsible technical committee, which you may attend. If you feel that your comments have not received a fair hearing you shouldmake your views known to the ASTM Committee on Standards, at the address shown below.This standard is copyrighted by ASTM

17、 International, 100 Barr Harbor Drive, PO Box C700, West Conshohocken, PA 19428-2959,United States. Individual reprints (single or multiple copies) of this standard may be obtained by contacting ASTM at the aboveaddress or at 610-832-9585 (phone), 610-832-9555 (fax), or serviceastm.org (e-mail); or through the ASTM website(www.astm.org).FIG. 2 Target MarksD 5109 99 (2004)8