REG NASA-LLIS-0402-1996 Lessons Learned - Solderability Problem with Solder Plated Terminals (~ 1990).pdf
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1、Lessons Learned Entry: 0402Lesson Info:a71 Lesson Number: 0402a71 Lesson Date: 1996-04-19a71 Submitting Organization: JPLa71 Submitted by: J.W. BottSubject: Solderability Problem with Solder Plated Terminals ( 1990) Abstract: Multi-year storage and aging of solder plated terminals for TOPEX and ASTR
2、OS circuit boards affected their solderability. Consider aging and solderability factors, and perform solderability tests, before installing solder plated terminals.Description of Driving Event: TOPEX Microwave Radiometer (TMR)Solder plated terminals supplied to a contractor for installation in TMR
3、multilayer boards failed solderability tests, prior to installation. These terminals were found to have exceeded their useful shelf life, (typically 2 years), and were replaced with new ones. Removal and replacement of these terminals after installation would have meant severe penalties in terms of
4、added costs, schedule slippage and/or potentially destructive rework.ASTROS InstrumentWhen previously built printed wiring board assemblies were removed from long term storage (more than 5 years) for use in new construction, surface deterioration on solder plated terminals necessitated the use of ac
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