NAVY A-A-59877-2010 INSULATING COMPOUND ELECTRICAL EMBEDDING《嵌入式电绝缘材料》.pdf
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1、Beneficial comments, recommendations, additions, deletions, clarifications, etc. and any data that may improve this document should be sent to: Commander, Naval Sea Systems Command, ATTN: SEA 05S, 1333 Isaac Hull Avenue, SE, Stop 5160, Washington Navy Yard DC 20376-5160 or emailed to CommandStandard
2、snavy.mil, with the subject line “Document Comment”. Since contact information can change, you may want to verify the currency of this address information using the ASSIST Online database at https:/assist.daps.dla.mil. FSC 5970 METRIC A-A-59877 9 September 2010 COMMERCIAL ITEM DESCRIPTION INSULATING
3、 COMPOUND, ELECTRICAL, EMBEDDING The General Services Administration has authorized the use of this commercial item description, for all federal agencies. 1. SCOPE. This commercial item description covers a general purpose casting and potting compound which has excellent electrical and hydrolytic st
4、ability characteristics. The purpose of the compound is to preserve the electrical properties of the equipment to which it is applied by sealing against such environmental conditions as moisture, dirt, fumes, fungus, or other deleterious substances which may be encountered in Military service. 2. CL
5、ASSIFICATION. Electrical embedding insulating compounds shall be classified as types in accordance with 2.1. 2.1 Type (see 7.2). Type 1 Single component compound. Type 2 Multi-component compound. 3. SALIENT CHARACTERISTICS. 3.1 Commercial standard. The electrical insulating compound shall be based o
6、n a bisphenol-A epoxy-based polymer with curing agent as specified herein. 3.2 Characteristics. 3.2.1 Cure. When mixed according to the manufacturers instructions, the compound shall cure at a temperature less than 130 degrees Celsius (C) 266 degrees Fahrenheit (F) and meet the properties specified
7、herein. 3.2.2 Fillers and additives. Fillers and additives may be added to the compound but shall be uniformly dispersed throughout the compound. Fillers shall not agglomerate or irreversibly settle during storage. Fillers shall not settle during application or cure. Phase separation shall not occur
8、 with any component of the compound during working life or cure. 3.2.3 Toxicity. The components, individually or mixed, and the cured product shall not have any adverse effect on the health of personnel when used for its intended use. 3.3 Properties of individual components. 3.3.1 Color. Color addit
9、ives may be used. 3.3.2 Volatile content. The components shall be free of non-reactive, volatile solvents. The total volatile matter measured in each component shall be less than 1 percent by weight. 3.4 Properties of the mixed, uncured compound. 3.4.1 Pot life. The pot life at 23 C (73.4 F) shall b
10、e between 30 and 45 minutes. 3.4.2 Viscosity. The viscosity shall be a maximum of 25,000 Centipoises (cps) (16.8 lbm/ft sec). Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-A-A-59877 3.5 Properties of the cured product. When cured as specified, the
11、properties of the product shall be as specified in table I. TABLE I. Quantitative requirements. Property Units Value Requirement Volatile content, max. %WT 1.0 ASTM D1259, Method B Pot life, min. Minutes 30-45 3.5.4 Viscosity, max. CPS 25,000 ASTM D2196, Method A Working life, min. Minutes 30 3.5.2
12、Flammability, extent of burning, max. cm (inch) 2.54 (1) ULVN Specific gravity 1/ASTM D792, Method A Mean hardness, min. Shore D 75 ASTM D2240 Average tensile strength, min. Bar (atm) 482.7 (476) ASTM D638, Type I Average elongation, min. Percent 2.0 ASTM D638, Type I Average water absorption, max.
13、Percent 0.2 ASTM D570, 24 hour immersion Mechanical shock, min. Grams 1360 3.5.1 Average notched Izod impact, min. J/cm (ft-lb/in) 0.1602 (.3) ASTM D256, Method A Thermal shock, min. Cycles 10 Standard industry method Average thermal expansion coefficient, max. cm/cm/C (in/in/F) 30 x 10-5 (16.7 x 10
14、-5) ASTM D696 Thermal conductivity coefficient, min. Cal-cm/sec-cm2-C(ft-lb in/sec-ft2-F) 2.5 x 10-4 (0.1569) Standard industry method Dielectric strength, min. kV/mm (V/mil) 12.79 (325) ASTM D149 Dielectric constant, max. At 60 Hz At 1 MHz - - 5.0 4.5 ASTM D150 Dissipation factor, max. At 60 Hz At
15、1 MHz - - 0.04 0.05 ASTM D150 Arc resistance, min. Seconds 50 ASTM D495 Volume resistivity, min. Ohm-cm (ohm-in) 10 (3.94) 1/ 3/ASTM D257 Hydrolytic stability: Average hardness, max. Average volume resistivity, max. Percent 2/Ohm-cm (ohm-in) 3/10 10 (3.94) 1/ 2/ASTM D2240 ASTM D257 Fungus resistance
16、 - Grade 0 MIL-STD-810, Method 508 Operating temperature C (F) -32 to 130 (25.6 to 266) 3.5.3 NOTES: 1/Informational purposes only. 2/Percent reduction after aging. 3/Value after aging. 2 Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-A-A-59877 3.5.
17、1 Mechanical shock. Mechanical shock shall be determined as specified in 3.5.1.1 through 3.5.1.3. 3.5.1.1 Specimen. Three specimens, each 5 cm wide by 5 cm long and 1.25 cm thick (1.97 inches wide by 1.97 inches long and 0.49 inch thick), prepared as follows shall be tested. The specimens shall be p
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