JEDEC JESD9B-2011 Inspection Criteria for Microelectronic Packages and Covers.pdf
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1、JEDEC STANDARD Inspection Criteria for Microelectronic Packages and Covers JESD9B (Revision of JESD9A, April 1987) MAY 2011 JEDEC SOLID STATE TECHNOLOGY ASSOCIATION NOTICE JEDEC standards and publications contain material that has been prepared, reviewed, and approved through the JEDEC Board of Dire
2、ctors level and subsequently reviewed and approved by the JEDEC legal counsel. JEDEC standards and publications are designed to serve the public interest through eliminating misunderstandings between manufacturers and purchasers, facilitating interchangeability and improvement of products, and assis
3、ting the purchaser in selecting and obtaining with minimum delay the proper product for use by those other than JEDEC members, whether the standard is to be used either domestically or internationally. JEDEC standards and publications are adopted without regard to whether or not their adoption may i
4、nvolve patents or articles, materials, or processes. By such action JEDEC does not assume any liability to any patent owner, nor does it assume any obligation whatever to parties adopting the JEDEC standards or publications. The information included in JEDEC standards and publications represents a s
5、ound approach to product specification and application, principally from the solid state device manufacturer viewpoint. Within the JEDEC organization there are procedures whereby a JEDEC standard or publication may be further processed and ultimately become an ANSI standard. No claims to be in confo
6、rmance with this standard may be made unless all requirements stated in the standard are met. Inquiries, comments, and suggestions relative to the content of this JEDEC standard or publication should be addressed to JEDEC at the address below, or refer to www.jedec.org under Standards and Documents
7、for alternative contact information. Published by JEDEC Solid State Technology Association 2011 3103 North 10th Street Suite 240 South Arlington, VA 22201-2107 This document may be downloaded free of charge; however JEDEC retains the copyright on this material. By downloading this file the individua
8、l agrees not to charge for or resell the resulting material. PRICE: Contact JEDEC Printed in the U.S.A. All rights reserved PLEASE! DONT VIOLATE THE LAW! This document is copyrighted by JEDEC and may not be reproduced without permission. Organizations may obtain permission to reproduce a limited num
9、ber of copies through entering into a license agreement. For information, contact: JEDEC Solid State Technology Association 3103 North 10th Street Suite 240 South Arlington, VA 22201-2107 or refer to www.jedec.org under Standards and Documents for alternative contact information. JEDEC Standard No.
10、9B -i- INSPECTION CRITERIA FOR MICROELECTRONIC PACKAGES AND COVERS Contents Page Foreword ii 1 Scope 1 2 Normative Reference 1 3 Terms and Definitions 2 4 General Requirements 10 4.1 Quality System 10 4.2 Quality and Screening 10 4.3 Order of Precedence 10 4.4 Inspection Magnification 10 4.5 Control
11、ling Dimension 10 5 Insulator Criteria (Metal Packages: Glass-to-metal and Ceramic-to-metal Seals) 11 5.1 Insulator Bubbles 11 5.2 Insulator Cracks, Chip-outs, Crazing 13 5.3 Insulator Climb, Overflow, Splatter 17 5.4 Other Insulator Conditions 19 6 Braze Criteria (Metal Packages) 21 6.1 Undercut Br
12、aze, Non-continuous Braze, Misalignment 21 6.2 Porous and Peeling Braze 22 6.3 Braze Run-out 23 6.4 Braze Climb 24 7 Leads (Metal and Ceramic Packages) 26 7.1 Lead Nicks, Pits, Voids, Indentations, Scratches, Over-etching, Protrusions 26 7.2 Lead Surface Finish 29 7.3 Off-center, Bent, Angled, or Br
13、oken Leads 31 8 General Package Criteria (Metal Packages) 34 8.1 Package Nicks, Pits, Voids, Indentations, Scratches, Protrusions, Chip-outs 34 8.2 Package Surface Finish 40 9 General Cover Criteria (Metal Covers) 42 9.1 Cover Nicks, Pits, Voids, Indentations, Scratches, Protrusions, Chip-outs 42 9.
14、2 Cover Surface Finish 45 10 General Package Criteria (Ceramic Packages: Non-metallized Areas) 46 10.1 Ceramic Chip-outs, Cracks, Delamination, Separation, Voiding, Protrusions, Fins 46 11 Metallization Criteria (Ceramic Packages) 50 11.1 General 50 11.2 Contact Pad Metallization 50 11.3 Seal Area M
15、etallization 53 11.4 Bonding Area Metallization 57 11.5 Die Attach Area 61 11.6 Braze Pad Metallization 64 11.7 Castellation Metallization 66 12 Lead Attachment (Ceramic Packages) 67 12.1 Lead to Braze Pad Attachment 67 12.2 Lead to Pad Misalignment 69 Annex A (informative) Index of Figures 70 Annex
16、 B (informative) Differences between revisions 73 JEDEC Standard No. 9B -ii- Foreword The purpose of this JEDEC standard is to verify the workmanship and requirements of microelectronic packages and covers (lids) intended for use in fabricating hybrid microelectronic circuits / microcircuits (hereaf
17、ter referred to as “microcircuits”). It is applicable for use by the package manufacturer (i.e., package components), and the microcircuit manufacturer (i.e., from incoming inspection of package components through final inspection of the completed microcircuit). This standard implements a complete r
18、e-write and significant technical changes and information from the previous edition. This standard also encompasses and replaces JESD27, Ceramic Package Specification for Microelectronic Packages. It is meant to be used in conjunction, and to not contradict, with MIL-STD-883, Test Method 2009: Exter
19、nal Visual. This standard provides the package manufacturer, microcircuit manufacturer, and microcircuit customer a complete set of microelectronic package workmanship inspection requirements. JEDEC Standard No. 9B Page 1 INSPECTION CRITERIA FOR MICROELECTRONIC PACKAGES AND COVERS (From JEDEC Board
20、Ballot JCB-11-23, formulated under the cognizance of the JC-13.5 Committee on Hybrid Microcircuit Technology) 1 Scope This standard establishes the inspection criteria for metal and ceramic hermetic packages, individual feed throughs, and covers (lids). 2 Normative Reference The following normative
21、documents contain provisions that, through reference in this text, constitute provisions of this standard. For dated references, subsequent amendments to, or revisions of, any of these publications do not apply. However, parties to agreements based on this standard are encouraged to investigate the
22、possibility of applying the most recent editions of the normative documents indicated below. For undated references, the latest edition of the normative document referred to applies. MIL-PRF-38534, Hybrid Microcircuits, General Specification for MIL-PRF-38535, Microcircuits, General Specification fo
23、r MIL-STD-883, Test Method Standard, Microcircuits Military Standards are available in electronic format from: http:/assist.daps.dla.mil and in hard copy format from: Standardization Documents Order Desk Building 4D, 700 Robbins Avenue Philadelphia, PA 19111-5904 JEDEC Standard No. 9B Page 2 3 Terms
24、 and Definitions For the purpose of this standard, the terms, definitions, and symbols of MIL-PRF-38534, MIL-PRF-38535, and MIL-STD-883 and the following shall apply and shall be used in the applicable procurement documentation: 3.1 annular ring: The metallization pad area around the top or bottom o
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