IEST RP-CC028 1-2002 MINIENVIRONMENTS.pdf

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1、INSTITUTE OF ENVIRONMENTAL SCIENCES AND TECHNOLOGY Contamination Control Division Reco ended Practice 028.1 IEST-RP-C028.1 Minienvironments INSTITUTE OF ENVIRONMENTAL SCIENCES AND TECHNOLOGY Arlington Place One 2340 S. Arlington Heights Road, Suite 10 Arlington Heights, IL 6005-4516 Phone: (847) 981

2、-010 Fax: (847) 981-4130 E-mail: iestiest.org Web: ww.iest.org 2 Copyrighted material IEST-RP-C028.1 INSTITUTE OF ENVIRONMENTAL SCIENCES AND TECHNOLOGY This Recomended Practice is published by the INSTITUTE OF ENVIRONMENTAL SCIENCES AND TECHNOLOGY to ad-vance contamination control and the technical

3、and enginering sciences. Its use is entirely voluntary, and determina-tion of its aplicability and suitability for any particular use is solely the responsibility of the user. This Recomended Practice was prepared by and is under the jurisdiction of Working Group C028 of the IEST Contamination Contr

4、ol Division. Copyright 202 by the INSTITUTE OF ENVIRONMENTAL SCIENCES AND TECHNOLOGY Second printing, December 202 ISBN 978-1-87862-83-0 PROPOSAL FOR IMPROVEMENT: The Working Groups of the INSTITUTE OF ENVIRONMENTAL SCIENCES AND TECHNOLOGY are continualy working on improvements to their Recomended P

5、ractices and Reference Docu-ments. Sugestions from those who use these documents are welcome. If you have a sugestion regarding this document, please use the online Proposal for Improvement form found on the IEST website at ww.iest.org/proposal/form.html. INSTITUTE OF ENVIRONMENTAL SCIENCES AND TECH

6、NOLOGY Arlington Place One 2340 S. Arlington Heights Road, Suite 10 Arlington Heights, IL 6005-4516 Phone: (847) 981-010 Fax: (847) 981-4130 E-mail: iestiest.org Web: ww.iest.org IEST-RP-C028.1 INSTITUTE OF ENVIRONMENTAL SCIENCES AND TECHNOLOGY Copyrighted material 3 Minienvironments IEST-RP-C028.1

7、CONTENTS SECTION 1 SCOPE AND LIMITATIONS.5 2 REFERENCES5 3 TERMS AND EFINITIONS.7 4 APLICATIONS AND CONCEPTS8 5 PLANING.13 6 DESIGN CONSIDERATIONS15 7 EVALUATION OF MINIENVIRONMENT SYSTEMS.2 8 BIBLIOGRAPHY26 TABLE 1 MICROELECTRONICS PRODUCTION OPERATIONS.10 2 MINIENVIRONMENT CONCEPTS.10 3 CONTAMINAT

8、ION CONTROL CATEGORIES14 FIGURE 1 STAND-ALONE MINIENVIRONMENT (OPEN LOP).1 2 FACILITY SUPLIED MINIENVIRONMENT (OPEN LOP)1 3 STAND-ALONE MINIENVIRONMENT (CLOSED LOP).12 4 Copyrighted material IEST-RP-C028.1 INSTITUTE OF ENVIRONMENTAL SCIENCES AND TECHNOLOGY IEST-RP-C028.1 INSTITUTE OF ENVIRONMENTAL S

9、CIENCES AND TECHNOLOGY Copyrighted material 5 INSTITUTE OF ENVIRONMENTAL SCIENCES AND TECHNOLOGY Contamination Control Division Recomended Practice 028.1 Minienvironments IEST-RP-C028.1 1 SCOPE AND LIMITATIONS 1.1 Scope The purpose of this document is to provide a frame-work for describing minienvir

10、onments for microelec-tronics and similar aplications. Aplications, planing, design, and evaluation are discused in detail. This Recomended Practice is intended to stimulate discusion of specifications and configurations for a specified aplication betwen the suplier and cus-tomer. This Recomended Pr

11、actice does not adres microbiological isues or aplications. 1.2 Limitations This Recomended Practice is limited to a discus-sion of the design characteristics and operating char-acteristics of minienvironments and other localy controled environments. Proces equipment design fals outside the scope of

12、 this document. This document does not supersede specific require-ments established by recognized national or interna-tional regulating bodies. Certain specific hazardous materials, such as radioactive materials and geneti-caly altered organisms, and certain toxic materials are not specificaly adres

13、ed in this document. Users of these substances should augment this document with industry-specific publications. 2 REFERENCES 2.1 Institute of Environmental Sciences and Technology (IEST) 2340 S. Arlington Heights Road, Suite 10 Arlington Heights, IL 6005-4516, USA Phone: (847) 981-010 Fax: (847) 98

14、1-4130 E-mail: iestiest.org Website: ww.iest.org IEST-RP-C06.2: Testing Cleanroms IEST-RP-C08-84: Gas-Phase Adsorber Cels IEST-RP-C012.1: Considerations in Cleanrom Design IEST-RP-C02.1: Electrostatic Charge in Clean-roms and Other Controled Environments IEST-RP-C034.1: HEPA and ULPA Filter Leak Tes

15、ts 2.2 American National Standards Institute (ANSI) Website: ww.ansi.org ANSI C63.14-192 Dictionary of Technologies of Electromagnetic Compatibility (EMC), Electromag-netic Pulse (EMP), and Electrostatic Discharge (ESD) 6 Copyrighted material IEST-RP-C028.1 INSTITUTE OF ENVIRONMENTAL SCIENCES AND TE

16、CHNOLOGY 2.3 American Society of Heating, Refrigerating and Air-Conditioning Enginers, Inc. (ASHRAE) Website: ww.ashrae.org 2.4 ASTM International Website: ww.astm.org ASTM D257 Standard Test Method for DC Resis-tance or Conductance of Insulating Materials ASTM E595-93 Standard Test Method for Total

17、 Mas Los and Colected Volatile Condensable Materials from Outgasing in a Vacum Environment 2.5 European Comite for Standardization (CEN) Website: ww.cenorm.be EN 501 Limits and Methods of Measurement of Ra-dio Disturbance Characteristics of Industrial, Scien-tific and Medical (ISM) Radio-Frequency E

18、quipment EN 5082-1:192 Electromagnetic CompatibilityGeneric Imunity Standard, Part 1: Residential, Comercial and Light Industry EN 5082-2:194 Electromagnetic CompatibilityGeneric Imunity Standard, Part 2: Industrial En-vironment 2.6 Factory Mutual Research Corporation (FMRC) Website: FM 4910 FMRC C

19、lean Rom Materials Flamabil-ity Test Protocol 2.7 Ilumination Enginering Society of North America (IESNA) Website: ww.iesna.org IESNA Lighting Handbok 2.8 International Organization for Standardization (ISO) Available from IEST at ww.iest.org. ISO 1464-1 Cleanroms and asociated controled environment

20、sPart 1: Clasification of airborne particulates 2.9 Military Available from the Defense Information Systems Agency (DISA) at ww.disa.mil and from other sources. MIL-HDBK-263B Electrostatic Discharge Control (ESD) Handbok for Protection of Electrical and Elec-tronic Parts, Asemblies and Equipment (Ex

21、cluding Electricaly Initiated Explosive Devices) (Metric) 2.10 National Asociation of Corosion Enginers (NACE) Website: ww.nace.org National Asociation of Corosion Enginers (NACE) Coatings and Linings Handbok. NACE Corosion Enginers Reference Handbok. 2.11 National Fire Protection Asociation (NFPA)

22、Website: ww.nfpa.org NFPA-70: National Electric Code 2.12 Semiconductor Equipment and Materials International (SEI) Website: ww.semi.org SEMI E14-93 Measurement of Particle Contamina-tion Contributed to the Product from the Proces or Suport Tol SEMI E3-94 Specification for Semiconductor Man-ufacturi

23、ng Facility Electromagnetic Compatibility SEMI E43-95 Recomended Practice for Measuring Static Charge on Objects and Surfaces SEMI F21-95 Clasification of Airborne Molecular Contaminant Levels in Clean Environments SEMI S2-020 Environmental, Healthy, and Safety Guidelines for Semiconductor Manufactu

24、ring Equip-ment SEMI S8-95 Safety Guidelines for Ergonom-ics/Human Factors Enginering of Semiconductor Manufacturing Equipment IEST-RP-C028.1 INSTITUTE OF ENVIRONMENTAL SCIENCES AND TECHNOLOGY Copyrighted material 7 2.13 Underwriters Laboratories (UL) Website: UL-90 Safety Standards for Air Filter

25、Units 2.14 Other Hinds, W.C. Aerosol Technology: Properties, Behav-ior, and Measurement of Airborne Particle. New York: Wiley one substance adheres to the surface of the other aerosol gaseous suspension of solid or liquid material, usu-aly betwen 0.01 m and 100 m in diameter airflow In the context o

26、f this document, movement of al gaseous environmental media (e.g., air, nitrogen, ar-gon, etc.). ambient environment external to the minienvironment box protective portable container for a casete and/or contamination-sensitive products casete open structure that holds one or more contamination-sensi

27、tive products certification statement by a testing agency that a minienvironment has ben tested in acordance with the latest revision of established specifications and that the require-ments of the specifications have ben achieved chemisorption type of adsorption having most of the characteristics o

28、f a chemical reaction betwen a reactant molecule and the solid condensable substance (other than water) typicaly having a boil-ing point above rom temperature at atmospheric presure, capable of condensation on a clean surface contaminant anything that can adversely afect product, proces, or people d

29、opant chemical element that modifies the electrical proper-ties of a semiconductor material electromagnetic compatibility (EMC) ability of an electronic system or device to: 1) func-tion properly in its intended electromagnetic envi-ronment, and 2) not be a source of electromagnetic polution to its

30、environment; where the electromag-netic environment is composed of both radiated and conducted energy, EMC has two aspects: susceptibil-ity and emision electromagnetic interference (EMI) conducted or radiated electrical disturbances that can interfere with equipment operation; these distur-bances ca

31、n ocur anywhere in the electromagnetic spectrum, from les than 10 Hz to cosmic rays, in-cluding radio, light, and x-rays electrostatic discharge (ESD) transfer of electrostatic charge betwen bodies at dif-ferent electrostatic potentials enclosure physical barier or bariers separating the localized e

32、nvironment and its suroundings flow visualization method for demonstrating paterns of airflow, either physicaly (using fog test, aerosol smoke test, strings, or threads) or by computational fluid dynamics input/output (I/O) device means of transfering contamination-sensitive mate-rials into and out

33、of a minienvironment integration integration of the minienvironment into the entire production system (including proces materials, proc-es equipment, materials-handling equipment, people, cleanrom, etc.) inert chemicaly non-reactive with the products or materi-als at hand or in use isolation separat

34、ion of a proces or object from the ambient environment mean time betwen failures (MTBF) average time (in hours) equipment performed in-tended function prior to failure minienvironment localized environment created by an enclosure to isolate a product or proces from the surounding environment 8 Copyr

35、ighted material IEST-RP-C028.1 INSTITUTE OF ENVIRONMENTAL SCIENCES AND TECHNOLOGY monitor wafer semiconductor wafer used as a witnes plate monitoring routine measurement of relevant conditions (airborne particles, surface particles, temperature and humidity, diferential presure, airflow velocity and

36、 directional-ity, etc.) outgasing liberation of a gas from any material other than by a change of state particle object that is solid, liquid, or both, usualy betwen 1 nanometer and 1 milimeter in size particle deposition rate number of particles deposited on a surface per unit of time physisorption

37、 atraction of an adsorbate, e.g. contaminants, to the surface of an adsorbent caused mainly by van der Wals forces and electrostatic forces pod box containing a casete of wafers that is used in conjunction with a standard mechanical interface (SMIF); the box isolates the casete of wafers and maintai

38、ns the integrity of the minienvironment precision closenes of agrement betwen values obtained by repeated measurements of the same quantity under the identical conditions; also known as repeatability or reproducibility radio-frequency interference (RFI) electromagnetic radiation emited by electrical

39、 cir-cuits carying rapidly changing signals as a by-product of their normal operation, and that causes unwanted signals (interference or noise) to be in-duced in other circuits relative humidity ratio of the amount of water vapor in the air (at a specific temperature) to the maximum amount that the

40、air could hold at that temperature, expresed as a percentage resolution, particle size capability of a particle-sizing device to discriminate betwen particles that are similar in size; expresed as the ratio of the minimum size diferential required to indicate a size change to the size of the particl

41、e be-ing measured standard mechanical interface (SMIF) mechanical device that transports a casete of wafers into and out of a minienvironment thermophoresis movement of particles in a thermal gradient; can in-duce significant diferences betwen airflow and par-ticle velocity triboelectric charging el

42、ectrostatic charging folowing the mechanical sepa-ration of solids or the separation of solids from fluids unidirectional airflow air that flows in a single pas in a single direction through a cleanrom or clean zone with generaly paralel streamlines; formerly refered to as laminar airflow witnes pla

43、te surface used to colect contaminants deposited from the environment; typicaly selected to simulate par-ticular products (examples include silicon wafers, microscope plates, membrane filters, and glas pho-tomask substrates) 4 APLICATIONS AND CONCEPTS 4.1 Overview Minienvironments can be specified a

44、nd constructed in many styles and configurations. These configura-tions may range from the extremely simple laminar hod with direction shields to stand-alone, tempera-ture- and humidity-controled, ultra-clean chambers with inert recirculating gases and automated I/O mechanisms. The type and location

45、 depend on: Product contamination control requirements Plans for automation and product-handling New instalation versus retrofit Economics Environmental control tolerances Safety isues 4.2 Use of Minienvironments Minienvironments may be used to either protect a product from people or the environment

46、, or to pro-tect people and the environment from the product or proces. 4.2.1 Protection of the product from people or the environment Minienvironments may be used to protect contamina-tion-sensitive products by isolating them from contami-nants in the ambient environment. These contaminants may be

47、environmental, the result of nearby production operations, or the result of personel activity. The apli-cation of a specific minienvironment design to a given IEST-RP-C028.1 INSTITUTE OF ENVIRONMENTAL SCIENCES AND TECHNOLOGY Copyrighted material 9 proces should be evaluated based on its ability to c

48、on-trol environmental parameters that are critical to proces outcome, or provide protection of personel from haz-ards that originate within the proces, or both. Environ-mental parameters that may impact proces outcome include aerosols, gaseous contaminants, temperature, humidity, presure, vibration,

49、 electrostatic discharge, and electromagnetic radiation. Aerosols may be organic or inorganic in nature. Gas-phase contaminants may be corosive, flamable, or toxic and may originate from the external environment or the proces itself. 4.2.2 Protection of people or the environment from the product or proces Minienvironments may be used to protect people, the environment, or both, by isolating the hazardous prod-ucts or proceses from the surounding environment. Proces hazards that should be contained by the minien-v