EN 61967-6-2002 en Integrated circuits - Measurement of electromagnetic emissions 150 kHz to 1 GHz Part 6 Measurement of conducted emissions - Magnetic probe method (Incorporates A.pdf

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1、BRITISH STANDARDBS EN 61967-6:2002 +A1:2008Integrated circuits Measurement of electromagnetic emissions, 150 kHz to 1 GHz Part 6: Measurement of conducted emissions Magnetic probe methodICS 31.200g49g50g3g38g50g51g60g44g49g42g3g58g44g55g43g50g56g55g3g37g54g44g3g51g40g53g48g44g54g54g44g50g49g3g40g59g

2、38g40g51g55g3g36g54g3g51g40g53g48g44g55g55g40g39g3g37g60g3g38g50g51g60g53g44g42g43g55g3g47g36g58Incorporating corrigendum August 2010National forewordThis British Standard is the UK implementation of EN 61967-6:2002+A1:2008. It is identical with IEC 61967-6:2002, incorporating amendment 1:2008. It s

3、upersedes BS EN 61967-6:2002 which is withdrawn.The UK participation in its preparation was entrusted to Technical Committee EPL/47, Semiconductors.A list of organizations represented on this committee can be obtained on request to its secretary.This publication does not purport to include all the n

4、ecessary provisions of a contract. Users are responsible for its correct application.Compliance with a British Standard cannot confer immunity from legal obligations.BS EN 61967-6:2002+A1:2008This British Standard was published under the authority of the Standards Policy and Strategy Committee on 24

5、 October 2002 BSI 2010Amendments/corrigenda issued since publicationDate Comments 30 September 2008 Implementation of IEC amendment 1:2008 with CENELEC endorsement A1:2008. Annex E added and Bibliography amended31 December 2010 Implementation of IEC corrigendum August 2010: Corrections to Figure 3 a

6、nd A.4ISBN 978 0 580 72986 7EUROPEAN STANDARD EN 61967-6:2002+A1NORME EUROPENNEEUROPISCHE NORM May 2008CENELECEuropean Committee for Electrotechnical StandardizationComit Europen de Normalisation ElectrotechniqueEuropisches Komitee fr Elektrotechnische NormungCentral Secretariat: rue de Stassart 35,

7、 B - 1050 Brussels 2002 CENELEC - All rights of exploitation in any form and by any means reserved worldwide for CENELEC members.Ref. No. EN 61967-6:2002 EICS 31.200English versionIntegrated circuits -Measurement of electromagnetic emissions,150 kHz to 1 GHzPart 6: Measurement of conducted emissions

8、 -Magnetic probe method(IEC 61967-6:2002)Circuits intgrs -Mesure des missionslectromagntiques, 150 kHz 1 GHzPartie 6: Mesure des missionsconduites -Mthode de la sonde magntique(CEI 61967-6:2002)Integrierte Schaltungen -Messung von elektromagnetischenAussendungen im Frequenzbereichvon 150 kHz bis 1 G

9、HzTeil 6: Messung der leitungsgefhrtenAussendungen -Magnetsondenverfahren(IEC 61967-6:2002)This European Standard was approved by CENELEC on 2002-09-01. CENELEC members are bound tocomply with the CEN/CENELEC Internal Regulations which stipulate the conditions for giving this EuropeanStandard the st

10、atus of a national standard without any alteration.Up-to-date lists and bibliographical references concerning such national standards may be obtained onapplication to the Central Secretariat or to any CENELEC member.This European Standard exists in three official versions (English, French, German).

11、A version in any otherlanguage made by translation under the responsibility of a CENELEC member into its own language andnotified to the Central Secretariat has the same status as the official versions.CENELEC members are the national electrotechnical committees of Austria, Belgium, Czech Republic,D

12、enmark, Finland, France, Germany, Greece, Hungary, Iceland, Ireland, Italy, Luxembourg, Malta,Netherlands, Norway, Portugal, Slovakia, Spain, Sweden, Switzerland and United Kingdom.ForewordThe text of document 47A/645/FDIS, future edition 1 of IEC 61967-6, prepared by SC 47A, Integratedcircuits, of

13、IEC TC 47, Semiconductor devices, was submitted to the IEC-CENELEC parallel vote andwas approved by CENELEC as EN 61967-6 on 2002-09-01.This European Standard should be read in conjunction with EN 61967-1:2002.The following dates were fixed: latest date by which the EN has to be implementedat nation

14、al level by publication of an identicalnational standard or by endorsement (dop) 2003-06-01 latest date by which the national standards conflictingwith the EN have to be withdrawn (dow) 2005-09-01Annexes designated “normative“ are part of the body of the standard.Annexes designated “informative“ are

15、 given for information only.In this standard, annexes A and ZA are normative and annexes B, C and D are informative.Annex ZA has been added by CENELEC._Endorsement noticeThe text of the International Standard IEC 61967-6:2002 was approved by CENELEC as a EuropeanStandard without any modification._Fo

16、reword to amendment A1 The text of document 47A/781/FDIS, future amendment 1 to IEC 61967-6:2002, prepared by SC 47A, Integrated circuits, of IEC TC 47, Semiconductor devices, was submitted to the IEC-CENELEC parallel vote and was approved by CENELEC as amendment A1 to EN 61967-6:2002 on 2008-04-01.

17、 The following dates were fixed: latest date by which the amendment has to be implemented at national level by publication of an identical national standard or by endorsement (dop) 2009-01-01 latest date by which the national standards conflicting with the amendment have to be withdrawn (dow) 2011-0

18、4-01 _ Endorsement notice The text of amendment 1:2008 to the International Standard IEC 61967-6:2002 was approved by CENELEC as an amendment to the European Standard without any modification. _ BS EN 61967-6:2002+A1:2008Page 2EN 61967-6:2002+A1:2008 (E)CONTENTS1 Scope 52 Normative references 53 Def

19、initions .54 General 54.1 Measurement philosophy.54.2 Measurement principle.65 Test conditions.65.1 General 65.2 Frequency range .66 Test equipment .66.1 General 66.2 Magnetic probe.66.3 Probe spacing fixture and placement 67 Test set-up 97.1 General 97.2 Probe calibration .97.3 Modifications to sta

20、ndardized IC test board.97.3.1 Layer arrangement 97.3.2 Layer thickness .97.3.3 Decoupling capacitors 97.3.4 I/O pin loading .108 Test procedure 148.1 General 148.2 Test technique .149 Test report .149.1 General 149.2 Documentation 14Annex A (normative) Probe calibration procedure Microstrip line me

21、thod 16Annex B (informative) Measurement principle and calibration factor .19Annex C (informative) Spatial resolution of magnetic probe .23Annex D (informative) Angle pattern of probe placement .24Annex ZA (normative) Normative references to international publications with theircorresponding Europea

22、n publications .43Bibliography 42Annex E (informative) Advanced magnetic probe .25BS EN 61967-6:2002+A1:2008Page 3EN 61967-6:2002+A1:2008 (E)Figure 1 Magnetic probe 7Figure 2 Magnetic probe 1stand 3rdlayers .7Figure 3 Magnetic probe 2ndlayer 8Figure 4 Magnetic probe layer construction 8Figure 5 Stan

23、dardized IC test board (sectional view 1) .10Figure 6 Standardized IC test board (sectional view 2 measurement line) 10Figure 7 Power line pattern on the standardized IC test board Bottom layer .11Figure 8 I/O signal line pattern on the standardized IC test board Bottom layer 12Figure 9 Multi-power

24、lines on the standardized IC test board Bottom layer .12Figure 10 Measurement set-up 13Figure 11 Measurement circuit schematic .13Figure 12 Transfer constant for current calculation as a function of insulatorthickness of microstrip board 15Figure A.1 Cross-sectional view of a microstip line for cali

25、bration 16Figure A.2 Measurement set-up for probe calibration .18Figure B.1 Cross-sectional view of a microstrip line 19Figure B.2 Measurement of magnetic probe output 21Figure B.3 Example of calibration factor for the magnetic probe specifiedin figures 1, 2, 3 and 4 .22Figure C.1 Diagram for measur

26、ing a magnetic field distribution .23Figure C.2 Magnetic field distribution across the microstrip line (800 MHz)23Figure D.1 Diagram for measuring an angle pattern of probe placement .24Figure D.2 Probe output to angle 24BS EN 61967-6:2002+A1:2008Page 4EN 61967-6:2002+A1:2008 (E)INTEGRATED CIRCUITS

27、MEASUREMENT OF ELECTROMAGNETIC EMISSIONS,150 kHz TO 1 GHz Part 6: Measurement of conducted emissions Magnetic probe method1 ScopeThis part of the IEC 61967 specifies a method for evaluating RF currents on the pins of anintegrated circuit (IC) by means of non-contact current measurement using a minia

28、turemagnetic probe. This method is capable of measuring the RF currents generated by the ICover a frequency range of 0,15 MHz to 1 000 MHz. This method is applicable to themeasurement of a single IC or a chip set of ICs on the standardized test board forcharacterization and comparison purposes. It i

29、s also usable to evaluate the electromagneticcharacteristics of an IC or group of ICs on an actual application PCB for emission reductionpurposes. This method is called the “magnetic probe method“.2 Normative referencesThe following referenced documents are indispensable for the application of this

30、document.For dated references, only the edition cited applies. For undated references, the latest editionof the referenced document (including any amendments) applies.IEC 61967-1, Integrated circuits Measurement of electromagnetic emissions, 150 kHz to1 GHz Part 1: General conditions and definitions

31、IEC 61967-4, Integrated circuits Measurement of electromagnetic emissions, 150 kHz to1 GHz Part 4: Measurement of conducted emissions 1 /150 direct coupling method 33 DefinitionsFor the purposes of this part of IEC 61967 the definitions found in IEC 61967-1 apply.4 General4.1 Measurement philosophyT

32、he emissions radiated from a PCB are, in part, caused by RF current generated by theonboard IC which drives PCB traces, PCB ground and supply planes, and cables connected tothe PCB. All of these can act as RF antennas to radiate the emissions. The emission level isproportional to the driving RF curr

33、ent, and is also affected significantly by PCB design,radiation effectiveness of the pseudo-antennas, and noise coupling path coefficients from theIC to the pseudo-antennas.For this emission mechanism, the driving force of the IC can be a significant parameter forboth users and manufacturers to esti

34、mate and predict the electromagnetic characteristics of aPCB, module, or system. A measure of the emission driving force can be obtained bymeasuring the RF currents generated by the IC under test. Thus, the measured RF noisecurrent can be regarded as an indicator of the undesirable electromagnetic e

35、mission drivingforce generated by the IC._3To be published.BS EN 61967-6:2002+A1:2008Page 5EN 61967-6:2002+A1:2008 (E)4.2 Measurement principleUsing this test method, the RF current on the power supply pins and I/O pins of an IC undertest can be measured using a miniature triplate-structured magneti

36、c probe. This probemeasures the magnetic field at a specified height over a power supply or I/O strip conductoron the standardized test board in a controlled manner. The RF current is calculated from themeasured magnetic field using the formula described in 8.2. With accurate mechanicalplacement of

37、the magnetic probe, this method provides a high degree of repeatability. Inaddition, the frequency range of this method can be extended subject to the limitationsdescribed in 5.2. Higher frequencies can be obtained without a substantial influence onaccuracy. The estimation of the RF current over the

38、 power supply or I/O strip conductor is aneasy and handy way of characterizing and comparing the ICs.5 Test conditions5.1 GeneralGeneral test conditions are described in IEC 61967-1.5.2 Frequency rangeThe effective frequency range of this measurement method is 0,15 MHz to 1 000 MHz. Themaximum frequ

39、ency can be extended, if desired, subject to the limitations of the test set-up.The upper limit of the frequency range is directly related to high frequency characteristics ofthe magnetic probe and its distance from the line under test as described in annex B. At a lowfrequency region of 0,15 MHz to

40、 10 MHz, however, it may be advisable to use a low noisepre-amplifier to improve dynamic range of the measurement.6 Test equipment6.1 GeneralFor general information on test equipment see IEC 61967-1.6.2 Magnetic probeThe magnetic probe shall be a triplate-structured strip line composed of a three-la

41、yer PCB.Recommended probe construction details are shown in figures 1, 2, 3 and 4.An SMA connector is attached at the edge of the PCB opposite to the rectangular loop portionof the probe as shown in the figures . Attachment pads for the SMA connector are on layers 1and 3, which are connected to each

42、 other through four vias. The strip conductor pattern is onlayer 2, which is connected to the centre pin of the SMA connector.6.3 Probe spacing fixture and placementThe probe output voltage depends on the distance between the probe tip and the stripconductor under measurement. This makes it very cri

43、tical to maintain a 1 mm space betweenthe strip conductor and the magnetic probe tip during this measurement. Therefore, a probespacing fixture shall be used to maintain 1,0 mm 0,1 mm spacing between the bottom of therectangular loop portion of the probe and strip line on the IC test board, or the e

44、ntire probecan be molded into a piece of fixing block which houses the probe so as to maintain thespecified space precisely as shown in figure 10.BS EN 61967-6:2002+A1:2008Page 6EN 61967-6:2002+A1:2008 (E)In addition, the probe output voltage depends on probe placement angle () to direction ofmicros

45、trip line under measurement. According to an experimental measurement on anglepatterns of probe directional placement, the angle shall be less than 15 for amplitude error tobe less than 2 dB. See annex D for details.30 mm10 mm50 strip lineVia through layers 1, 2, and 3Signal line pattern on layer 2P

46、ads for SMA connectoron layer 1 and 3Via for SMA connectorthrough layers 1, 2, and 3Rectangular loop portionfor detectionVia for SMA connectorthrough layers 1, 2, and 3Ground plane patternson layer 1 and layer 3IEC 1468/02Figure 1 Magnetic probe1,8 mm30 mm 0,8 mmVia: 0,25 mm diameter0,2 mm10 mm8,4 m

47、m0,1 mm10 mmCenter lineViaViaIEC 1469/02Figure 2 Magnetic probe First and third layersBS EN 61967-6:2002+A1:2008Page 7EN 61967-6:2002+A1:2008 (E)Figure 3 Magnetic probe Second layerLayer 3Layer 2Layer 1InsulatorThickness of copper foils:Layer 1: 0,035 mmLayer 2: 0,035 mmLayer 3: 0,035 mmInsulatorCen

48、ter line0,2 mm* Thickness of insulatorInsulators for reinforcement(recommended)Insulators(glass epoxy)0,2 mm*IEC 1471/02Figure 4 Magnetic probe Layer constructionBS EN 61967-6:2002+A1:2008Page 830 mm Via 0,1 mm 10 mm 5,2 mm 0,4 mm 1,0 mm Center line Via: 0,25 mm diameterIEC 2078/10 EN 61967-6:2002+A

49、1:2008 (E)7 Test set-up7.1 GeneralGeneral test set-up requirements are described in IEC 61967-1.The measurement set-up and circuit schematic of the magnetic probe measurement methodare shown in figures 10 and 11, respectively.7.2 Probe calibrationThe magnetic probe used shall be calibrated to obtain accurate correlation between themeasured magnetic field intensity and the estimated RF current. The probe calibrat