EN 60664-3-2003 en Insulation coordination for equipment within low-voltage systems Part 3 Use of coating potting or moulding for protection against pollution (Incorporates Amendme.pdf

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1、BRITISH STANDARDBS EN 60664-3:2003Insulation coordination for equipment within low-voltage systemsPart 3: Use of coating, potting or moulding for protection against pollutionICS 29.080.30g49g50g3g38g50g51g60g44g49g42g3g58g44g55g43g50g56g55g3g37g54g44g3g51g40g53g48g44g54g54g44g50g49g3g40g59g38g40g51g

2、55g3g36g54g3g51g40g53g48g44g55g55g40g39g3g37g60g3g38g50g51g60g53g44g42g43g55g3g47g36g58+A1:20 0 1Incorporating corrigendum November 2010National forewordThis British Standard is the UK implementation of EN 60664-3:2003+A1:2010. It is identical with IEC 60664-3:2003, incorporating amendment 1:2010 an

3、d corrigendum November 2010. It supersedes BS EN 60664-3:2003+A1:2010, which is withdrawn.The start and finish of text introduced or altered by amendment is indicated in the text by tags. Tags indicating changes to IEC text carry the number of the IEC amendment. For example, text altered by IEC amen

4、dment 1 is indicated by !“.The UK participation in its preparation was entrusted to Technical Committee GEL/109, Insulation coordination for low-voltage equipment.A list of organizations represented on this committee can be obtained on request to its secretary. This publication does not purport to i

5、nclude all the necessary provisions of a contract. Users are responsible for its correct application. Compliance with a British Standard cannot confer immunity from legal obligations. BS EN 60664-3:2003+A1:2010This British Standard was published under the authority of the Standards Policy and Strate

6、gy Committee on 9 June 2003 BSI 2011Amendments/corrigenda issued since publicationDate Comments 31 July 2010 Implementation of IEC amendment 1:2010 with CENELEC endorsement A1:201030 April 2011 Implementaion of IEC corigendum November 201. Addition of IEC 60326-2:1990 to normative referencesISBN 978

7、 0 580 73981 1EUROPEAN STANDARD EN 60664-3NORME EUROPENNE EUROPISCHE NORM 2010 CENELEC European Committee for Electrotechnical Standardization Comit Europen de Normalisation Electrotechnique Europisches Komitee fr Elektrotechnische Normung Central Secretariat: rue de Stassart 35, B - 1050 Brussels 2

8、003 CENELEC - All rights of exploitation in any form and by any means reserved worldwide for CENELEC members. Ref. No. EN 60664-3:2003+A1:2010 E ICS 29.080.30Supersedes HD 625.3 S1:1997 English version Insulation coordination for equipment within low-voltage systems Part 3: Use of coating, potting o

9、r moulding for protection against pollution (IEC 60664-3:2003+A1:2010) Coordination de lisolement des matriels dans les systmes (rseaux) basse tension Partie 3: Utilisation de revtement, dempotage ou de moulage pour la protection contre la pollution (CEI 60664-3:2003+A1:2010) Isolationskoordination

10、fr elektrische Betriebsmittel in NiederspannungsanlagenTeil 3: Anwendung von Beschichtungen, Eingieen oder Vergieen zum Schutz gegen Verschmutzung (IEC 60664-3:2003+A1:2010) This European Standard was approved by CENELEC on 2003-04-01. CENELEC members are bound to comply with the CEN/CENELEC Interna

11、l Regulations which stipulate the conditions for giving this European Standard the status of a national standard without any alteration. Up-to-date lists and bibliographical references concerning such national standards may be obtained on application to the Central Secretariat or to any CENELEC memb

12、er. This European Standard exists in three official versions (English, French, German). A version in any other language made by translation under the responsibility of a CENELEC member into its own language and notified to the Central Secretariat has the same status as the official versions. CENELEC

13、 members are the national electrotechnical committees of Austria, Belgium, Czech Republic, Denmark, Finland, France, Germany, Greece, Hungary, Iceland, Ireland, Italy, Luxembourg, Malta, Netherlands, Norway, Portugal, Slovakia, Spain, Sweden, Switzerland and United Kingdom. :2003+A1JuneIncorporating

14、 corrigendum November 2010EN 60664-3:2003 - 2 - Foreword The text of document 109/24/FDIS, future edition 2 of IEC 60664-3, prepared by IEC TC 109, Insulation co-ordination for low-voltage equipment, was submitted to the IEC-CENELEC parallel vote and was approved by CENELEC as EN 60664-3 on 2003-04-

15、01. This European Standard supersedes HD 625.3 S1:1997. The following dates were fixed: latest date by which the EN has to be implemented at national level by publication of an identical national standard or by endorsement (dop) 2004-01-01 latest date by which the national standards conflicting with

16、 the EN have to be withdrawn (dow) 2006-04-01 Annexes designated “normative“ are part of the body of the standard. In this standard, annexes A, B, C and ZA are normative. Annex ZA has been added by CENELEC. _ Endorsement notice The text of the International Standard IEC 60664-3:2003 was approved by

17、CENELEC as a European Standard without any modification. _ Page 2Foreword to amendment A1The text of document 109/79/FDIS, future amendment 1 to IEC 60664-3:2003, prepared by IEC TC 109, Insulation co-ordination for low-voltage equipment, was submitted to the IEC-CENELEC parallel vote and was approv

18、ed by CENELEC as amendment A1 to EN 60664-3:2003 on 2010-06-01. Attention is drawn to the possibility that some of the elements of this document may be the subject of patent rights. CEN and CENELEC shall not be held responsible for identifying any or all such patent rights. The following dates were

19、fixed: latest date by which the amendment has to be implemented at national level by publication of an identical national standard or by endorsement (dop) 2011-03-01 latest date by which the national standards conflicting with the amendment have to be withdrawn (dow) 2013-06-01 Annex ZA has been add

20、ed by CENELEC. _ Endorsement notice The text of amendment 1:2010 to the International Standard IEC 60664-3:2003 was approved by CENELEC as an amendment to the European Standard without any modification. BS EN 60664-3:2003+A1:2010EN 60664-3:2003+A1:2010 (E)60664-3 IEC:2003 3 CONTENTS INTRODUCTION.4 1

21、 Scope.5 2 Normative references .5 3 Definitions 6 4 Design requirements 7 4.1 Principles 7 4.2 Application range regarding environment.7 4.3 Requirements for the types of protection .7 4.4 Dimensioning procedures 8 5 Tests 9 5.1 General .9 5.2 Specimens for testing coatings10 5.3 Specimens for test

22、ing mouldings and potting.10 5.4 Preparation of test specimens .10 5.5 Scratch resistance test 10 5.6 Visual examination 11 5.7 Conditioning of the test specimens 11 5.8 Mechanical and electrical tests after conditioning and electromigration .13 5.9 Additional tests15 Annex A (normative) Test sequen

23、ce 16 Annex B (normative) Technical committees decisions .17 Annex C (normative) Printed wiring board for testing coatings .18 Annex ZA (normative) Normative references to international publications with their corresponding European publications .22 Bibliography24 Figure 1 Scratch resistance test fo

24、r protecting layers.11 Figure C.1 Configuration of the test specimen20 Figure C.2 Configuration of lands and adjacent conductors21 Table 1 Minimum spacings for type 2 protection.9 Table 2 Dry heat conditioning 12 Table 3 Degrees of severities for rapid change of temperature.12 Page 3BS EN 60664-3:20

25、03+A1:2010EN 60664-3:2003+A1:2010 (E)60664-3 IEC:2003 4 INTRODUCTION This part of IEC 60664 details the conditions in which the reduction of clearance and creepage distances can apply to rigid assemblies such as printed boards or terminals of components. Protection against pollution can be achieved

26、by any kind of encapsulation such as coating, potting or moulding. The protection may be applied to one or both sides of the assembly. This standard specifies the insulating properties of the protecting material. Between any two unprotected conductive parts, the clearance and creepage distance requi

27、rements of IEC 60664-1 or IEC 60664-5 apply. This standard refers only to permanent protection. It does not cover assemblies after repair. Technical committees need to consider the influence on the protection of overheated conductors and components, especially under fault conditions, and to decide i

28、f any additional requirements are necessary. Safe performance of assemblies is dependent upon a precise and controlled manufacturing process for the application of the protective system. Requirements for quality control, e.g. by sampling tests, should be considered by technical committees. Page 4BS

29、EN 60664-3:2003+A1:2010EN 60664-3:2003+A1:2010 (E)60664-3 IEC:2003 5 INSULATION COORDINATION FOR EQUIPMENT WITHIN LOW-VOLTAGE SYSTEMS Part 3: Use of coating, potting or moulding for protection against pollution 1 Scope This part of IEC 60664 applies to assemblies protected against pollution by the u

30、se of coating, potting or moulding, thus allowing a reduction of clearance and creepage distances as described in Part 1 or Part 5. NOTE 1 When reference is made to Part 1 or Part 5, IEC 60664-1 or IEC 60664-5 are meant. This standard describes the requirements and test procedures for two methods of

31、 protection: type 1 protection improves the microenvironment of the parts under the protection; type 2 protection is considered to be similar to solid insulation. This standard also applies to all kinds of protected printed boards, including the surface of inner layers of multi-layer boards, substra

32、tes and similarly protected assemblies. In the case of multi-layer printed boards, the distances through an inner layer are covered by the requirements for solid insulation in Part 1. NOTE 2 Examples of substrates are hybrid integrated circuits and thick-film technology. This standard refers only to

33、 permanent protection. It does not cover assemblies that are subjected to mechanical adjustment or repair. The principles of this standard are applicable to functional, basic, supplementary and reinforced insulation. 2 Normative references Page 5IEC 60068-2-1:2007, Environmental testing Part 2-1: Te

34、sts Test A: Cold IEC 60068-2-2:2007, Environmental testing Part 2-2: Tests Test B: Dry heat IEC 60068-2-14:2009, Environmental testing Part 2-14: Tests Test N: Change of temperature IEC 60068-2-78:2001, Environmental testing Part 2-78: Tests Test Cab: Damp heat, steady state IEC 60454-3-1:1998, Pres

35、sure-sensitive adhesive tapes for electrical purposes Part 3: Specifications for individual materials Sheet 1: PVC film tapes with pressure- sensitive adhesive Amendment 1 (2001) IEC 60664-1:2007, Insulation coordination for equipment within low-voltage systems Part 1: Principles, requirements and t

36、ests!“BS EN 60664-3:2003+A1:2010EN 60664-3:2003+A1:2010 (E)IEC 60326-2:1990, Printed boards Part 2: Test methods Amendment 1 (1992)3 Definitions For the purposes of this document, the definitions given in IEC 60664-1 as well as the following definitions apply. 3.1 base material insulating material u

37、pon which a conductive pattern may be formed NOTE The base material may be rigid or flexible, or both. It may be a dielectric or an insulated metal sheet. (IEC 60194, definition 40.1334) 3.2 printed board general term for completely processed printed circuit and printed wiring configurations NOTE Th

38、is includes single-sided, double-sided and multilayer boards with rigid, flexible, and rigid-flex base materials (IEC 60194, definition 60.1485) 3.3 conductor single conductive path in a conductive pattern (IEC 60194, definition 22.0251) 3.4 protection any kind of measure which reduces the influence

39、 of the environment 1)To be published. Page 6IEC 61189-2:2006, Test methods for electrical materials, printed boards and other interconnection structures and assemblies Part 2:Test methods for materials for interconnection structures IEC 61189-3:2007, Test methods for electrical materials, printed b

40、oards and other interconnection structures and assemblies Part 3: Test methods for interconnection structures (printed boards) IEC 61249-2 (all Parts 2) Materials for printed boards and other interconnecting structures Reinforced base materials, clad and unclad IEC Guide 104:2004, The preparation of

41、 safety publications and the use of basic safety publications and group safety publications IEC 60664-5:2007, Insulation coordination for equipment within low-voltage systems Part 5: Comprehensive method for determining clearances and creepage distances equal to or less than 2 mm !“BS EN 60664-3:200

42、3+A1:2010EN 60664-3:2003+A1:2010 (E)60664-3 IEC:2003 7 3.5 coating insulating material such as varnish or dry film laid on the surface of the assembly NOTE Coating and base material of a printed board form an insulating system that may have properties similar to solid insulation. 3.6 solid insulatio

43、n solid insulating material interposed between two conductive parts NOTE In the case of a printed board with a coating, solid insulation consists of the board itself as well as the coating. In other cases, solid insulation consists of the encapsulating material. 3.7 spacing any combination of cleara

44、nces, creepage distances and insulation distances through insulation 4 Design requirements 4.1 Principles Dimensioning of spacings between conductors depends on the type of protection used. When type 1 protection is used, dimensioning of clearances and creepage distances shall follow the requirement

45、s of Part 1 or Part 5. If the requirements of this standard are met, pollution degree 1 applies under the protection. When type 2 protection is used, spacings between conductive parts shall meet the requirements and tests for solid insulation of Part 1 and their dimensions shall not be less than the

46、 minimum clearances specified in Part 1 or Part 5 for homogeneous field conditions. 4.2 Application range regarding environment The design requirements are applicable in all microenvironments. Stresses such as temperature, chemical, mechanical or those listed in 5.3.2.4 of Part 1 Absorption of humid

47、ity by the protective material shall not impair the insulation properties of the parts being protected. NOTE Absorption of humidity can be checked by an insulation resistance measurement under humid conditions. 4.3 Requirements for the types of protection Protection is achieved in the following ways

48、: type 1 protection improves the microenvironment of the parts under the protection. The clearance and creepage distance requirements of Part 1 or Part 5 for pollution degree 1 apply under the protection. Between two conductive parts, it is a requirement that one or both conductive parts, together w

49、ith all the spacings between them, are covered by the protection; Page 7! “shall be taken into account when the protective material is selected. BS EN 60664-3:2003+A1:2010EN 60664-3:2003+A1:2010 (E)60664-3 IEC:2003 8 type 2 protection is considered to be similar to solid insulation. Under the protection, the requirements for solid insulation specified in Part 1 are applicable and the spacings shall be not less than those specified in Ta