DLA SMD-5962-94758 REV H-2013 MICROCIRCUIT DIGITAL SERIAL MICROCODED MULTI-MODE INTELLIGENT TERMINAL SILICON.pdf

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1、 REVISIONS LTR DESCRIPTION DATE (YR-MO-DA) APPROVED A Add device types 04, 05, and 06. Editorial changes throughout. 96-01-17 Monica L. Poelking B Add device types 07, 08, and 09. Update boilerplate. Editorial changes throughout. - TVN 99-04-12 Monica L. Poelking C Changes in accordance with NOR 596

2、2-R002-01. - TVN 00-12-21 Thomas M. Hess D Update the boilerplate in accordance with the requirements of MIL-PRF-38535. TVN 01-04-11 Thomas M. Hess E Update boilerplate to current MIL-PRF-38535 requirements. CFS 07-07-30 Thomas M. Hess F Update case outline Y package dimension A and A1 in figure 1 o

3、f Quad flat pack for device types 07, 08 and 09. - MAA 11-02-01 David Corbett G Update values of tWP2, tRDYL1, tRDYL2, in table I, per GIDEP# GB4-C-12-0005. - PHN 12-04-17 Thomas M. Hess H Correct dimensions A, D, and E for case outline X, Figure 1. Update boilerplate to current MIL-PRF-38535 requir

4、ements. - PHN 13-03-04 Thomas M. Hess REV H H H H SHEET 35 36 37 38 REV H H H H H H H H H H H H H H H H H H H H SHEET 15 16 17 18 19 20 21 22 23 24 25 26 27 28 29 30 31 32 33 34 REV STATUS OF SHEETS REV H H H H H H H H H H H H H H SHEET 1 2 3 4 5 6 7 8 9 10 11 12 13 14 PMIC N/A PREPARED BY Thomas M.

5、 Hess DLA LAND AND MARITIME COLUMBUS, OHIO 43218-3990 http:/www.landandmaritime.dla.mil STANDARD MICROCIRCUIT DRAWING THIS DRAWING IS AVAILABLE FOR USE BY ALL DEPARTMENTS AND AGENCIES OF THE DEPARTMENT OF DEFENSE AMSC N/A CHECKED BY Thomas M. Hess APPROVED BY Monica L. Poelking MICROCIRCUIT, DIGITAL

6、, SERIAL MICROCODED MULTI-MODE INTELLIGENT TERMINAL, SILICON DRAWING APPROVAL DATE 95-03-28 REVISION LEVEL H SIZE A CAGE CODE 67268 5962-94758 SHEET 1 OF 38 DSCC FORM 2233 APR 97 5962-E281-13 Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-STANDARD M

7、ICROCIRCUIT DRAWING DLA LAND AND MARITIME COLUMBUS, OHIO 43218-3990 SIZE A 5962-94758 REVISION LEVEL H SHEET 2 DSCC FORM 2234 APR 97 1. SCOPE 1.1 Scope. This drawing documents two product assurance class levels consisting of high reliability (device classes Q) and space application (device class V).

8、 A choice of case outlines and lead finishes are available and are reflected in the Part or Identifying Number (PIN). When available, a choice of Radiation Hardness Assurance (RHA) levels is reflected in the PIN. 1.2 PIN. The PIN is as shown in the following example: 5962 - 94758 01 Q X X Federal RH

9、A Device Device Case Lead stock class designator type class outline finish designator (see 1.2.1) (see 1.2.2) designator (see 1.2.4) (see 1.2.5) / (see 1.2.3) / Drawing number 1.2.1 RHA designator. Device classes Q and V RHA marked devices meet the MIL-PRF-38535 specified RHA levels and are marked w

10、ith the appropriate RHA designator. A dash (-) indicates a non-RHA device. 1.2.2 Device types. The device types identify the circuit function as follows: Device type Generic number Circuit function 01 69151XT15 Serial microcoded monolithic multi-mode intelligent terminal with +5 V/-15 V operation 02

11、 69151XT5 Serial microcoded monolithic multi-mode intelligent terminal with +5 V operation 03 69151XT12 Serial microcoded monolithic multi-mode intelligent terminal with +5 V/-12 V operation 04 69151XTE15 Enhanced serial microcoded monolithic multi-mode intelligent terminal with +5 V/-15V operation

12、05 69151XTE5 Enhanced serial microcoded monolithic multi-mode intelligent terminal with +5 V operation 06 69151XTE12 Enhanced, serial microcoded monolithic multi-mode intelligent terminal with +5 V/-12V operation 07 69151XTE15 Enhanced, serial microcoded monolithic multi-mode intelligent terminal wi

13、th +5 V/-15V operation 08 69151XTE5 Enhanced, serial microcoded monolithic multi-mode intelligent terminal with +5 V operation 09 69151XTE12 Enhanced, serial microcoded monolithic multi-mode intelligent terminal with +5 V/-12V operation 1.2.3 Device class designator. The device class designator is a

14、 single letter identifying the product assurance level as follows: Device class Device requirements documentation Q or V Certification and qualification to MIL-PRF-38535 Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-STANDARD MICROCIRCUIT DRAWING DL

15、A LAND AND MARITIME COLUMBUS, OHIO 43218-3990 SIZE A 5962-94758 REVISION LEVEL H SHEET 3 DSCC FORM 2234 APR 97 1.2.4 Case outlines. The case outlines are as designated in MIL-STD-1835 and as follows: Outline letter Descriptive designator Terminals Package style X See figure 1 139 Pin grid array Y Se

16、e figure 1 140 Quad flat pack 1.2.5 Lead finish. The lead finish is as specified in MIL-PRF-38535 for device classes Q and V or MIL-PRF-38535. 1.3 Absolute maximum ratings. 1/ Storage temperature range (TSTG) -65C to +150C Operating case temperature range (TC) -55C to +125C Transceiver supply voltag

17、e (VEE): Device types 01, 03, 04, 06, 07, 09 -22 V dc Transceiver supply voltage range (VCC): Device types 02, 05, 08 -0.3 V dc to +7.0 V dc Logic supply voltage range (VDD) . -0.3 V dc to +7.0 V dc Input voltage range (receiver) (VDR): Device types 01, 03, 04, 06, 07, 09 42 VP,L-LDevice types 02, 0

18、5, 08 10 VP,L-LMaximum power dissipation (PD) . 5 W Logic voltage on any pin range (VI/O) . -0.3 V dc to VDD+ 0.3 V dc Logic latch-up immunity (ILU) . 150 mA Logic input current (II) . 10 mA Peak output current (transmitter) (IO): Device types 01, 03, 04, 06, 07, 09 190 mA Device types 02, 05, 08 10

19、00 mA Maximum junction temperature (TJ): Device types 01, 03, 04, 06, 07, 09 +150C Device types 02, 05, 08 +135C Receiver common mode input voltage range (VIC): Device types 01, 03, 04, 06, 07, 09 -11 V dc to +11 V dc Device types 02, 05, 08 -5 V dc to +5 V dc Lead temperature (soldering, 5 seconds)

20、 +300C Thermal resistance junction-to-case (JC): 2/ Cases X and Y 7C/W _ 1/ Stresses above the absolute maximum rating may cause permanent damage to the device. These are stress ratings only, and functional operation of the device at these or any other conditions beyond limits indicated in the opera

21、tional sections of this specification is not recommended. Extended operation at the maximum levels may degrade performance and affect reliability. 2/ Mounting in accordance with MIL-STD-883, method 1012. Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-

22、,-STANDARD MICROCIRCUIT DRAWING DLA LAND AND MARITIME COLUMBUS, OHIO 43218-3990 SIZE A 5962-94758 REVISION LEVEL H SHEET 4 DSCC FORM 2234 APR 97 1.4 Recommended operating conditions. Transceiver supply voltage range (VCC): Device types 01, 03, 04, 06, 07, 09 +4.75 V dc to +5.5 V dc Device types 02,

23、05, 08 +4.5 V dc to +5.5 V dc Logic supply voltage range (VDD) +4.5 V dc to +5.5 V dc Transceiver supply voltage range (VEE): Device types 01, 04, 07 -15 V dc 5% Device types 03, 06, 09 -12 V dc 5% Receiver differential voltage (VDR): Device types 01, 03, 04, 06, 07, 09 40 VP-PDevice types 02, 05, 0

24、8 8.0 VP-PLogic dc input voltage range (VIN) 0 V dc to VDDReceiver common mode input voltage (VIC): Device types 01, 03, 04, 06, 07, 09 10 V dc Device types 02, 05, 08 5.0 V dc Driver peak output current (IO): Device types 01, 03, 04, 06, 07, 09 180 mA Device types 02, 05, 08 700 mA Serial data rate

25、 range (SD) 0 to 1 MHz Clock duty cycle (DC) 50 5% Case operating temperature range (TC) -55C to +125C Operating frequency (FIN) . 24 MHz 0.01% 1.5 Digital logic testing for device classes Q and V. Fault coverage measurement of manufacturing logic tests (MIL-STD-883, method 5012) 95.12 percent 2. AP

26、PLICABLE DOCUMENTS 2.1 Government specification, standards, and handbooks. The following specification, standards, and handbooks form a part of this drawing to the extent specified herein. Unless otherwise specified, the issues of these documents are those cited in the solicitation or contract. DEPA

27、RTMENT OF DEFENSE SPECIFICATION MIL-PRF-38535 - Integrated Circuits, Manufacturing, General Specification for. DEPARTMENT OF DEFENSE STANDARDS MIL-STD-883 - Test Methods and Procedures for Microelectronics. MIL-STD-1835 - Interface Standard Electronic Component Case Outlines. DEPARTMENT OF DEFENSE H

28、ANDBOOKS MIL-HDBK-103 - List of Standard Microcircuit Drawings. MIL-HDBK-780 - Standard Microcircuit Drawings. MIL-HDBK-1553 - Multiplex Application Handbook. (Copies of these documents are available online at https:/assist.daps.dla.mil/quicksearch/ or from the Standardization Document Order Desk, 7

29、00 Robbins Avenue, Building 4D, Philadelphia, PA 19111-5094). 2.2 Non-Government publications. The following document(s) form a part of this document to the extent specified herein. Unless otherwise specified, the issues of the documents are the issues of the documents cited in the solicitation or c

30、ontract. Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-STANDARD MICROCIRCUIT DRAWING DLA LAND AND MARITIME COLUMBUS, OHIO 43218-3990 SIZE A 5962-94758 REVISION LEVEL H SHEET 5 DSCC FORM 2234 APR 97 IEEE - THE INSTITUTE OF ELECTRICAL AND ELECTRONICS

31、 ENGINEERS (IEEE) IEEE Standard 1149.1 - IEEE Standard Test Access Port and Boundary Scan Architecture. (Copies of these documents are available online at http:/www.ieee.org or from the IEEE Service Center, 445 Hoes Lane, P.O. Box 1331, Piscataway, NJ 088551331). 2.3 Order of precedence. In the even

32、t of a conflict between the text of this drawing and the references cited herein, the text of this drawing takes precedence. Nothing in this document, however, supersedes applicable laws and regulations unless a specific exemption has been obtained. 3. REQUIREMENTS 3.1 Item requirements. The individ

33、ual item requirements for device classes Q and V shall be in accordance with MIL-PRF-38535 and as specified herein or as modified in the device manufacturers Quality Management (QM) plan. The modification in the QM plan shall not affect the form, fit, or function as described herein. 3.2 Design, con

34、struction, and physical dimensions. The design, construction, and physical dimensions shall be as specified in MIL-PRF-38535 and herein for device classes Q and V. 3.2.1 Case outlines. The case outlines shall be in accordance with 1.2.4 herein and figure 1. 3.2.2 Terminal connections. The terminal c

35、onnections shall be as specified on figure 2. 3.2.3 Block diagram. The block diagram shall be as specified on figure 3. 3.2.4 Boundary scan instruction codes. The boundary scan instruction codes shall be as specified on figure 4. 3.2.5 Timing waveforms. The timing waveforms shall be as specified on

36、figure 5. 3.2.6 Radiation exposure circuit. The radiation exposure circuit shall be maintained by the manufacturer under document revision level control and shall be made available to the preparing and acquiring activity upon request. 3.3 Electrical performance characteristics and postirradiation pa

37、rameter limits. Unless otherwise specified herein, the electrical performance characteristics and postirradiation parameter limits are as specified in table I and shall apply over the full case operating temperature range. 3.4 Electrical test requirements. The electrical test requirements shall be t

38、he subgroups specified in table II. The electrical tests for each subgroup are defined in table I. 3.5 Marking. The part shall be marked with the PIN listed in 1.2 herein. In addition, the manufacturers PIN may also be marked. For packages where marking of the entire SMD PIN number is not feasible d

39、ue to space limitations, the manufacturer has the option of not marking the “5962-“ on the device. For RHA product using this option, the RHA designator shall still be marked. Marking for device classes Q and V shall be in accordance with MIL-PRF-38535. 3.5.1 Certification/compliance mark. The certi

40、fication mark for device classes Q and V shall be a “QML“ or “Q“ as required in MIL-PRF-38535. 3.6 Certificate of compliance. For device classes Q and V, a certificate of compliance shall be required from a QML-38535 listed manufacturer in order to supply to the requirements of this drawing (see 6.6

41、.1 herein). The certificate of compliance submitted to DLA Land and Maritime -VA prior to listing as an approved source of supply for this drawing shall affirm that the manufacturers product meets, for device classes Q and V, the requirements of MIL-PRF-38535 and herein. 3.7 Certificate of conforman

42、ce. A certificate of conformance as required for device classes Q and V in MIL-PRF-38535 shall be provided with each lot of microcircuits delivered to this drawing. 3.11 IEEE 1149.1 compliance. Theses devices shall be compliant to IEEE 1149.1. Provided by IHSNot for ResaleNo reproduction or networki

43、ng permitted without license from IHS-,-,-STANDARD MICROCIRCUIT DRAWING DLA LAND AND MARITIME COLUMBUS, OHIO 43218-3990 SIZE A 5962-94758 REVISION LEVEL H SHEET 6 DSCC FORM 2234 APR 97 TABLE I. Electrical performance characteristics. Test Symbol Test conditions 1/ -55C TC +125C 4.5 V VDD 5.5 V unles

44、s otherwise specified Device type Group A subgroups Limits Unit Min Max Low level input voltage VIL1All 1, 2, 3 0.8 V Low level input voltage, TCK only VIL201, 02 03, 04 05, 06 1, 2, 3 0.8 07, 08 09 1, 2, 3 0.7 High level input voltage VIHAll 1, 2, 3 2.2 V Low level input voltage 2/ VILCAll 1, 2, 3

45、0.3 VDDV High level input voltage 2/ VIHCAll 1, 2, 3 0.7 VDDV Low level output voltage VOLIOL= 4.0 mA All 1, 2, 3 0.4 V IOL= 1.0 A 3/ 0.05 High level output voltage VOHIOH= 4.0 mA All 1, 2, 3 2.4 V IOH= 1.0 A 3/ VDD-0.05 Input leakage current IINTTL inputs VIN= VDD or VSSAll 1, 2, 3 -10 +10 A Inputs

46、 with pull- up resistors VIN= VDDAll 1, 2, 3 -10 +10 VIN= VSS01, 02 03, 04 05, 06 -900 -150 07, 08 09 -167 -27 Three-state output leakage current, TTL loaded outputs, single-drive buffer IOZVO= VDDor VSSAll 1, 2, 3 -10 +10 A Short-circuit output current, TTL outputs, single-drive buffer IOS4/ 5/ VDD

47、= 5.5 V, VO= 0 V VDD= 5.5 V, VO= VDDAll 1, 2, 3 -100 +100 mA Input capacitance CINf = 1 MHz at 0 V See 4.4.1c All 4 45 pF Output capacitance COUTAll 4 45 Bidirectional capacitance 6/ CIOAll 4 45 Quiescent current 7/ IDDQf = 0 MHz 01, 02 03 1, 2, 3 10 mA 04, 05 06 15 07, 08, 09 20 See footnotes at en

48、d of table. Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-STANDARD MICROCIRCUIT DRAWING DLA LAND AND MARITIME COLUMBUS, OHIO 43218-3990 SIZE A 5962-94758 REVISION LEVEL H SHEET 7 DSCC FORM 2234 APR 97 TABLE I. Electrical performance characteristics - Continued. Test Symbol Test conditions 1/ -55C TC +125C 4.5 V VDD 5.5 V unless otherwise specified Device type Group A subgroups Limits Unit Min Max Standby operating current IDDSf = 24 MHz 01, 02 03, 04 05, 06 1, 2, 3 8