DLA SMD-5962-91732-1993 MICROCIRCUIT DIGITAL HIGH-SPEED CMOS 3-TO-8 LINE DECODER DEMULTIPLEXOR TTL COMPATIBLE MONOLITHIC SILICON《硅单块 晶体管-晶体管逻辑电路兼容 3到8线译码器或光学多路分解器 高速互补金属氧化物半导体 数字微型.pdf
《DLA SMD-5962-91732-1993 MICROCIRCUIT DIGITAL HIGH-SPEED CMOS 3-TO-8 LINE DECODER DEMULTIPLEXOR TTL COMPATIBLE MONOLITHIC SILICON《硅单块 晶体管-晶体管逻辑电路兼容 3到8线译码器或光学多路分解器 高速互补金属氧化物半导体 数字微型.pdf》由会员分享,可在线阅读,更多相关《DLA SMD-5962-91732-1993 MICROCIRCUIT DIGITAL HIGH-SPEED CMOS 3-TO-8 LINE DECODER DEMULTIPLEXOR TTL COMPATIBLE MONOLITHIC SILICON《硅单块 晶体管-晶体管逻辑电路兼容 3到8线译码器或光学多路分解器 高速互补金属氧化物半导体 数字微型.pdf(19页珍藏版)》请在麦多课文档分享上搜索。
1、W 9999996 0091475 255 W LTR DESCRIPTION DATE (YR-MO-DA) APPROVED REV SHEET 15 16 17 REV STATUS OF SHEETS PMIC NIA STANDARDIZED MILITARY DRAWING THIS DRAWING IS AVAILABLE FOR USE BY ALL DEPARTMENTS AND AGENCIES OF THE DEPARTMENT OF DEFENSE AMSC NIA REV I I I SHEET 123 PREPARED BY Wanda L. Meadows CHE
2、CKED BY Thomas J. Ricciuti APPROVED BY Monica L. Poelking DRAWING APPROVAL DATE 93-03-31 REVISION LEVEL DEFENSE ELECTRONICS SUPPLY CENTER DAYTON, OHIO 45444 MICROCIRCUIT, DIGITAL, HIGH-SPEED DEMULTIPLEXOR, TTL COMPATIBLE, MONOLITHIC SILICON CMOS, 3-TO-8 LINE DECODER/ I SIZE ICAGE CODE A 67268 5962-9
3、1732 SHEET ? OF 18 DESC FORM 193 JUL 91 DISTRIBUTION STATEMENT A. Approved for public release; distribution is unlimited. 5962-E686-92 Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-= 999999b O093476 193 D STANDARDIZED MILITARY DRAWING DEFENSE ELECT
4、RONICS SUPPLY CENTER DAYTON, OHIO 45444 I 1. SCOPE 1.1 Scope. This drawing forms a part of a one part - one part number documentation system (see 6.6 herein). Two product assurance classes consisting of military high reliability (device classes B, Q, and M) and space application (device classes S an
5、d VI, and a choice of case outlines and lead finishes are available and are reflected in the Part or Identifying Number (PIN). Device class M microcircuits represent non-JAN class B microcircuits in accordance with 1.2.1 of MIL-STD-883, “Provisions for the use of MIL-STD-883 in conjunction with comp
6、liant non-JAN devices“. available, a choice of Radiation Hardness Assurance (RHAI levels are reflected in the PIN. When 5962-91732 SIZE A REVISION LEVEL SHEET I 1.2 m. The PIN shall be as shown in the following example: - X - o1 M E I I I I I 91 732 - 5962 I I I I l I I Lead finish Case Devi ce Devi
7、 ce -1 Federal RHA stock class designator type class outline designator (see 1.2.1) (see 1.2.2) designator (see 1.2.4) (see 1.2.5) / (see 1.2.3) / Drawing number 1.2.1 RHA designator. Device classes M, 6, and S RHA marked devices shall meet the MIL-il-38510 specified RHA Levels and shall be marked w
8、ith the appropriate RHA designator. the MIL-1-38535 specified RHA levels and shall be marked with the appropriate RHA designator. non-RHA device. Device classes Q and V RHA marked devices shall meet A dash (-1 indicates a 1.2.2 Device type(s). The device type(s) shall identify the circuit function a
9、s follows: Device type Generic number Circuit function o1 54HCT137 3-to-8 line decoder/demultiplexor with address latches, TTL compatible inputs 1.2.3 Device class designator. The device class designator chat1 be a single letter identifying the product assurance level as follows: Device class Device
10、 requirements documentation M Vendor self-certification to the requirements for non-JAN class 6 microcircuits in accordance with 1.2.1 of MIL-STD-883 EI or S Q or v Cert i f i cat ion and qua li f i cat ion to MIL-M-38510 Certification and qualification to MIL-1-38535 1.2.4 Case outline(s). The case
11、 outline(s1 shall be as designated in MIL-STD-1835 and as follows: Outline letter Descriptive designator Termi na 1s Packaae style E 2 GDIPI-TI6 or CDIP2-Tl6 16 CQCCI-N20 20 Dua 1-i n- li ne Square leadless chip carrier 1.2.5 Lead finish. The lead finish shall be as specified in MIL-M-38510 for clas
12、ses M, 8, and S or MIL-1-38535 for classes Q and V. Finish letter “X“ shall not be marked on the microcircuit or its packaging. The “X“ designation is I for use in specifications when lead finishes A, B, and C are considered acceptable and interchangeable without preference. _. DESC FORM 193A JUL 91
13、 Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-9 9999996 009L477 028 STANDARDIZED MILITARY DRAWING I DEFENSE ELECTRONICS SUPPLY CENTER 1.3 Absolute maximum ratings. I/ 21 3/ SIZE 5962-91732 A Supply voltage range (V c) DC output voltage range (Vo T
14、) DC input clamp current (iI$ (vI vCc) DC output clamp current (IOK) No Vcc) DC output current, per output (IOUT) (V UT = O to Vcc) (per output) DC Vcc or ground current (Icc or IGND) ?per pin) . Maximum power dissipation (PD) Storage temperature range (TS c) . Lead temperature (soldering, JO second
15、s) . Thermal resistance, junction-to-case (OJc) Case operating temperature range (TC) 1.4 Recommended operating conditions. I/ 2/ 3/ DC input voltage range FVIN) . . Junction temperature (TJ) Supply voltage range Wee) Input voltage range Output voltage range . Case operating temperature range (TC) M
16、aximum Low level input voltage (VIL) Minimum high level input voltage (VIH) Input rise and fall times range Ctr, tf) (0.1 to 0.9VIN, 0.9 to O.lVIN) . Maximum high level output current (I ) . Maximum tow level output current (127 I . -0.5 V dc to +7.0 V dc -0.5 V dc to Vcc + 0.5 V dc -0.5 V dc to Vcc
17、 + 0.5 V dc I20 mA i20 mA *25 mA 150 mA 500 mw s/ -65C to +150C +3oO0c See MIL-STD-1835 t175“C -55C to +125“C 4.5 V dc to 5.5 V dc 0.0 V dc to Vcc 0.0 V dc to V sc -55OC to +I25 C 0.8 v dc 2.0 V dc O to 500 ns -4 mh +4 ah 1.5 Digital loqic testing for device classes Q and V. Fault coverage measureme
18、nt of manufacturing logic tests (MIL-STD-883, test method 5012) 5/ percent - I- - l/ Stresses above the absolute maximum rating may cause permanent damage to the device. maximum levels may degrade performance and affect reliability. for allowable short duration burn-in screening conditions in accord
19、ance with method 5004 of MIL-STO-883. - 2/ Unless otherwise specified, all voltages are referenced to GND. - 31 The limits for the parameters specified herein shall apply over the full specified Vcc range and case temperature range of -55OC to +12SoC. - 4/ For TC = +lOOC to +125“C, derate linearty a
20、t I1 mW/“C. - 51 Velues will be added when they become available. Extended operation at the The maximum junction temperature may be exceeded DAYTON, OHIO 45444 I REVISION LEVEL I SHEET DESC FORM 193A JUL 91 Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS
21、-,-,-= 99997b 0093478 Tb4 STANDARDIZED SIZE MILITARY DRAWING A DEFENSE ELECTRONICS SUPPLY CENTER DAYTON, OHIO 45444 REVISION LEVEL 2. APPLICABLE DOCUMENTS 2.1 Government specifications, standards, bulletin, and handbook. Unless otherwise specified, the following specifications, standards, bulletin,
22、and handbook of the issue listed in that issue of the Department of Defense Index of Specifications and Standards specified in the solicitation, form a part of this drawing to the extent specified 5962-91732 SHEET 4 herein. SPECIFICATIONS I DESC FORM 193A JUL 91 Provided by IHSNot for ResaleNo repro
23、duction or networking permitted without license from IHS-,-,-m 9999996 009l11179 9TO STANDARDIZED MI LI TARY DRAWING DEFENSE ELECTRONICS SUPPLY CENTER DAYTON, OHIO 45444 3. REQUIREMENTS 3.7 The individual item requirements for device class M shall be in accordance with 1.2.1 Of MIL-CTD-883, “Provisi
24、ons for the use of MIL-STD-883 in conjunction with compliant non-JAN devices and as specified herein. The individual item requirements for device classes 6 and S shall be in accordance with MIL-M-38510 and as specified herein. included in this SMD. MIL-1-38535, the device manufacturers Quality Manag
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