DLA SMD-5962-90616 REV B-2012 MICROCIRCUIT DIGITAL BIPOLAR ADVANCED LOW-POWER SCHOTTKY TTL 10-BIT BUS INTERFACE FLIP-FLOPS WITH 3-STATE OUTPUTS MONOLITHIC SILICON.pdf
《DLA SMD-5962-90616 REV B-2012 MICROCIRCUIT DIGITAL BIPOLAR ADVANCED LOW-POWER SCHOTTKY TTL 10-BIT BUS INTERFACE FLIP-FLOPS WITH 3-STATE OUTPUTS MONOLITHIC SILICON.pdf》由会员分享,可在线阅读,更多相关《DLA SMD-5962-90616 REV B-2012 MICROCIRCUIT DIGITAL BIPOLAR ADVANCED LOW-POWER SCHOTTKY TTL 10-BIT BUS INTERFACE FLIP-FLOPS WITH 3-STATE OUTPUTS MONOLITHIC SILICON.pdf(11页珍藏版)》请在麦多课文档分享上搜索。
1、 REVISIONS LTR DESCRIPTION DATE (YR-MO-DA) APPROVED A Update to reflect latest changes in format and requirements. Editorial changes throughout. -les 04-08-25 Raymond Monnin B Update drawing as part of 5 year review. -jt 12-06-25 C. SAFFLE THE ORIGINAL FIRST PAGE OF THIS DRAWING HAS BEEN REPLACED. R
2、EV SHEET REV SHEET REV STATUS REV B B B B B B B B B B OF SHEETS SHEET 1 2 3 4 5 6 7 8 9 10 PMIC N/A PREPARED BY Larry T. Gauder DLA LAND AND MARITIME COLUMBUS, OHIO 43218-3990 http:/www.landandmaritime.dla.mil STANDARD MICROCIRCUIT DRAWING THIS DRAWING IS AVAILABLE FOR USE BY ALL DEPARTMENTS AND AGE
3、NCIES OF THE DEPARTMENT OF DEFENSE CHECKED BY Tim H. Noh APPROVED BY William K. Heckman MICROCIRCUIT, DIGITAL, BIPOLAR, ADVANCED LOW-POWER SCHOTTKY, TTL, 10-BIT BUS INTERFACE FLIP-FLOPS WITH 3-STATE OUTPUTS, MONOLITHIC SILICON DRAWING APPROVAL DATE 90-05-15 AMSC N/A REVISION LEVEL B SIZE A CAGE CODE
4、 67268 5962-90616 SHEET 1 OF 10 DSCC FORM 2233 APR 97 5962-E340-12 Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-STANDARD MICROCIRCUIT DRAWING SIZE A 5962-90616 DLA LAND AND MARITIME COLUMBUS, OHIO 43218-3990 REVISION LEVEL B SHEET 2 DSCC FORM 2234
5、 APR 97 1. SCOPE 1.1 Scope. This drawing describes device requirements for MIL-STD-883 compliant, non-JAN class level B microcircuits in accordance with MIL-PRF-38535, appendix A. 1.2 Part or Identifying Number (PIN). The complete PIN is as shown in the following example: 5962-90616 01 L A Drawing n
6、umber Device type (see 1.2.1) Case outline (see 1.2.2) Lead finish (see 1.2.3) 1.2.1 Device type. The device type identifies the circuit function as follows: Device type Generic number Circuit function 01 54ALS29821 10-bit bus interface flip-flops with 3-state outputs 1.2.2 Case outlines. The case o
7、utlines are as designated in MIL-STD-1835 and as follows: Outline letter Descriptive designator Terminals Package style L GDIP3-T24 or CDIP4-T24 24 dual-in-line 1.2.3 Lead finish. The lead finish is as specified in MIL-PRF-38535, appendix A. 1.3 Absolute maximum ratings. Supply voltage (VCC) -0.5 V
8、dc to +7.0 V dc Input voltage range . -1.2 V dc at 18 mA to +5.5 V dc Voltage applied to a disabled 3-state output . -0.5 V dc to +5.5 V dc Storage temperature range -65C to +150C Continuous power dissipation (PD) 632.5 mW 1/ Lead temperature (soldering, 10 seconds) +300C Junction temperature (TJ) +
9、175C Thermal resistance, junction-to-case (JC) . See MIL-STD-1835 1.4 Recommended operating conditions. Supply voltage range (VCC) +4.5 V dc minimum to +5.5 V dc maximum Minimum high level input voltage (VIH) . 2.0 V dc Maximum low level input voltage (VIL) . 0.8 V dc Maximum high level output curre
10、nt (IOH) -18 mA Maximum low level output current (IOL) 32 mA Case operating temperature range (TC) . -55C to +125C _ 1/ Maximum power dissipation is defined as VCCX ICC, and must withstand the added PDdue to short circuit output test e.g., IOS. Provided by IHSNot for ResaleNo reproduction or network
11、ing permitted without license from IHS-,-,-STANDARD MICROCIRCUIT DRAWING SIZE A 5962-90616 DLA LAND AND MARITIME COLUMBUS, OHIO 43218-3990 REVISION LEVEL B SHEET 3 DSCC FORM 2234 APR 97 2. APPLICABLE DOCUMENTS 2.1 Government specification, standards, and handbooks. The following specification, stand
12、ards, and handbooks form a part of this drawing to the extent specified herein. Unless otherwise specified, the issues of these documents are those cited in the solicitation or contract. DEPARTMENT OF DEFENSE SPECIFICATION MIL-PRF-38535 - Integrated Circuits, Manufacturing, General Specification for
13、. DEPARTMENT OF DEFENSE STANDARDS MIL-STD-883 - Test Method Standard Microcircuits. MIL-STD-1835 - Interface Standard Electronic Component Case Outlines. DEPARTMENT OF DEFENSE HANDBOOKS MIL-HDBK-103 - List of Standard Microcircuit Drawings. MIL-HDBK-780 - Standard Microcircuit Drawings. (Copies of t
14、hese documents are available online at https:/assist.dla.mil/quicksearch/ or from the Standardization Document Order Desk, 700 Robbins Avenue, Building 4D, Philadelphia, PA 19111-5094.) 2.2 Order of precedence. In the event of a conflict between the text of this drawing and the references cited here
15、in, the text of this drawing takes precedence. Nothing in this document, however, supersedes applicable laws and regulations unless a specific exemption has been obtained. 3. REQUIREMENTS 3.1 Item requirements. The individual item requirements shall be in accordance with MIL-PRF-38535, appendix A fo
16、r non-JAN class level B devices and as specified herein. Product built to this drawing that is produced by a Qualified Manufacturer Listing (QML) certified and qualified manufacturer or a manufacturer who has been granted transitional certification to MIL-PRF-38535 may be processed as QML product in
17、 accordance with the manufacturers approved program plan and qualifying activity approval in accordance with MIL-PRF-38535. This QML flow as documented in the Quality Management (QM) plan may make modifications to the requirements herein. These modifications shall not affect form, fit, or function o
18、f the device. These modifications shall not affect the PIN as described herein. A “Q“ or “QML“ certification mark in accordance with MIL-PRF-38535 is required to identify when the QML flow option is used. 3.2 Design, construction, and physical dimensions. The design, construction, and physical dimen
19、sions shall be as specified in MIL-PRF-38535, appendix A and herein. 3.2.1 Case outlines. The case outlines shall be in accordance with 1.2.2 herein. 3.2.2 Terminal connections. The terminal connections shall be as specified on figure 1. 3.2.3 Truth table. The truth table shall be as specified on fi
20、gure 2. 3.2.4 Test circuit and switching waveforms. The test circuit and switching waveforms shall be as specified on figure 3. 3.3 Electrical performance characteristics. Unless otherwise specified herein, the electrical performance characteristics are as specified in table I and shall apply over t
21、he full case operating temperature range. 3.4 Electrical test requirements. The electrical test requirements shall be the subgroups specified in table II. The electrical tests for each subgroup are described in table I. Provided by IHSNot for ResaleNo reproduction or networking permitted without lic
22、ense from IHS-,-,-STANDARD MICROCIRCUIT DRAWING SIZE A 5962-90616 DLA LAND AND MARITIME COLUMBUS, OHIO 43218-3990 REVISION LEVEL B SHEET 4 DSCC FORM 2234 APR 97 3.5 Marking. Marking shall be in accordance with MIL-PRF-38535, appendix A. The part shall be marked with the PIN listed in 1.2 herein. In
23、addition, the manufacturers PIN may also be marked. For packages where marking of the entire SMD PIN number is not feasible due to space limitations, the manufacturer has the option of not marking the “5962-“ on the device. 3.5.1 Certification/compliance mark. A compliance indicator “C” shall be mar
24、ked on all non-JAN devices built in compliance to MIL-PRF-38535, appendix A. The compliance indicator “C” shall be replaced with a “Q“ or “QML“ certification mark in accordance with MIL-PRF-38535 to identify when the QML flow option is used. 3.6 Certificate of compliance. A certificate of compliance
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