DLA SMD-5962-89593 REV D-1995 MICROCIRCUIT DIGITAL CMOS 32-BIT DMA CONTROLLER WITH INTEGRATED SYSTEM SUPPORT PERIPHERALS MONOLITHIC SILICON《硅单片 装有外围支援集成系统的32位存储票接存取控制器 氧化物半导体数字微型电路.pdf
《DLA SMD-5962-89593 REV D-1995 MICROCIRCUIT DIGITAL CMOS 32-BIT DMA CONTROLLER WITH INTEGRATED SYSTEM SUPPORT PERIPHERALS MONOLITHIC SILICON《硅单片 装有外围支援集成系统的32位存储票接存取控制器 氧化物半导体数字微型电路.pdf》由会员分享,可在线阅读,更多相关《DLA SMD-5962-89593 REV D-1995 MICROCIRCUIT DIGITAL CMOS 32-BIT DMA CONTROLLER WITH INTEGRATED SYSTEM SUPPORT PERIPHERALS MONOLITHIC SILICON《硅单片 装有外围支援集成系统的32位存储票接存取控制器 氧化物半导体数字微型电路.pdf(26页珍藏版)》请在麦多课文档分享上搜索。
1、REVISIONSLTR DESCRIPTION DATE (YR-MO-DA) APPROVEDABCDAdd device type 02. Add package Y. Correct table I, I . EditorialCCchanges throughout.Changes in accordance with NOR 5962-R058-94Changes in accordance with NOR 5962-R025-95Add device 03. Editorial changes throughout.92-01-1693-12-0294-11-1595-09-2
2、6Monica PoelkingTim NohThomas M. HessMonica PoelkingREV SHEETREV DDDDDDDDDDDSHEET 15 16 17 18 19 20 21 22 23 24 25REV STATUSOF SHEETSREV DD DDDDDDDD DDD DSHET 123456789101121314PMIC N/APREPARED BY Todd D. Creek DEFENSE ELECTRONICS SUPPLY CENTER DAYTON, OHIO 45444 STANDARDMICROCIRCUITDRAWINGTHIS DRAW
3、ING IS AVAILABLEFOR USE BY ALLDEPARTMENTSAND AGENCIES OF THEDEPARTMENT OF DEFENSEAMSC N/A CHECKED BYRay MonninMICROCIRCUIT, DIGITAL, CMOS, 32-BIT DMACONTROLLER WITH INTEGRATED SYSTEM SUPPORTPERIPHERALS, MONOLITHIC SILICONAPPROVED BYMichael FryeDRAWING APPROVAL DATE89-06-23SIZEACAGE CODE672685962-895
4、93REVISION LEVELDSHEET 1 OF 25DESC FORM 193JUL 94 5962-E258-95DISTRIBUTION STATEMENT A. Approved for public release; distribution is unlimited.Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-STANDARDMICROCIRCUIT DRAWINGDEFENSE ELECTRONICS SUPPLY CENT
5、ERDAYTON, OHIO 45444SIZEA5962-89593REVISION LEVELDSHEET2DESC FORM 193AJUL 941. SCOPE1.1 Scope. This drawing describes device requirements for class B microcircuits in accordance with 1.2.1 of MIL-STD-883,“Provisions for the use of MIL-STD-883 in conjunction with compliant non-JAN devices“.1.2 Part o
6、r Identifying Number (PIN). The complete PIN shall be as shown in the following example:5962-89593 01 X X G0D G0D G0D G0D G0D G0D G0D G0D G0D G0D G0D G0DG0D G0D G0D G0D Drawing number Device type Case outline Lead finish(see 1.2.1) (see 1.2.2) (see 1.2.3)1.2.1 Device type(s). The device type(s) shal
7、l identify the circuit function as follows:Device type Generic number Circuit function Frequency01 82380 32-bit DMA controller with integrated 16 MHzsystem support peripherals02 82380 32-bit DMA controller with integrated 20 MHzsystem support peripherals03 82380 32-bit DMA controller with integrated
8、 25 MHzsystem support peripherals1.2.2 Case outline(s). The case outline(s) shall be as designated in MIL-STD-1835 and as follows:Outline letter Descriptive designator Terminals Package styleY See figure 1 164 Leaded chip carrier leadsZ CMGA6-P132 132 Pin grid array package1.2.3 Lead finish. The lea
9、d finish shall be as specified in MIL-STD-883 (see 3.1 herein). Finish letter “X“ shall not be marked on themicrocircuit or its packaging. The “X“ designation is for use in specifications when lead finishes A, B, and C are considered acceptableand interchangeable without preference.1.3 Absolute maxi
10、mum ratings. Storage temperature range- -65G28C to +150G28CVoltage on any pin with respect to ground - -0.5 V dc to +6.5 V dcPower dissipation (P )- 2.0 WDLead temperature (soldering, 10 seconds) - +300G28CThermal resistance, junction-to-case (G14 ):JCCase Z - See MIL-STD-1835Case Y - +8G28C/WJuncti
11、on temperature (T ) - +175G28CJ1.4 Recommended operating conditions.Case operating temperature range (T ) - -55G28C to +125G28CCSupply voltage range (V ) - +4.75 V dc to +5.25 V dcCC2. APPLICABLE DOCUMENTS2.1 Government specification, standards, and bulletin. Unless otherwise specified, the followin
12、g specification, standards, and bulletinof the issue listed in that issue of the Department of Defense Index of Specifications and Standards specified in the solicitation, forma part of this drawing to the extent specified herein.SPECIFICATIONMILITARYMIL-I-38535 - Integrated Circuits (Microcircuits)
13、 Manufacturing, General Specification for.Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-STANDARDMICROCIRCUIT DRAWINGDEFENSE ELECTRONICS SUPPLY CENTERDAYTON, OHIO 45444SIZEA5962-89593REVISION LEVELDSHEET3DESC FORM 193AJUL 94STANDARDSMILITARYMIL-STD-
14、883 - Test Methods and Procedures for Microelectronics.MIL-STD-1835 - Microcircuit Case Outlines.BULLETIN MILITARYMIL-BUL-103 - List of Standardized Military Drawings (SMDs).(Copies of the specification, standards, and bulletin required by manufacturers in connection with specific acquisition functi
15、ons shouldbe obtained from the contracting activity or as directed by the contracting activity.)2.2 Order of precedence. In the event of a conflict between the text of this drawing and the references cited herein, the text of thisdrawing shall take precedence.3. REQUIREMENTS3.1 Item requirements. Th
16、e individual item requirements shall be in accordance with 1.2.1 of MIL-STD-883, “Provisions for the useof MIL-STD-883 in conjunction with compliant non-JAN devices“ and as specified herein. Product built to this drawing that is producedby a Qualified Manufacturer Listing (QML) certified and qualifi
17、ed manufacturer or a manufacturer who has been granted transitionalcertification to MIL-I-38535 may be processed as QML product in accordance with the manufacturers approved program plan andqualifying activity approval in accordance with MIL-I-38535. This QML flow as documented in the Quality Manage
18、ment (QM) plan maymake modifications to the requirements herein. These modifications shall not affect form, fit, or function of the device. Thesemodifications shall not affect the PIN as described herein. A “Q“ or “QML“ certification mark in accordance with MIL-I-38535 is requiredto identify when th
19、e QML flow option is used.3.2 Design, construction, and physical dimensions. The design, construction, and physical dimensions shall be as specified in MIL-STD-883 (see 3.1 herein) and herein.3.2.1 Case outline(s). The case outline(s) shall be in accordance with 1.2.2 herein and figure 1.3.2.2 Termi
20、nal connections. The terminal connections shall be as specified on figure 2.3.2.3 Functional block diagram. The functional block diagram shall be as specified on figure 3.3.3 Electrical performance characteristics. Unless otherwise specified herein, the electrical performance characteristics are ass
21、pecified in table I and shall apply over the full (case or ambient) operating temperature range.3.4 Electrical test requirements. The electrical test requirements shall be the subgroups specified in table II. The electrical tests foreach subgroup are described in table I.3.5 Marking. Marking shall b
22、e in accordance with MIL-STD-883 (see 3.1 herein). The part shall be marked with the PIN listed in 1.2herein. In addition, the manufacturers PIN may also be marked as listed in MIL-BUL-103 (see 6.6 herein).3.6 Certificate of compliance. A certificate of compliance shall be required from a manufactur
23、er in order to be listed as an approvedsource of supply in MIL-BUL-103 (see 6.6 herein). The certificate of compliance submitted to DESC-EC prior to listing as an approvedsource of supply shall affirm that the manufacturers product meets the requirements of MIL-STD-883 (see 3.1 herein) and therequir
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