DLA SMD-5962-87730 REV C-2009 MICROCIRCUIT DIGITAL ECL 4 WIDE ORAND OR-AND-INVERT GATE MONOLITHIC SILICON.pdf

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1、 REVISIONS LTR DESCRIPTION DATE (YR-MO-DA) APPROVED A Technical changes to 1.3, 1.4, table I, and table II. Add figure 4. Change footnotes in table I. Change terminal connections. Editorial changes throughout. 89-06-05 M. A. Frye B Changes in accordance with NOR 5962-R072-92. 91-12-10 Monica L. Poel

2、king C Redrawn with changes. Update drawing to current requirements. Editorial changes throughout. - gap 09-10-26 Charles F. Saffle The original first sheet of this drawing has been replaced. REV SHET REV SHET REV STATUS REV C C C C C C C C C C C C C OF SHEETS SHEET 1 2 3 4 5 6 7 8 9 10 11 12 13 PMI

3、C N/A PREPARED BY Monica L. Grosel DEFENSE SUPPLY CENTER COLUMBUS COLUMBUS, OHIO 43218-3990 http:/www.dscc.dla.mil STANDARD MICROCIRCUIT DRAWING THIS DRAWING IS AVAILABLE FOR USE BY ALL DEPARTMENTS AND AGENCIES OF THE DEPARTMENT OF DEFENSE CHECKED BY D. A. DiCenzo APPROVED BY Robert P. Evans MICROCI

4、RCUIT, DIGITAL, ECL, 4 WIDE OR-AND/OR-AND-INVERT GATE, MONOLITHIC SILICON DRAWING APPROVAL DATE 87-11-05 AMSC N/A REVISION LEVEL C SIZE A CAGE CODE 67268 5962-87730 SHEET 1 OF 13 DSCC FORM 2233 APR 97 5962-E314-09 Provided by IHSNot for ResaleNo reproduction or networking permitted without license f

5、rom IHS-,-,-STANDARD MICROCIRCUIT DRAWING SIZE A 5962-87730 DEFENSE SUPPLY CENTER COLUMBUS COLUMBUS, OHIO 43218-3990 REVISION LEVEL C SHEET 2 DSCC FORM 2234 APR 97 1. SCOPE 1.1 Scope. This drawing describes device requirements for MIL-STD-883 compliant, non-JAN class level B microcircuits in accorda

6、nce with MIL-PRF-38535, appendix A. 1.2 Part or Identifying Number (PIN). The complete PIN is as shown in the following example: 5962-87730 01 E X Drawing number Device type (see 1.2.1) Case outline(see 1.2.2) Lead finish(see 1.2.3)1.2.1 Device type(s). The device type(s) identify the circuit functi

7、on as follows: Device type Generic number Circuit function 01 10H521 4 wide OR-AND/OR-AND-INVERT gate 1.2.2 Case outline(s). The case outline(s) are as designated in MIL-STD-1835 and as follows: Outline letter Descriptive designator Terminals Package style E GDIP1-T16 or CDIP2-T16 16 Dual-in-line pa

8、ckage F GDFP2-F16 or CDFP3-F16 16 Flat pack package 2 CQCC1-N20 20 Square leadless chip carrier 1.2.3 Lead finish. The lead finish is as specified in MIL-PRF-38535, appendix A. 1.3 Absolute maximum ratings. Supply voltage range (VEE) -8.0 V dc to 0.0 V dc Input voltage range -5.2 V dc to 0.0 V dc St

9、orage temperature range . -65C to +165C Lead temperature (soldering, 10 seconds) +300C Junction temperature (TJ) +165C Maximum power dissipation (PD) . +174 mW Thermal resistance, junction-to-case (JC) See MIL-STD-1835 1.4 Recommended operating conditions. Supply voltage range (VEE) -5.46 V dc minim

10、um to -4.94 V dc maximum Supply voltage range (VCC) . -0.02 V dc to +0.02 V dc or +1.98 V dc to +2.02 V dc Ambient operating temperature range (TA) -55C to +125C Minimum high level input voltage (VIH): TA= +25C -0.780 V TA= +125C -0.650 V TA= -55C . -0.840 V Maximum low level input voltage (VIL) . -

11、1.950 V Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-STANDARD MICROCIRCUIT DRAWING SIZE A 5962-87730 DEFENSE SUPPLY CENTER COLUMBUS COLUMBUS, OHIO 43218-3990 REVISION LEVEL C SHEET 3 DSCC FORM 2234 APR 97 2. APPLICABLE DOCUMENTS 2.1 Government spe

12、cification, standards, and handbooks. The following specification, standards, and handbooks form a part of this drawing to the extent specified herein. Unless otherwise specified, the issues of these documents are those cited in the solicitation or contract. DEPARTMENT OF DEFENSE SPECIFICATION MIL-P

13、RF-38535 - Integrated Circuits, Manufacturing, General Specification for. DEPARTMENT OF DEFENSE STANDARDS MIL-STD-883 - Test Method Standard Microcircuits. MIL-STD-1835 - Interface Standard Electronic Component Case Outlines. DEPARTMENT OF DEFENSE HANDBOOKS MIL-HDBK-103 - List of Standard Microcircu

14、it Drawings. MIL-HDBK-780 - Standard Microcircuit Drawings. (Copies of these documents are available online at http:/assist.daps.dla.mil/quicksearch/ or from the Standardization Document Order Desk, 700 Robbins Avenue, Building 4D, Philadelphia, PA 19111-5094.) 2.2 Order of precedence. In the event

15、of a conflict between the text of this drawing and the references cited herein, the text of this drawing takes precedence. Nothing in this document, however, supersedes applicable laws and regulations unless a specific exemption has been obtained. 3. REQUIREMENTS 3.1 Item requirements. The individua

16、l item requirements shall be in accordance with MIL-PRF-38535, appendix A for non-JAN class level B devices and as specified herein. Product built to this drawing that is produced by a Qualified Manufacturer Listing (QML) certified and qualified manufacturer or a manufacturer who has been granted tr

17、ansitional certification to MIL-PRF-38535 may be processed as QML product in accordance with the manufacturers approved program plan and qualifying activity approval in accordance with MIL-PRF-38535. This QML flow as documented in the Quality Management (QM) plan may make modifications to the requir

18、ements herein. These modifications shall not affect form, fit, or function of the device. These modifications shall not affect the PIN as described herein. A “Q“ or “QML“ certification mark in accordance with MIL-PRF-38535 is required to identify when the QML flow option is used. 3.2 Design, constru

19、ction, and physical dimensions. The design, construction, and physical dimensions shall be as specified in MIL-PRF-38535, appendix A and herein. 3.2.1 Case outlines. The case outlines shall be in accordance with 1.2.2 herein. 3.2.2 Terminal connections. The terminal connections shall be as specified

20、 on figure 1. 3.2.3 Truth table. The truth table shall be as specified on figure 2. 3.2.4 Logic diagram. The logic diagram shall be as specified on figure 3. 3.2.5 Test circuit and switching waveforms. The test circuit and switching waveforms shall be as specified on figure 4. 3.3 Electrical perform

21、ance characteristics. Unless otherwise specified herein, the electrical performance characteristics are as specified in table I and shall apply over the full ambient operating temperature range. 3.4 Electrical test requirements. The electrical test requirements shall be the subgroups specified in ta

22、ble II. The electrical tests for each subgroup are described in table I. Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-STANDARD MICROCIRCUIT DRAWING SIZE A 5962-87730 DEFENSE SUPPLY CENTER COLUMBUS COLUMBUS, OHIO 43218-3990 REVISION LEVEL C SHEET 4

23、 DSCC FORM 2234 APR 97 3.5 Marking. Marking shall be in accordance with MIL-PRF-38535, appendix A. The part shall be marked with the PIN listed in 1.2 herein. In addition, the manufacturers PIN may also be marked. For packages where marking of the entire SMD PIN number is not feasible due to space l

24、imitations, the manufacturer has the option of not marking the “5962-“ on the device. 3.5.1 Certification/compliance mark. A compliance indicator “C” shall be marked on all non-JAN devices built in compliance to MIL-PRF-38535, appendix A. The compliance indicator “C” shall be replaced with a “Q“ or

25、“QML“ certification mark in accordance with MIL-PRF-38535 to identify when the QML flow option is used. 3.6 Certificate of compliance. A certificate of compliance shall be required from a manufacturer in order to be listed as an approved source of supply in MIL-HDBK-103 (see 6.6 herein). The certifi

26、cate of compliance submitted to DSCC-VA prior to listing as an approved source of supply shall affirm that the manufacturers product meets the requirements of MIL-PRF-38535, appendix A and the requirements herein. 3.7 Certificate of conformance. A certificate of conformance as required in MIL-PRF-38

27、535, appendix A shall be provided with each lot of microcircuits delivered to this drawing. 3.8 Notification of change. Notification of change to DSCC-VA shall be required for any change that affects this drawing. 3.9 Verification and review. DSCC, DSCCs agent, and the acquiring activity retain the

28、option to review the manufacturers facility and applicable required documentation. Offshore documentation shall be made available onshore at the option of the reviewer. 4. VERIFICATION 4.1 Sampling and inspection. Sampling and inspection procedures shall be in accordance with MIL-PRF-38535, appendix

29、 A. 4.2 Screening. Screening shall be in accordance with method 5004 of MIL-STD-883, and shall be conducted on all devices prior to quality conformance inspection. The following additional criteria shall apply: a. Burn-in test, method 1015 of MIL-STD-883. (1) Test condition A, B, C, or D. The test c

30、ircuit shall be maintained by the manufacturer under document revision level control and shall be made available to the preparing or acquiring activity upon request. The test circuit shall specify the inputs, outputs, biases, and power dissipation, as applicable, in accordance with the intent specif

31、ied in method 1015 of MIL-STD-883. (2) TA= +125C, minimum. b. Interim and final electrical test parameters shall be as specified in table II herein, except interim electrical parameter tests prior to burn-in are optional at the discretion of the manufacturer. Provided by IHSNot for ResaleNo reproduc

32、tion or networking permitted without license from IHS-,-,-STANDARD MICROCIRCUIT DRAWING SIZE A 5962-87730 DEFENSE SUPPLY CENTER COLUMBUS COLUMBUS, OHIO 43218-3990 REVISION LEVEL C SHEET 5 DSCC FORM 2234 APR 97 TABLE I. Electrical performance characteristics. Test Symbol Conditions -55C TA +125C unle

33、ss otherwise specified Group A subgroups Limits Unit Min Max Cases E, F, and 2 Quiescent tests 1/ Outputs terminated through 100 to -2 V VCC= 0.0 V VEE= -5.2 V 2/ VIHVILHigh level output voltage VOH-0.780 -1.950 1 -1.010 -0.780 V -0.650 -1.950 2 -0.860 -0.650 -0.840 -1.950 3 -1.060 -0.840 Low level

34、output voltage VOL-0.780 -1.950 1 -1.950 -1.580 V -0.650 -1.950 2 -1.950 -1.565 -0.840 -1.950 3 -1.950 -1.610 High level threshold VOHA-1.110 -1.480 1 -1.010 -0.780 V output voltage -0.960 -1.465 2 -0.860 -0.650 -1.160 -1.510 3 -1.060 -0.840 Low level threshold VOLA-1.110 -1.480 1 -1.950 -1.580 V ou

35、tput voltage -0.960 -1.465 2 -1.950 -1.565 -1.160 -1.510 3 -1.950 -1.610 Power supply drain current IEEVEE= -5.46 V 1 -26 mA 3/ VCC= 0.0 V 2, 3 -29 VIH= -0.780 V at +25C -0.650 V at +125C -0.840 V at -55C High level input current IIH1All inputs 1 295 A except A 2, 3 500 IIH2Input A 1 360 2, 3 610 Lo

36、w level input current IILVEE= -4.94 V, VCC= 0.0 V 1, 3 0.5 A VIL= -1.950 V 3/ 2 0.3 Functional tests See 4.3.1c 7, 8 See footnotes at end of table. Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-STANDARD MICROCIRCUIT DRAWING SIZE A 5962-87730 DEFENS

37、E SUPPLY CENTER COLUMBUS COLUMBUS, OHIO 43218-3990 REVISION LEVEL C SHEET 6 DSCC FORM 2234 APR 97 TABLE I. Electrical performance characteristics - Continued. Test Symbol Conditions -55C TA +125C unless otherwise specified Group A subgroups Limits Unit Min Max Cases E and F DC rapid tests 4/ Outputs

38、 terminated through 100 to -2 V VCC= 0.0 V VEE= -5.2 V 2/ VIHVILHigh level output voltage VOH-0.787 -1.950 1 -1.017 -0.787 V -0.638 -1.950 2 -0.867 -0.658 -0.848 -1.950 3 -1.067 -0.848 Low level output voltage VOL-0.787 -1.950 1 -1.950 -1.582 V -0.638 -1.950 2 -1.950 -1.567 -0.848 -1.950 3 -1.950 -1

39、.612 High level threshold VOHA-1.097 -1.482 1 -1.017 -0.787 V output voltage -0.967 -1.467 2 -0.867 -0.658 -1.167 -1.512 3 -1.067 -0.848 Low level threshold VOLA-1.097 -1.482 1 -1.950 -1.582 V output voltage -0.967 -1.467 2 -1.950 -1.567 -1.167 -1.512 3 -1.950 -1.612 Power supply drain IEEVEE= -5.46

40、 V 1 -25 mA current 3/ VCC= 0.0 V 2, 3 -28 VIH= -0.780 V at +25C -0.650 V at +125C -0.840 V at -55C High level input current IIH1All inputs 1 280 A except A 2, 3 485 IIH2Input A 1 345 2, 3 595 Low level input current IILVEE= -4.94 V, VCC= 0.0 V 1, 3 0.5 A VIL= -1.950 V 3/ 2 0.3 Functional tests See

41、4.3.1c 7, 8 See footnotes at end of table. Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-STANDARD MICROCIRCUIT DRAWING SIZE A 5962-87730 DEFENSE SUPPLY CENTER COLUMBUS COLUMBUS, OHIO 43218-3990 REVISION LEVEL C SHEET 7 DSCC FORM 2234 APR 97 TABLE I

42、. Electrical performance characteristics - Continued. Test Symbol Conditions -55C TA +125C unless otherwise specified Group A subgroups Limits Unit Min Max Case 2 DC rapid tests 4/ VIHVILHigh level output voltage VOHOutputs terminated through 100 to -2 V VCC= 0.0 V VEE= -5.2 V 2/ -0.792 -1.950 1 -1.

43、021 -0.792 V -0.643 -1.950 2 -0.872 -0.663 -0.853 -1.950 3 -1.072 -0.853 Low level output voltage VOL-0.792 -1.950 1 -1.950 -1.584 V -0.643 -1.950 2 -1.950 -1.569 -0.853 -1.950 3 -1.950 -1.614 High level threshold VOHA-1.101 -1.484 1 -1.021 -0.792 V output voltage -0.972 -1.469 2 -0.872 -0.663 -1.17

44、2 -1.514 3 -1.072 -0.853 Low level threshold VOLA-1.101 -1.484 1 -1.950 -1.584 V output voltage -0.972 -1.469 2 -1.950 -1.569 -1.172 -1.514 3 -1.950 -1.614 Power supply drain IEEVEE= -5.46 V 1 -25 mA current 3/ VCC= 0.0 V 2, 3 -28 VIH= -0.780 V at +25C -0.650 V at +125C -0.840 V at -55C High level i

45、nput current IIH1All inputs 1, 2 280 A except A 3 485 IIH2Input A 1, 2 345 3 595 Low level input current IILVEE= -4.94 V, VCC= 0.0 V 3/ VIL= -1.950 V 1, 3 0.5 A 2 0.3 Functional tests See 4.3.1c 7, 8 See footnotes at end of table. Provided by IHSNot for ResaleNo reproduction or networking permitted

46、without license from IHS-,-,-STANDARD MICROCIRCUIT DRAWING SIZE A 5962-87730 DEFENSE SUPPLY CENTER COLUMBUS COLUMBUS, OHIO 43218-3990 REVISION LEVEL C SHEET 8 DSCC FORM 2234 APR 97 TABLE I. Electrical performance characteristics - Continued. Test Symbol Conditions -55C TA +125C unless otherwise spec

47、ified Group A subgroups Limits Unit Min Max Cases E, F, and 2 AC tests Transition time tTLH, VEE= -2.94 V 9 0.50 1.80 ns tTHLVCC= 2.0 V 10 0.50 2.10 CL 5 pF 11 0.50 1.70 Propagation delay time, tPLH1, Load all outputs through 100 to ground See figure 4 9 0.45 1.80 ns input A to Y tPHL1, 10 0.55 2.40

48、 tPLL1, 11 0.45 1.80 PHH1Propagation delay time, tPLH2, 9 0.60 2.00 ns all inputs except A to Y tPHL2, 10 0.70 2.60 tPLL2, 11 0.55 2.00 tPHH21/ The quiescent limits are determined after a device has reached thermal equilibrium. This is defined as the reading taken with the device in a socket with 500 LFPM of +25C, +125C or -55C (as applicable) air blowing on the unit in a transverse direction with power applied for at least 4 minutes before the reading is taken. This method