DLA SMD-5962-86874 REV C-2006 MICROCIRCUIT DIGITAL ADVANCED SCHOTTKY TTL OCTAL BUFFER W LOW& HIGH ENABLED 3-STATE NON- INVERTED OUTPUTS MONOLITHIC SILICON《硅单块 八进制缓冲器W 高或低激活的三态非倒转输出.pdf

《DLA SMD-5962-86874 REV C-2006 MICROCIRCUIT DIGITAL ADVANCED SCHOTTKY TTL OCTAL BUFFER W LOW& HIGH ENABLED 3-STATE NON- INVERTED OUTPUTS MONOLITHIC SILICON《硅单块 八进制缓冲器W 高或低激活的三态非倒转输出.pdf》由会员分享，可在线阅读，更多相关《DLA SMD-5962-86874 REV C-2006 MICROCIRCUIT DIGITAL ADVANCED SCHOTTKY TTL OCTAL BUFFER W LOW& HIGH ENABLED 3-STATE NON- INVERTED OUTPUTS MONOLITHIC SILICON《硅单块 八进制缓冲器W 高或低激活的三态非倒转输出.pdf（12页珍藏版）》请在麦多课文档分享上搜索。

1、 REVISIONS LTR DESCRIPTION DATE (YR-MO-DA) APPROVED A Device 01 inactive for new design. Editorial changes throughout. 87-05-19 N. A. Hauck B Device 01 reactivated for new design, due to inactivation of M38510/332. Drawing placed on new boilerplate. CAGE changed from 14933 to 67268. Editorial change

2、s throughout. 97-07-30 Raymond L. Monnin C Update to current requirements. Editorial changes throughout. - gap 06-02-14 Raymond Monnin CURRENT CAGE CODE 67268 THE ORIGINAL FIRST PAGE OF THIS DRAWING HAS BEEN REPLACED. REV SHET REV SHET REV STATUS REV C C C C C C C C C C C OF SHEETS SHEET 1 2 3 4 5 6

3、 7 8 9 10 11 PMIC N/A PREPARED BY David W. Queenan DEFENSE SUPPLY CENTER COLUMBUS STANDARD MICROCIRCUIT DRAWING CHECKED BY N. A. Hauck COLUMBUS, OHIO 43218-3990 http:/www.dscc.dla.mil THIS DRAWING IS AVAILABLE FOR USE BY ALL DEPARTMENTS APPROVED BY N. A. Hauck MICROCIRCUIT, DIGITAL, ADVANCED SCHOTTK

4、Y TTL, OCTAL BUFFER W/LOW quicksearch/ or www.dodssp.daps.mil or from the Standardization Document Order Desk, 700 Robbins Avenue, Building 4D, Philadelphia, PA 19111-5094.) 2.2 Order of precedence. In the event of a conflict between the text of this drawing and the references cited herein, the text

5、 of this drawing takes precedence. Nothing in this document, however, supersedes applicable laws and regulations unless a specific exemption has been obtained. 3. REQUIREMENTS 3.1 Item requirements. The individual item requirements shall be in accordance with MIL-PRF-38535, appendix A for non-JAN cl

6、ass level B devices and as specified herein. Product built to this drawing that is produced by a Qualified Manufacturer Listing (QML) certified and qualified manufacturer or a manufacturer who has been granted transitional certification to MIL-PRF-38535 may be processed as QML product in accordance

7、with the manufacturers approved program plan and qualifying activity approval in accordance with MIL-PRF-38535. This QML flow as documented in the Quality Management (QM) plan may make modifications to the requirements herein. These modifications shall not affect form, fit, or function of the device

8、. These modifications shall not affect the PIN as described herein. A “Q“ or “QML“ certification mark in accordance with MIL-PRF-38535 is required to identify when the QML flow option is used. 3.2 Design, construction, and physical dimensions. The design, construction, and physical dimensions shall

9、be as specified in MIL-PRF-38535, appendix A and herein. 3.2.1 Case outline(s). The case outline(s) shall be in accordance with 1.2.2 herein. 3.2.2 Terminal connections. The terminal connections shall be as specified on figure 1. 3.2.3 Truth table(s). The truth table(s) shall be as specified on figu

10、re 2. 3.2.4 Logic diagram(s). The logic diagram(s) shall be as specified on figure 3. 3.2.5 Test circuit and timing waveforms. The test circuit and timing waveforms shall be as specified on figure 4. 3.3 Electrical performance characteristics. Unless otherwise specified herein, the electrical perfor

11、mance characteristics are as specified in table I and shall apply over the full case operating temperature range. Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-STANDARD MICROCIRCUIT DRAWING SIZE A 5962-86874 DEFENSE SUPPLY CENTER COLUMBUS COLUMBUS,

12、 OHIO 43218-3990 REVISION LEVEL C SHEET 4 DSCC FORM 2234 APR 97 3.4 Electrical test requirements. The electrical test requirements shall be the subgroups specified in table II. The electrical tests for each subgroup are described in table I. 3.5 Marking. Marking shall be in accordance with MIL-PRF-3

13、8535, appendix A. The part shall be marked with the PIN listed in 1.2 herein. In addition, the manufacturers PIN may also be marked. For packages where marking of the entire SMD PIN number is not feasible due to space limitations, the manufacturer has the option of not marking the “5962-“ on the dev

14、ice. 3.5.1 Certification/compliance mark. A compliance indicator “C” shall be marked on all non-JAN devices built in compliance to MIL-PRF-38535, appendix A. The compliance indicator “C” shall be replaced with a “Q“ or “QML“ certification mark in accordance with MIL-PRF-38535 to identify when the QM

15、L flow option is used. 3.6 Certificate of compliance. A certificate of compliance shall be required from a manufacturer in order to be listed as an approved source of supply in MIL-HDBK-103 (see 6.6 herein). The certificate of compliance submitted to DSCC-VA prior to listing as an approved source of

16、 supply shall affirm that the manufacturers product meets the requirements of MIL-PRF-38535, appendix A and the requirements herein. 3.7 Certificate of conformance. A certificate of conformance as required in MIL-PRF-38535, appendix A shall be provided with each lot of microcircuits delivered to thi

17、s drawing. 3.8 Notification of change. Notification of change to DSCC-VA shall be required for any change that affects this drawing. 3.9 Verification and review. DSCC, DSCCs agent, and the acquiring activity retain the option to review the manufacturers facility and applicable required documentation

18、. Offshore documentation shall be made available onshore at the option of the reviewer. 4. VERIFICATION 4.1 Sampling and inspection. Sampling and inspection procedures shall be in accordance with MIL-PRF-38535, appendix A. 4.2 Screening. Screening shall be in accordance with method 5004 of MIL-STD-8

19、83, and shall be conducted on all devices prior to quality conformance inspection. The following additional criteria shall apply: a. Burn-in test, method 1015 of MIL-STD-883. (1) Test condition A, B, C, or D. The test circuit shall be maintained by the manufacturer under document revision level cont

20、rol and shall be made available to the preparing or acquiring activity upon request. The test circuit shall specify the inputs, outputs, biases, and power dissipation, as applicable, in accordance with the intent specified in method 1015 of MIL-STD-883. (2) TA= +125C, minimum. b. Interim and final e

21、lectrical test parameters shall be as specified in table II herein, except interim electrical parameter tests prior to burn-in are optional at the discretion of the manufacturer. Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-STANDARD MICROCIRCUIT D

22、RAWING SIZE A 5962-86874 DEFENSE SUPPLY CENTER COLUMBUS COLUMBUS, OHIO 43218-3990 REVISION LEVEL C SHEET 5 DSCC FORM 2234 APR 97 TABLE I. Electrical performance characteristics. Test Symbol Conditions -55C TC +125C VCCGroup A subgroups Limits Unit unless otherwise specified Min Max Input clamp volta

23、ge VICII= -18mA 4.5 V 1 -1.2 V Short circuit output current IOS 1/ 5.5 V 1, 2, 3 -100 -325 mA High level output voltage VOHIOH= -3 mA , VIN= 0.8 V or VIN= 2.0 V 4.5 V 1, 2, 3 2.4 V Low level output voltage VOLIOL= 48 mA, VIN= 0.8 V or VIN= 2.0 V 4.5 V 1, 2, 3 0.55 V High-level input current IIH1VIN=

24、 2.7 V 5.5 V 1, 2, 3 20 A IIH2VIN= 7.0 V 5.5 V 1, 2, 3 0.1 mA Low-level input current any A (at data) IIL1VIN= 0.5 V 5.5 V 1, 2, 3 -1.6 mA Low-level input enable current IIL2VIN= 0.5 V 5.5 V 1, 2, 3 -1.0 mA High level supply current ICCH 5.5 V 1, 2, 3 60 mA Low level supply current ICCL5.5 V 1, 2, 3

25、 90 mA Off-state supply current ICCZoutputs disabled 5.5 V 1, 2, 3 90 mA Off-state output leakage current IOZHVZH = 2.4 V 5.5 V 1, 2, 3 50 A IOZL VZL = 0.5 V 5.5 V 1, 2, 3 -50 Functional test VIN= VIHmin or VILmax See 4.3.1c 4.5 V to 5.5 V 7, 8 See footnotes at end of table. Provided by IHSNot for R

26、esaleNo reproduction or networking permitted without license from IHS-,-,-STANDARD MICROCIRCUIT DRAWING SIZE A 5962-86874 DEFENSE SUPPLY CENTER COLUMBUS COLUMBUS, OHIO 43218-3990 REVISION LEVEL C SHEET 6 DSCC FORM 2234 APR 97 TABLE I. Electrical performance characteristics - Continued. Test Symbol C

27、onditions -55C TC +125C Group A subgroups Limits Unit unless otherwise specified Min Max Propagation delay time, low to high level output, from any A to Y tPLHVCC= 5.0 V CL= 50 pF, 9, 10, 11 6.5 ns Propagation delay time, high to low level output, from any A to Y tPHLRL= 500 5%, 9, 10, 11 7.0 ns Pro

28、pagation delay time, high level to off-state output from OE2 or 1OE to Y tPHZ9, 10, 11 7.0 ns Propagation delay time, off-state to high level output , from OE2 or 1OE to Y tPZH9, 10, 11 7.0 ns Propagation delay time, low level to off-state output, from OE2 or 1OE to Y tPLZ9, 10, 11 7.5 ns Propagatio

29、n delay time, off-state to low level output , from OE2 or 1OE to Y tPZL9, 10, 11 8.5 ns 1/ Not more than one output should be shorted at a time. Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-STANDARD MICROCIRCUIT DRAWING SIZE A 5962-86874 DEFENSE S

30、UPPLY CENTER COLUMBUS COLUMBUS, OHIO 43218-3990 REVISION LEVEL C SHEET 7 DSCC FORM 2234 APR 97 Case outlines R, S, and 2 Terminal number Terminal symbol 1 1OE 2 1A1 3 4Y2 4 2A1 5 3Y2 6 3A1 7 2Y2 8 4A1 9 1Y2 10 GND 11 1A2 12 4Y1 13 2A2 14 3Y1 15 3A2 16 2Y1 17 4A2 18 1Y1 19 OE2 20 VCCFIGURE 1. Termina

31、l connections. Inputs Output Inputs Output 1OE A1 Y1 OE2 A2 Y2 H X Z H H H L H H H L L L L L L X Z FIGURE 2. Truth table. Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-STANDARD MICROCIRCUIT DRAWING SIZE A 5962-86874 DEFENSE SUPPLY CENTER COLUMBUS C

32、OLUMBUS, OHIO 43218-3990 REVISION LEVEL C SHEET 8 DSCC FORM 2234 APR 97 FIGURE 3. Logic diagram. FIGURE 4. Test circuit and timing waveforms. Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-STANDARD MICROCIRCUIT DRAWING SIZE A 5962-86874 DEFENSE SUPP

33、LY CENTER COLUMBUS COLUMBUS, OHIO 43218-3990 REVISION LEVEL C SHEET 9 DSCC FORM 2234 APR 97 NOTES: 1. CLincludes probe and jig capacitance. 2. All input pulses are supplied by generators having the following characteristics: PRR 1 MHz, tr= tf 2.0 ns, duty cycle = 50%. 3. When measuring propagation d

34、elay times of 3-state outputs, switch S1 is open. 4. The outputs are measured one at a time with one transition per measurement. 5. Waveform 1 is for an output with internal conditions such that the output is low except when disabled by the output control. Waveform 2 is for an output with internal c

35、onditions such that the output is high except when disabled by the output control. FIGURE 4. Test circuit and timing waveforms - Continued. Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-STANDARD MICROCIRCUIT DRAWING SIZE A 5962-86874 DEFENSE SUPPLY

36、 CENTER COLUMBUS COLUMBUS, OHIO 43218-3990 REVISION LEVEL C SHEET 10 DSCC FORM 2234 APR 97 TABLE II. Electrical test requirements. MIL-STD-883 test requirements Subgroups (in accordance with MIL-STD-883, method 5005, table I) Interim electrical parameters (method 5004) - - - Final electrical test pa

37、rameters (method 5004) 1*, 2, 3, 7, 8, 9, 10, 11 Group A test requirements (method 5005) 1, 2, 3, 7, 8, 9, 10, 11 Groups C and D end-point electrical parameters (method 5005) 1, 2, 3 * PDA applies to subgroup 1. 4.3 Quality conformance inspection. Quality conformance inspection shall be in accordanc

38、e with method 5005 of MIL-STD-883 including groups A, B, C, and D inspections. The following additional criteria shall apply. 4.3.1 Group A inspection. a. Tests shall be as specified in table II herein. b. Subgroups 4, 5, and 6 in table I, method 5005 of MIL-STD-883 shall be omitted. c. Subgroups 7

39、and 8 shall include verification of the truth table. 4.3.2 Groups C and D inspections. a. End-point electrical parameters shall be as specified in table II herein. b. Steady-state life test conditions, method 1005 of MIL-STD-883. (1) Test condition A, B, C, or D. The test circuit shall be maintained

40、 by the manufacturer under document revision level control and shall be made available to the preparing or acquiring activity upon request. The test circuit shall specify the inputs, outputs, biases, and power dissipation, as applicable, in accordance with the intent specified in method 1005 of MIL-

41、STD-883. (2) TA= +125C, minimum. (3) Test duration: 1,000 hours, except as permitted by method 1005 of MIL-STD-883. Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-STANDARD MICROCIRCUIT DRAWING SIZE A 5962-86874 DEFENSE SUPPLY CENTER COLUMBUS COLUMBU

42、S, OHIO 43218-3990 REVISION LEVEL C SHEET 11 DSCC FORM 2234 APR 97 5. PACKAGING 5.1 Packaging requirements. The requirements for packaging shall be in accordance with MIL-PRF-38535, appendix A. 6. NOTES 6.1 Intended use. Microcircuits conforming to this drawing are intended for use for Government mi

43、crocircuit applications (original equipment), design applications, and logistics purposes. 6.2 Replaceability. Microcircuits covered by this drawing will replace the same generic device covered by a contractor-prepared specification or drawing. 6.3 Configuration control of SMDs. All proposed changes

44、 to existing SMDs will be coordinated with the users of record for the individual documents. This coordination will be accomplished using DD Form 1692, Engineering Change Proposal. 6.4 Record of users. Military and industrial users shall inform Defense Supply Center Columbus (DSCC) when a system app

45、lication requires configuration control and the applicable SMD. DSCC will maintain a record of users and this list will be used for coordination and distribution of changes to the drawings. Users of drawings covering microelectronics devices (FSC 5962) should contact DSCC-VA, telephone (614) 692-054

46、4. 6.5 Comments. Comments on this drawing should be directed to DSCC-VA, Columbus, Ohio 43218-3990, or telephone (614) 692-0547. 6.6 Approved sources of supply. Approved sources of supply are listed in MIL-HDBK-103. The vendors listed in MIL-HDBK-103 have agreed to this drawing and a certificate of

47、compliance (see 3.6 herein) has been submitted to and accepted by DSCC-VA. Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-STANDARD MICROCIRCUIT DRAWING BULLETIN DATE: 06-02-14 Approved sources of supply for SMD 5962-86874 are listed below for immedi

48、ate acquisition information only and shall be added to MIL-HDBK-103 and QML-38535 during the next revision. MIL-HDBK-103 and QML-38535 will be revised to include the addition or deletion of sources. The vendors listed below have agreed to this drawing and a certificate of compliance has been submitted to and accepted by DSCC-VA. This information bulletin is superseded by the next dated revision of MIL-HDBK-103 and QML-38535. Standard microcircuit drawing PIN 1/ Vendor CAGE number Vendor similar PIN 2/ Reference military specification PIN 5962-868740