DLA SMD-5962-03247 REV C-2012 MICROCIRCUIT HYBRID LINEAR POWER MOSFET DUAL CHANNEL OPTOCOUPLER.pdf
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1、 -REVISIONS LTR DESCRIPTION DATE (YR-MO-DA) APPROVED A Table I; For the Input-output isolation current test (II-O) and Channel-channel isolation current test (IISO) changed “RH 45 %“ to “RH 65 %“ in the conditions . Editorial changes throughout. -sld 04-09-15 Raymond Monnin B Added case outline Z. U
2、pdated drawing to reflect the latest requirements. -sld 05-08-26 Raymond Monnin C Updated drawing paragraphs. -sld 12-01-17 Charles F. Saffle REV SHEET REV SHEET REV STATUS REV C C C C C C C C C C OF SHEETS SHEET 1 2 3 4 5 6 7 8 9 10 PMIC N/A PREPARED BY Gary Zahn DLA LAND AND MARITIME COLUMBUS, OHI
3、O 43218-3990 http:/www.landandmaritime.dla.mil/ STANDARD MICROCIRCUIT DRAWING CHECKED BY Greg Cecil THIS DRAWING IS AVAILABLE FOR USE BY ALL DEPARTMENTS AND AGENCIES OF THE DEPARTMENT OF DEFENSE APPROVED BY Raymond Monnin MICROCIRCUIT, HYBRID, LINEAR, POWER MOSFET, DUAL CHANNEL, OPTOCOUPLER DRAWING
4、APPROVAL DATE 03-07-23 AMSC N/A REVISION LEVEL C SIZE A CAGE CODE 67268 5962-03247 SHEET 1 OF 10 DSCC FORM 2233 APR 97 5962-E064-12 Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-STANDARD MICROCIRCUIT DRAWING SIZE A 5962-03247 DLA LAND AND MARITIME
5、COLUMBUS, OHIO 43218-3990 REVISION LEVEL C SHEET 2 DSCC FORM 2234 APR 97 1. SCOPE 1.1 Scope. This drawing documents five product assurance classes as defined in paragraph 1.2.3 and MIL-PRF-38534. A choice of case outlines and lead finishes which are available and are reflected in the Part or Identif
6、ying Number (PIN). When available, a choice of radiation hardness assurance levels are reflected in the PIN. 1.2 PIN. The PIN shall be as shown in the following example: 5962 - 03247 01 H X X Federal RHA Device Device Case Lead stock class designator type class outline finish designator (see 1.2.1)
7、(see 1.2.2) designator (see 1.2.4) (see 1.2.5) / (see 1.2.3) / Drawing number 1.2.1 Radiation hardness assurance (RHA) designator. RHA marked devices shall meet the MIL-PRF-38534 specified RHA levels and shall be marked with the appropriate RHA designator. A dash (-) indicates a non-RHA device. 1.2.
8、2 Device type(s). The device type(s) identify the circuit function as follows: Device type Generic number Circuit function 01 53252 Dual channel, power MOSFET, optocoupler, 90 V, 0.8 A 1.2.3 Device class designator. This device class designator shall be a single letter identifying the product assura
9、nce level. All levels are defined by the requirements of MIL-PRF-38534 and require QML Certification as well as qualification (Class H, K, and E) or QML Listing (Class G and D). The product assurance levels are as follows: Device class Device performance documentation K Highest reliability class ava
10、ilable. This level is intended for use in space applications. H Standard military quality class level. This level is intended for use in applications where non-space high reliability devices are required. G Reduced testing version of the standard military quality class. This level uses the Class H s
11、creening and In-Process Inspections with a possible limited temperature range, manufacturer specified incoming flow, and the manufacturer guarantees (but may not test) periodic and conformance inspections (Group A, B, C, and D). E Designates devices which are based upon one of the other classes (K,
12、H, or G) with exception(s) taken to the requirements of that class. These exception(s) must be specified in the device acquisition document; therefore the acquisition document should be reviewed to ensure that the exception(s) taken will not adversely affect system performance. D Manufacturer specif
13、ied quality class. Quality level is defined by the manufacturers internal, QML certified flow. This product may have a limited temperature range. 1.2.4 Case outline(s). The case outline(s) are as designated in MIL-STD-1835 and as follows: Outline letter Descriptive designator Terminals Package style
14、 X See figure 1 8 Dual-in-line Y See figure 1 8 Dual-in-line Z See figure 1 8 Dual-in-line 1.2.5 Lead finish. The lead finish shall be as specified in MIL-PRF-38534. Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-STANDARD MICROCIRCUIT DRAWING SIZE A
15、 5962-03247 DLA LAND AND MARITIME COLUMBUS, OHIO 43218-3990 REVISION LEVEL C SHEET 3 DSCC FORM 2234 APR 97 1.3 Absolute maximum ratings. 1/ Average input current (IF) . 20 mA Peak repetitive input current (IFPK) . 40 mA 2/ Peak surge input current (IFPKsurge) . 100 mA 3/ Continuous output current pe
16、r relay (IO) 0.8 A 4/ Single shot output current per relay (IOPKsurge, pulse width 10 ms) . 3.0 A Output voltage (VO) 90 V dc Output power dissipation (PO) . 1.54 W 5/ Junction temperature (TJ) . +150C Thermal resistance junction-to-case (JC) . 15C/W Lead temperature (soldering, 10 seconds) . +260C
17、6/ Storage temperature range -65C to +150C 1.4 Recommended operating conditions. Input current ON (IFON) . 10 mA minimum to 20 mA maximum Input voltage OFF (VFOFF) 0 to 0.6 V dc maximum Ambient operating temperature range (TA) -55C to +125C 2. APPLICABLE DOCUMENTS 2.1 Government specification, stand
18、ards, and handbooks. The following specification, standards, and handbooks form a part of this drawing to the extent specified herein. Unless otherwise specified, the issues of these documents are those cited in the solicitation or contract. DEPARTMENT OF DEFENSE SPECIFICATION MIL-PRF-38534 - Hybrid
19、 Microcircuits, General Specification for. DEPARTMENT OF DEFENSE STANDARDS MIL-STD-883 - Test Method Standard Microcircuits. MIL-STD-1835 - Interface Standard for Electronic Component Case Outlines. DEPARTMENT OF DEFENSE HANDBOOKS MIL-HDBK-103 - List of Standard Microcircuit Drawings. MIL-HDBK-780 -
20、 Standard Microcircuit Drawings. (Copies of these documents are available online at https:/assist.daps.dla.mil/quicksearch/ or from the Standardization Document Order Desk, 700 Robbins Avenue, Building 4D, Philadelphia, PA 19111-5094.) 2.2 Order of precedence. In the event of a conflict between the
21、text of this drawing and the references cited herein, the text of this drawing takes precedence. Nothing in this document, however, supersedes applicable laws and regulations unless a specific exemption has been obtained. 1/ Stresses above the absolute maximum ratings may cause permanent damage to t
22、he device. Extended operation at the maximum levels may degrade performance and affect reliability. 2/ Pulse width 100 ms, duty cycle 50 %. 3/ Pulse width 0.2 ms, duty cycle 0.1 %. 4/ Maximum average current rating where the case temperature (TC) is maintained below 120C. 5/ Output power dissipation
23、 (PO) is obtained when the part is handling the maximum output current (IO). Care should be taken not to exceed the maximum output dissipation, maximum case temperature, and maximum junction temperature when repetitively switching loads. 6/ Lead temperature soldering occurs 1.6 mm below the seating
24、plane. Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-STANDARD MICROCIRCUIT DRAWING SIZE A 5962-03247 DLA LAND AND MARITIME COLUMBUS, OHIO 43218-3990 REVISION LEVEL C SHEET 4 DSCC FORM 2234 APR 97 3. REQUIREMENTS 3.1 Item requirements. The individua
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