DLA DSCC-VID-V62 09620-2009 MICROCIRCUIT DIGITAL MIXED SIGNAL MICROCONTROLLER MONOLITHIC SILICON.pdf
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1、 REVISIONS LTR DESCRIPTION DATE APPROVED Prepared in accordance with ASME Y14.24 Vendor item drawing REV PAGE 40 41 42 43 44 45 46 47 REV PAGE 18 19 20 21 22 23 24 25 26 27 28 29 30 31 32 33 34 35 36 37 38 39 REV STATUS OF PAGES REV PAGE 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 PMIC N/A PREPARED BY
2、 Phu H. Nguyen DEFENSE SUPPLY CENTER, COLUMBUS COLUMBUS, OHIO 43218-3990 Original date of drawing YY-MM-DD CHECKED BY Phu H. Nguyen TITLE MICROCIRCUIT, DIGITAL, MIXED SIGNAL MICROCONTROLLER, MONOLITHIC SILICON 09-07-21 APPROVED BY Thomas M. Hess SIZE A CODE IDENT. NO. 16236 DWG NO. V62/09620 REV PAG
3、E 1 OF 47 AMSC N/A 5962-V033-09 Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-DEFENSE SUPPLY CENTER, COLUMBUS COLUMBUS, OHIO SIZE A CODE IDENT NO. 16236 DWG NO. V62/09620 REV PAGE 2 1. SCOPE 1.1 Scope. This drawing documents the general requirement
4、s of a high performance mixed signal microcontroller microcircuit, with an operating temperature range of -40C to +105C. 1.2 Vendor Item Drawing Administrative Control Number. The manufacturers PIN is the item of identification. The vendor item drawing establishes an administrative control number fo
5、r identifying the item on the engineering documentation: V62/09620 - 01 X A Drawing Device type Case outline Lead finish number (See 1.2.1) (See 1.2.2) (See 1.2.3) 1.2.1 Device type(s). Device type Generic Circuit function 01 MSP430F2618-EP Mixed signal microcontroller 1.2.2 Case outline(s). The cas
6、e outlines are as specified herein. Outline letter Number of pins JEDEC PUB 95 Package style X 113 JEDEC MO-225 Plastic ball grid array 1.2.3 Lead finishes. The lead finishes are as specified below or other lead finishes as provided by the device manufacturer: Finish designator Material A Hot solder
7、 dip B Tin-lead plate C Gold plate D Palladium E Gold flash palladium Z Other 1.3 Absolute maximum ratings. 1/ Voltage applied at VCCto VSS. -0.3 V to 4.1 V Voltage applied to any pin -0.3 V to VCC+ 0.3 V 2/ Diode current at any device terminal 2 mA Storage temperature range, TSTG(Unprogrammed devic
8、e) -55C to 150C 3/ Storage temperature range, TSTG(Programmed device) -40C to 105C 3/ _ 1/ Stresses beyond those listed under “absolute maximum ratings” may cause permanent damage to the device. These are stress ratings only, and functional operation of the device at these or any other conditions be
9、yond those indicated under “recommended operating conditions” is not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability. 2/ All voltages referenced to VSS. The JTAG fuse blow voltage, VFB, is allowed to exceed the absolute maximum rating. The vo
10、ltage is applied to the TDI/TCLK pin when blowing the JTAG fuse. 3/ Higher temperature may be applied during board soldering process according to the current JEDEC J-STD-020 specification with peak reflow temperatures not higher than classified on the device label on the shipping boxes or reels. Pro
11、vided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-DEFENSE SUPPLY CENTER, COLUMBUS COLUMBUS, OHIO SIZE A CODE IDENT NO. 16236 DWG NO. V62/09620 REV PAGE 3 1.4 Recommended operating conditions. Supply voltage during program execution (VCC) . 1.8 V to 3.6 V
12、4/ Supply voltage during flash memory programming (VCC) . 2.2 V to 3.6 V 4/ Supply voltage (VSS) . 0.0 V 5/ Processor frequency fSYSTEMrange (Maximum MCLK frequency): 6/ 7/ See figure 4. VCC= 1.8 V, Duty Cycle 50% 10% dc to 4.15 MHz VCC= 2.7 V, Duty Cycle 50% 10% dc to 12 MHz VCC 3.3 V, Duty Cycle 5
13、0% 10% dc to 16 MHz Operating free air temperature range, TA. -40C to 105C 2. APPLICABLE DOCUMENTS JEDEC PUB 95 Registered and Standard Outlines for Semiconductor Devices JEDEC J-STD-020 Joint IPC/JEDEC standard for moisture/reflow sensitivity classification for nonhermetic solid state surface mount
14、 devices. (Applications for copies should be addressed to the Electronic Industries Alliance, 2500 Wilson Boulevard, Arlington, VA 22201-3834 or online at http:/www.jedec.org) 3. REQUIREMENTS 3.1 Marking. Parts shall be permanently and legibly marked with the manufacturers part number as shown in 6.
15、3 herein and as follows: A. Manufacturers name, CAGE code, or logo B. Pin 1 identifier C. ESDS identification (optional) 3.2 Unit container. The unit container shall be marked with the manufacturers part number and with items A and C (if applicable) above. 3.3 Electrical characteristics. The maximum
16、 and recommended operating conditions and electrical performance characteristics are as specified in 1.3, 1.4, and table I herein. 3.4 Design, construction, and physical dimension. The design, construction, and physical dimensions are as specified herein. _ 4/ AVCC= DVCC= VCC. It is recommended to p
17、ower AVCCand DVCCfrom the same source. A maximum difference of 0.3 V between AVCCand DVCCcan be tolerated during power-up. 5/ AVSS= DVSS= VSS. 6/ The CPU is clocked directly with MCLK. 7/ Modules might have a different maximum input clock specification. Refer to the data sheet from the manufacturer.
18、 Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-DEFENSE SUPPLY CENTER, COLUMBUS COLUMBUS, OHIO SIZE A CODE IDENT NO. 16236 DWG NO. V62/09620 REV PAGE 4 3.5 Diagrams. 3.5.1 Case outline. The case outline shall be as shown in 1.2.2 and figure 1. 3.5.2
19、 Terminal connections. The terminal connections shall be as shown in figure 2. 3.5.3 Functional block diagram. The functional block diagram shall be as shown in figure 3. 3.5.4 Operating area. The operating area shall be as shown in figure 4. 3.5.5 Active mode supply current. The active mode supply
20、current shall be as shown in figure 5. 3.5.6 POR/Brownout reset. The POR/Brownout reset shall be as shown in figures 6 -8. 3.5.7 Test circuits and timing waveforms. The test circuits and timing waveforms shall be as shown in figures 9-24. Provided by IHSNot for ResaleNo reproduction or networking pe
21、rmitted without license from IHS-,-,-DEFENSE SUPPLY CENTER, COLUMBUS COLUMBUS, OHIO SIZE A CODE IDENT NO. 16236 DWG NO. V62/09620 REV PAGE 5 TABLE I. Electrical performance characteristics. 1/ Test Symbol Conditions 2/ unless otherwise specified TAVCCLimits Unit Min Max Active mode supply current in
22、to VCCexcluding external current 3/ 4/ See figure 5. Active mode (AM) current (1 MHz) IAM, 1 MHzfDCO= fMCLK= fSMCLK= 1 MHz, fACLK= 32,768 Hz, Program executes from flash, BCSCTL1 = CALBC1_1MHz, DCOCTL = CALDCO_1MHz CPUOFF = 0, SCG0 = 0, SCG1 = 0, OSCOFF = 0 -40C to 85C 2.2 V 395 A 105C 420 -40C to 8
23、5C 3 V 560 105C 595 Active mode (AM) current (1 MHz) IAM, 1 MHzfDCO= fMCLK= fSMCLK= 1 MHz, fACLK= 32,768 Hz, Program executes in RAM, BCSCTL1 = CALBC1_1MHz, DCOCTL = CALDCO_1MHz CPUOFF = 0, SCG0 = 0, SCG1 = 0, OSCOFF = 0 -40C to 85C 2.2 V 370 A 105C 390 -40C to 85C 3 V 495 105C 520 Active mode (AM)
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