DLA DSCC-VID-V62 04702 REV A-2011 MICROCIRCUIT DIGITAL HIGH-SPEED CMOS 8-STAGE SYNCHRONOUS DOWN COUNTER MONOLITHIC SILICON.pdf
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1、 REVISIONSLTR DESCRIPTION DATE APPROVEDA Update boilerplate paragraphs to current requirements. - PHN 11-02-01 David J. Corbett CURRENT DESIGN ACTIVITY CAGE CODE 16236 HAS CHANGED NAMES TO: DLA LAND AND MARITIME COLUMBUS, OHIO 43218-3990 Prepared in accordance with ASME Y14.24 Vendor item drawing RE
2、V PAGE REV PAGE REV STATUS OF PAGES REV A A A A A A A A A A A A A PAGE 1 2 3 4 5 6 7 8 9 10 11 12 13 PMIC N/A PREPARED BY Charles F. Saffle DEFENSE SUPPLY CENTER COLUMBUS COLUMBUS, OHIO 43218-3990 Original date of drawing CHECKED BY Charles F. Saffle TITLE MICROCIRCUIT, DIGITAL, HIGH-SPEED CMOS, 8-S
3、TAGE SYNCHRONOUS DOWN COUNTER, MONOLITHIC SILICON YY-MM-DD 04-04-12 APPROVED BY Thomas M. Hess SIZE A CODE IDENT. NO. 16236 DWG NO. V62/04702 REV PAGE 1 OF 13 AMSC N/A 5962-V035-11 .Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-DEFENSE SUPPLY CENTE
4、R, COLUMBUS COLUMBUS, OHIO SIZE A CODE IDENT NO. 16236 DWG NO. V62/04702 REV A PAGE 2 1. SCOPE 1.1 Scope. This drawing documents the general requirements of a high performance 8-stage synchronous down counter microcircuit, with an operating temperature range of -40C to +125C. 1.2 Vendor Item Drawing
5、 Administrative Control Number. The manufacturers PIN is the item of identification. The vendor item drawing establishes an administrative control number for identifying the item on the engineering documentation: V62/04702 - 01 X E Drawing Device type Case outline Lead finish number (See 1.2.1) (See
6、 1.2.2) (See 1.2.3) 1.2.1 Device type(s). Device type Generic Circuit function 01 CD74HC40103-EP 8-stage synchronous down counter 1.2.2 Case outlines. The case outlines are as specified herein. Outline letter Number of pins JEDEC PUB 95 Package style X 16 MS-012 Plastic small-outline1.2.3 Lead finis
7、hes. The lead finishes are as specified below or other lead finishes as provided by the device manufacturer: Finish designator Material A Hot solder dip B Tin-lead plateC Gold plateD PalladiumE Gold flash palladium Z Other 1.3 Absolute maximum ratings. 1/ Supply voltage range (VCC) . -0.5 V to +7 V
8、2/ Input clamp current (IIK) (VIVCC+0.5) 20 mA Output clamp current (IOK) (VOVCC+0.5) 20 mA Source or sink current per output pin (IO) (VO -0.5 or VO VCC+0.5) . 25 mA Continuous current through VCCor GND . 50 mA Package thermal impedance (JA) . 73C/W 3/ Maximum junction temperature (TJ) 150C Lead te
9、mperature (during soldering): At distance 1/16 1/32 inch (1.59 0.79 mm) from case for 10 s max. . 300C Storage temperature range (TSTG) . -65C to +150C _ 1/ Stresses beyond those listed under “absolute maximum rating” may cause permanent damage to the device. These are stress ratings only, and funct
10、ional operation of the device at these or any other conditions beyond those indicated under “recommended operating conditions” is not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability. 2/ All voltages are referenced to GND unless otherwise spec
11、ified. 3/ The package thermal impedance is calculated in accordance with JESD 51-7. Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-DEFENSE SUPPLY CENTER, COLUMBUS COLUMBUS, OHIO SIZE A CODE IDENT NO. 16236 DWG NO. V62/04702 REV A PAGE 3 1.4 Recommen
12、ded operating conditions. 4/ 5/ Supply voltage range (VCC) . 2 V to 6 V Minimum high level input voltage (VIH): VCC= 2 V . 1.5 V VCC= 4.5 V 3.15 V VCC= 6 V . 4.2 V Maximum low level input voltage (VIL): VCC= 2 V . 0.5 V VCC= 4.5 V 1.35 V VCC= 6 V . 1.8 V Input voltage range (VI) . 0 V to VCCOutput v
13、oltage range (VO) . 0 V to VCCInput transition (rise and fall) time (tt): VCC= 2 V . 0 to 1000 ns VCC= 4.5 V 0 to 500 ns VCC= 6 V . 0 to 400 ns Operating free-air temperature range (TA) -40C to +125C 2. APPLICABLE DOCUMENTS JEDEC PUB 95 - Registered and Standard Outlines for Semiconductor Devices JE
14、SD 51-7 - High Effective Thermal Conductivity Test Board for Leaded Surface Mount Packages (Applications for copies should be addressed to the Electronic Industries Alliance, 3103 North 10thSt., Suite 240-S, Arlington, VA 22201-2107 or online at http:/www.jedec.org) 3. REQUIREMENTS 3.1 Marking. Part
15、s shall be permanently and legibly marked with the manufacturers part number as shown in 6.3 herein and as follows: A. Manufacturers name, CAGE code, or logo B. Pin 1 identifier C. ESDS identification (optional) 3.2 Unit container. The unit container shall be marked with the manufacturers part numbe
16、r and with items A and C (if applicable) above. 3.3 Electrical characteristics. The maximum and recommended operating conditions and electrical performance characteristics are as specified in 1.3, 1.4, and table I herein. 4/ All unused inputs of the device must be held at VCCor GND to ensure proper
17、device operation. 5/ Use of this product beyond the manufacturers design rules or stated parameters is done at the users risk. The manufacturer and/or distributor maintain no responsibility or liability for product used beyond the stated limits. Provided by IHSNot for ResaleNo reproduction or networ
18、king permitted without license from IHS-,-,-DEFENSE SUPPLY CENTER, COLUMBUS COLUMBUS, OHIO SIZE A CODE IDENT NO. 16236 DWG NO. V62/04702 REV A PAGE 4 3.4 Design, construction, and physical dimension. The design, construction, and physical dimensions are as specified herein. 3.5 Diagrams. 3.5.1 Case
19、outline. The case outline shall be as shown in 1.2.2 and figure 1. 3.5.2 Function table. The function table shall be as shown in figure 2. 3.5.3 Logic diagram. The logic diagram shall be as shown in figure 3. 3.5.4 Terminal connections. The terminal connections shall be as shown in figure 4. 3.5.5 T
20、iming waveforms and test circuit. The timing waveforms and test circuit shall be as shown in figure 5. Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-DEFENSE SUPPLY CENTER, COLUMBUS COLUMBUS, OHIO SIZE A CODE IDENT NO. 16236 DWG NO. V62/04702 REV A
21、PAGE 5 TABLE I. Electrical performance characteristics. 1/ Test Symbol Conditions VCCTemperature, TADevice type Limits Unit Min Max High level output voltage VOHCMOS loads VI= VIHor VILIO= -0.02 mA 2 V 25C, -40C to 125C All 1.9 V 4.5 V 4.4 6 V 5.9 TTL loads VI= VIHor VIL, IO= -4 mA 4.5 V 25C 3.98 -4
22、0C to 125C 3.7 TTL loads VI= VIHor VIL, IO= -5.2 mA 6 V 25C 5.48 -40C to 125C 5.2 Low level output voltage VOLCMOS loads VI= VIHor VILIO= -0.02 mA 2 V 25C, -40C to 125C 0.1 V 4.5 V 0.1 6 V 0.1 TTL loads VI= VIHor VIL, IO= -4 mA 4.5 V 25C 0.26 -40C to 125C 0.4 TTL loads VI= VIHor VIL, IO= -5.2 mA 6 V
23、 25C 0.26 -40C to 125C 0.4 Input current IIVI= VCCor GND 6 V 25C 0.1 A -40C to 125C 1 Quiescent supply current ICCVI= VCCor GND IO= 0 mA 6 V 25C 8 A -40C to 125C 160 Input capacitance CINCL= 50 pF 25C 10 pF -40C to 125C 10 Power dissipation capacitance Cpd2/ Input tr, tf= 6 ns 5 V 25C 25 TYP pF Puls
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