BS IEC 60747-16-2-2001 Semiconductor devices - Microwave integrated circuits - Frequency prescalers《半导体装置 微波集成电路 频率预定标器》.pdf

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1、BRITISH STANDARD BS IEC 60747-16-2: 2001 Incorporating amendment no. 1 Semiconductor devices Part 16-2: Microwave integrated circuits Frequency prescalers ICS 31.080.01 BS IEC 60747-16-2:2001 This British Standard was published under the authority of the Standards Policy and Strategy Committee on 15

2、 August 2001 BSI 2007 ISBN 978 0 580 60882 7 National foreword This British Standard is the UK implementation of IEC 60747-16-2:2001, incorporating amendment 1:2007. The start and finish of text introduced or altered by amendment is indicated in the text by tags !“. Tags indicating changes to IEC te

3、xt carry the number of the IEC amendment. For example, text altered by IEC amendment 1 is indicated by !“. The UK participation in its preparation was entrusted to Technical Committee EPL/47, Semiconductors. A list of organizations represented on this committee can be obtained on request to its secr

4、etary. This publication does not purport to include all the necessary provisions of a contract. Users are responsible for its correct application. Compliance with a British Standard cannot confer immunity from legal obligations. Amendments issued since publication Amd. No. Date Comments 17498 31 Dec

5、ember 2007 See national forewordINTERNATIONAL STANDARD IEC 60747-16-2 First edition 2001-03 Semiconductor devices Part 16-2: Microwave integrated circuits Frequency prescalers Dispositifs semiconducteurs Partie 16-2: Circuits intgrs hyperfrquences Diviseurs pralables de frquence Reference number IEC

6、 60747-16-2:2001(E) BSIEC60747162:2001 100280ISB 2 60747-16-2 IEC:2001(E) CONTENTS FOREWORD 3 1 Scope 4 2 Normative references. 4 3 Terms and definitions 4 4 Essential ratings and characteristics 6 4.1 General 6 4.2 Application-related description 6 4.3 Specification of the function 7 4.4 Limiting v

7、alues (absolute maximum rating system) . 9 4.5 Operating conditions (within the specified operating temperature range)10 4.6 Electrical characteristics11 4.7 Mechanical and environmental ratings, characteristics and data 12 4.8 Additional information12 5 Measuring methods 13 5.1 General .13 5.2 Outp

8、ut power (P o )13 5.3 Output voltage (V o )14 5.4 Minimum operating input power (P i, min ).16 5.5 Maximum operating input power (P i, max ) .17 5.6 Minimum operating input voltage (V i, min ).19 5.7 Maximum operating input voltage (V i, max ) .22 5.8 Maximum input frequency (f i, max )24 5.9 Minimu

9、m input frequency (f i, min )25 5.10 High-level modulus control input voltage (V CH ) 26 5.11 Low-level modulus control input voltage (V CL ) .28 5.12 High-level modulus control input current (I CH )29 5.13 Low-level modulus control input current (I CL ).30 BSIEC60747162:2001 2 BSI 2007 3 INTERNATIO

10、NAL ELECTROTECHNICAL COMMISSION _ SEMICONDUCTOR DEVICES Part 16-2: Microwave integrated circuits Frequency prescalers FOREWORD 1) The IEC (International Electrotechnical Commission) is a worldwide organization for standardization comprising all national electrotechnical committees (IEC National Comm

11、ittees). The object of the IEC is to promote international co-operation on all questions concerning standardization in the electrical and electronic fields. To this end and in addition to other activities, the IEC publishes International Standards. Their preparation is entrusted to technical committ

12、ees; any IEC National Committee interested in the subject dealt with may participate in this preparatory work. International, governmental and non-governmental organizations liaising with the IEC also participate in this preparation. The IEC collaborates closely with the International Organization f

13、or Standardization (ISO) in accordance with conditions determined by agreement between the two organizations. 2) The formal decisions or agreements of the IEC on technical matters express, as nearly as possible, an international consensus of opinion on the relevant subjects since each technical comm

14、ittee has representation from all interested National Committees. 3) The documents produced have the form of recommendations for international use and are published in the form of standards, technical specifications, technical reports or guides and they are accepted by the National Committees in tha

15、t sense. 4) In order to promote international unification, IEC National Committees undertake to apply IEC International Standards transparently to the maximum extent possible in their national and regional standards. Any divergence between the IEC Standard and the corresponding national or regional

16、standard shall be clearly indicated in the latter. 5) The IEC provides no marking procedure to indicate its approval and cannot be rendered responsible for any equipment declared to be in conformity with one of its standards. 6) Attention is drawn to the possibility that some of the elements of this

17、 International Standard may be the subject of patent rights. The IEC shall not be held responsible for identifying any or all such patent rights. International Standard IEC 60747-16-2 has been prepared by subcommittee 47E: Discrete semiconductor devices, of IEC technical committee 47: Semiconductor

18、devices. The text of this standard is based on the following documents: FDIS Report on voting 47E/160/FDIS 47E/172/RVD Full information on the voting for the approval of this standard can be found in the report on voting indicated in the above table. This publication has been drafted in accordance w

19、ith the ISO/IEC Directives, Part 3. The committee has decided that the contents of this publication will remain unchanged until 2006. At this date, the publication will be reconfirmed; withdrawn; replaced by a revised edition, or amended. BSIEC60747162:2001 3 BSI 2007 4 SEMICONDUCTOR DEVICES Part 16

20、-2: Microwave integrated circuits Frequency prescalers 1 Scope This part of IEC 60747 provides new measuring methods, terminology and letter symbols, as well as essential ratings and characteristics for integrated circuit microwave frequency prescalers. 2 Normative references The following normative

21、 documents contain provisions which, through reference in this text, constitute provisions of this part of IEC 60747. For dated references, subsequent amend- ments to, or revisions of, any of these publications do not apply. However, parties to agreements based on this part of IEC 60747 are encourag

22、ed to investigate the possibility of applying the most recent editions of the normative documents indicated below. For undated references, the latest edition of the normative document referred to applies. Members of IEC and ISO maintain registers of currently valid International Standards. IEC 60748

23、-2, Semiconductor devices Integrated circuits Part 2: Digital integrated circuits IEC 60748-3, Semiconductor devices. Integrated circuits Part 3: Analogue integrated circuits IEC 60748-4, Semiconductor devices Integrated circuits Part 4: Interface integrated circuits 3 Terms and definitions For the

24、purpose of this part of IEC 60747, the following terms and definitions apply: 3.1 power supply voltage V xxi (terminal voltage) d.c. voltage required to be applied to an i-th terminal noted by xx 3.2 power supply current I xxi d.c. current flowing through an i-th terminal noted by xx 3.3 output powe

25、r a.c. power measured at the output terminal BSIEC60747162:2001 4 !IEC 60617:2001, Graphical symbols for diagrams IEC 60747-1:2006, Semiconductor devices Part 1: General“ !IEC 61340-5-1:2007, Electrostatics Part 5-1: Protection of electronic devices from electrostatic phenomena - General requirement

26、s IEC/TR 61340-5-2:2007, Electrostatics Part 5-2: Protection of electronic devices from electrostatic phenomena User guide “ ! P o “ BSI 200764707-61-2 EI:C002(1)E 5 3.4 output voltage V o amplitude of voltage swing measured at the output terminal 3.5 input power P i a.c. power delivered to the inpu

27、t terminal 3.6 input voltage V i amplitude of input voltage swing 3.7 high-level modulus control input voltage V CH control voltage value to transfer the division ratio from low-level modulus to high-level modulus 3.8 low-level modulus control input voltage V CL control voltage value to transfer the

28、 division ratio from high-level modulus to low-level modulus 3.9 high-level modulus control input current I CH control current value to transfer the division ratio from low-level modulus to high-level modulus 3.10 low-level modulus control input current I CL control current value to transfer the div

29、ision ratio from high-level modulus to low-level modulus 3.11 input frequency f i input frequency for which the device functions 3.12 division ratio N ratio of the output frequency and input frequency 3.13 set-up time t set (under consideration) BSIEC60747162:2001 5 BSI 2007 6 60747-16-2 IEC:2001(E)

30、 4 Essential ratings and characteristics 4.1 General This clause gives ratings and characteristics required for specifying integrated circuit microwave frequency prescalers used at the microwave or millimetre-wave frequency band. The integrated circuits contain fixed and two modulus prescalers. 4.1.

31、1 Circuit identification and types 4.1.1.1 Designation and types Indication of type (device name), category of circuit and technology applied should be given. Microwave frequency prescalers are divided into two categories: type A: fixed modulus type; type B: two modulus type. 4.1.1.2 General functio

32、n description A general description should be made of the function performed by the integrated circuit microwave frequency prescalers, and the features for the application. 4.1.1.3 Manufacturing technology The manufacturing technology, e.g. semiconductor monolithic integrated circuit, thin film inte

33、grated circuit, micro-assembly, should be stated. This statement should include details of the semiconductor technologies such as MESFET, MISFET, MOSFET, Si bipolar transistor, HBT, etc. 4.1.1.4 Package identification The following should be stated: a) chip or packaged form; b) IEC and/or national r

34、eference number of the outline drawing or of the drawing of a non- standard package including terminal numbering; c) principal package material, for example, metal, ceramic, plastic; d) for chip form, outlines, dimensions, pad sizes, contact material, and recommended contact technologies. 4.1.1.5 Ma

35、in application The main application should be stated if necessary. If the device has restrictive applications, these should be stated here. 4.2 Application-related description Information on the application of the integrated circuit and its relation to the associated devices should be given. BSIEC60

36、747162:2001 6 BSI 200764707-61-2 EI:C002(1)E 7 4.2.1 Conformance to system and/or interface information It should be stated whether the integrated circuit conforms to an application system and/or an interface standard or recommendation. Detailed information about application systems, equipment and c

37、ircuits such as VSAT systems, DBS receivers, and microwave landing systems should also be given. 4.2.2 Overall block diagram A block diagram of the applied systems should be given if necessary. 4.2.3 Reference data The most important properties required to permit comparison between derivative types

38、should be given. 4.2.4 Electrical compatibility It should be stated whether the integrated circuit is electrically compatible with other particular integrated circuits or families of integrated circuits, or whether special interfaces are required. Details should be given concerning the type of input

39、 and output circuits, for example, input/output impedances, d.c. block, open-drain. Interchangeability with other devices, if any, should be given. 4.2.5 Associated devices If applicable, the following should be stated here: devices necessary for correct operation (list with type number, name, and f

40、unction); peripheral devices with direct interfacing (list with type number, name, and function). 4.3 Specification of the function 4.3.1 Detailed block diagram-functional blocks A detail block diagram or equivalent circuit information concerning the integrated circuit microwave frequency prescalers

41、 should be given. The block diagram should be composed of the following: a) functional blocks; b) mutual interconnections among the functional blocks; c) individual functional units within the functional blocks; d) mutual interconnections among the individual functional blocks; e) function of each e

42、xternal connection; f) inter-dependence between the separate functional blocks. The block diagram should identify the function of each external connection, and where no ambiguity can arise, can also show the terminal symbols and/or numbers. If the encapsulation has metallic parts, any connection to

43、them from external terminals should be indicated. The connections with any associated external electrical elements should be stated, where necessary. BSIEC60747162:2001 7 BSI 2007 8 60747-16-2 IEC:2001(E) For the purpose of providing additional information, the complete electrical circuit diagram ca

44、n be reproduced, though this will not necessarily involve giving indications of the function. Rules governing such diagrams may be obtained from 4.3.2 Identification and function of terminals All terminals should be identified on the block diagram (supply terminals, input or output terminals, input/

45、output terminals). The terminal functions 1) to 4) should be indicated in a table as follows: Function of terminal Terminal number Terminal symbol 1) Terminal designation 2) Function 3) Input/output identification 4) Type of input/output circuits 1) Terminal designation A terminal name indicating th

46、e function of the terminal should be given. Supply terminals, ground terminals, blank terminals (with abbreviation NC) and non-usable terminals (with abbreviation NU) should be distinguished. 2) Function A brief indication of terminal function should be given: each function of multi-role terminals,

47、i.e. terminals having multiple functions; each function of integrated circuits selected by mutual pin connections or function selection data applied to the function selection pin such as mode selection pin. 3) Input/output identification Input, output, input/output, and multiple input/output termina

48、ls should be distinguished. 4) Type of input/output circuits The type of input and output circuits, for example, input/output impedances, with or without d.c. block, etc., should be distinguished. 5) Type of ground If the baseplate of the package is used as ground, this should be stated. Example: In

49、tegrated circuit microwave frequency prescalers Supply voltages NC Output(s) Input(s) NU Ground IEC 113/01 BSIEC60747162:2001 8 ! IEC 60617“. BSI 200764707-61-2 EI:C002(1)E 9 4.3.3 Functional description The function performed by the circuit should be specified and include the following information: basic functi