BS EN 62610-4-2013 Mechanical structures for electronic equipment Thermal management for cabinets in accordance with IEC 60297 and IEC 60917 series Cooling performance tests for wae.pdf

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1、BSI Standards PublicationMechanical structures for electronic equipment Thermal management for cabinets in accordance with IEC 60297 and IEC 60917 seriesPart 4: Cooling performance tests for water supplied heat exchangers in electronic cabinetsBS EN 62610-4:2013National forewordThis British Standard

2、 is the UK implementation of EN 62610-4:2013. It isidentical to IEC 62610-4:2013.The UK participation in its preparation was entrusted to TechnicalCommittee EPL/48, Electromechanical components and mechanical structures for electronic equipment.A list of organizations represented on this committee c

3、an be obtained onrequest to its secretary.This publication does not purport to include all the necessary provisions ofa contract. Users are responsible for its correct application. The British Standards Institution 2013.Published by BSI Standards Limited 2013ISBN 978 0 580 72855 6ICS 31.240Complianc

4、e with a British Standard cannot confer immunity fromlegal obligations.This British Standard was published under the authority of theStandards Policy and Strategy Committee on 30 November 2013.Amendments/corrigenda issued since publicationDate Text affectedBRITISH STANDARDBS EN 62610-4:2013EUROPEAN

5、STANDARD EN 62610-4 NORME EUROPENNE EUROPISCHE NORM November 2013 CENELEC European Committee for Electrotechnical Standardization Comit Europen de Normalisation Electrotechnique Europisches Komitee fr Elektrotechnische Normung CEN-CENELEC Management Centre: Avenue Marnix 17, B - 1000 Brussels 2013 C

6、ENELEC - All rights of exploitation in any form and by any means reserved worldwide for CENELEC members. Ref. No. EN 62610-4:2013 E ICS 31.240 English version Mechanical structures for electronic equipment - Thermal management for cabinets in accordance with IEC 60297 and IEC 60917 series - Part 4:

7、Cooling performance tests for water supplied heat exchangers in electronic cabinets (IEC 62610-4:2013) Structures mcaniques pour quipements lectroniques Gestion thermique pour les armoires conformes aux sries CEI 60297 et CEI 60917 Partie 4: Essais de performances de refroidissement pour les changeu

8、rs de chaleur aliments par de leau dans des baies lectroniques (CEI 62610-4:2013) Mechanische Bauweisen fr elektronische Einrichtungen - Wrmemanagement fr Schrnke nach den Reihen IEC 60297 und IEC 60917 - Teil 4: Khlleistungsprfungen fr Wasser-Wrmetauscher in Elektronikschrnken (IEC 62610-4:2013) Th

9、is European Standard was approved by CENELEC on 2013-09-19. CENELEC members are bound to comply with the CEN/CENELEC Internal Regulations which stipulate the conditions for giving this European Standard the status of a national standard without any alteration. Up-to-date lists and bibliographical re

10、ferences concerning such national standards may be obtained on application to the CEN-CENELEC Management Centre or to any CENELEC member. This European Standard exists in three official versions (English, French, German). A version in any other language made by translation under the responsibility o

11、f a CENELEC member into its own language and notified to the CEN-CENELEC Management Centre has the same status as the official versions. CENELEC members are the national electrotechnical committees of Austria, Belgium, Bulgaria, Croatia, Cyprus, the Czech Republic, Denmark, Estonia, Finland, Former

12、Yugoslav Republic of Macedonia, France, Germany, Greece, Hungary, Iceland, Ireland, Italy, Latvia, Lithuania, Luxembourg, Malta, the Netherlands, Norway, Poland, Portugal, Romania, Slovakia, Slovenia, Spain, Sweden, Switzerland, Turkey and the United Kingdom. BS EN 62610-4:2013EN 62610-4:2013 - 2 -

13、Foreword The text of document 48D/542/FDIS, future edition 1 of IEC 62610-4, prepared by SC 48D, “Mechanical structures for electronic equipment“, of IEC TC 48, “Electromechanical components and mechanical structures for electronic equipment“ was submitted to the IEC-CENELEC parallel vote and approv

14、ed by CENELEC as EN 62610-4:2013. The following dates are fixed: latest date by which the document has to be implemented at national level by publication of an identical national standard or by endorsement (dop) 2014-06-19 latest date by which the national standards conflicting with the document hav

15、e to be withdrawn (dow) 2016-09-19 Attention is drawn to the possibility that some of the elements of this document may be the subject of patent rights. CENELEC and/or CEN shall not be held responsible for identifying any or all such patent rights. Endorsement notice The text of the International St

16、andard IEC 62610-4:2013 was approved by CENELEC as a European Standard without any modification. BS EN 62610-4:2013- 3 - EN 62610-4:2013 Annex ZA (normative) Normative references to international publications with their corresponding European publications The following documents, in whole or in part

17、, are normatively referenced in this document and are indispensable for its application. For dated references, only the edition cited applies. For undated references, the latest edition of the referenced document (including any amendments) applies. NOTE When an international publication has been mod

18、ified by common modifications, indicated by (mod), the relevant EN/HD applies. Publication Year Title EN/HD Year IEC 60297 Series Mechanical structures for electronic equipment - Dimensions of mechanical structures of the 482,6 mm (19 in) series EN 60297 Series IEC 60917 Series Modular order for the

19、 development of mechanical structures for electronic equipment practices EN 60917 Series BS EN 62610-4:2013 2 62610-4 IEC:2013 CONTENTS INTRODUCTION . 5 1 Scope and object 6 2 Normative references . 6 3 Terms and definitions, symbols and units . 6 3.1 Terms and definitions 6 3.2 Symbols and units .

20、7 4 Performance test for the heat exchanger 8 4.1 General . 8 4.2 Test setup . 9 Test room 9 4.2.1Simulating the equipment heat load in the test sample. 9 4.2.2Chilled-water flow rate and temperatures . 10 4.2.3Measurement of the air temperature 10 4.2.4Temperature difference between chilled water s

21、upply and equipment 4.2.5air inlet temperature 11 4.3 Assessment of the heat exchanger performance . 11 Determination of the cooling capacity by means of simplified tests 11 4.3.1Determination of the cooling capacity by way of an extended test 12 4.3.2Complete identification of the cooling capacity.

22、 14 4.3.34.4 Electrical power consumption 16 4.5 Water circuit pressure resistance 16 Annex A (normative) Test conditions 17 Annex B (normative) Test results . 18 Figure 1 Principle of the heat exchanger performance test . 9 Figure 2 Test setup of simplified tests 12 Figure 3 Test setup of extended

23、tests 14 Figure 4 Test setup, test for complete identification of the cooling capacity 15 Figure 5 Diagram of electrical power consumption versus cooling capacity 16 Figure 6 Diagram of water pressure resistance versus water flow rate . 16 Figure B.1 System cooling capacity and water flow rate . 19

24、Table B.1 Test result recording template 18 Table B.2 Test for closed air loop air to water heat exchanger for high density cooling systems for IT equipment and server cooling 19 BS EN 62610-4:201362610-4 IEC:2013 5 INTRODUCTION Electronic cabinets of the IEC 60297 and IEC 60917 series are used for

25、the housing of electronic devices in many different fields of application. A wide field of application is represented by installations of communication networks with electronic devices in information technology (IT) environments. The classic way is to install rows of cabinets into defined foot print

26、 patterns and interconnect them via cables managed from overhead cable trays or raised floor cable management. So far, cooling has been facilitated by equipping the entire IT room with air conditioning in order to provide for air flow and air temperatures required for the safe operation of the elect

27、ronic devices. With the growing heat load in data centers, this form of cooling has become more and more inefficient. Thermal problems with respect to high-performance electronic devices have become more difficult to solve. The environmental aspect is gaining crucial importance forcing us to cut dow

28、n on wasting resources and to reduce CO2emissions. Alternatives to the air conditioning of rooms need to be looked at more closely. Under the aspect of increasing cooling efficiency, there are some major concepts, two cases serve as examples here: Case 1. The equipped group of cabinets, with dedicat

29、ed temperature control. This method is the cold aisles / hot aisles arrangement of a smaller number of cabinets, typically four to twelve. Its advantage over the air conditioning of rooms is the smaller air volume which allows a focused heat management with optimised dimensioning of power consumptio

30、n for the cooling devices and increased temperatures in the warm zones of the room. In such cases, efficiency can be increased by adopting exhaust heat recovery for room heating in cold periods. Due to the improved energy efficiency contained aisles are becoming more and more popular. Case 2. Single

31、 cabinets with water-air heat exchangers. This method is used for cabinets accommodating high-performance/heat dissipating electronic equipment, typically servers and mainframe computers. Its advantage over the room air conditioning or cold aisles consists in the high degree of constant air inlet te

32、mperature for sensitive electronic devices. Closed air circulation within a cabinet allows a very precise temperature control. The power consumption aspect may be similar to that of the cold aisle, but the temperature control aspect is more important and favourable to a longer life-cycle of costly e

33、quipment. This standard has been created for case 2: Cooling performance tests for water-supplied heat exchangers in single electronic cabinet configurations. The parameters with reference to the described test sample are shown in diagrams which may be useful to provide for a standardized calculatio

34、n method for specific cabinet dimensions and heat exchanger cooling requirements. The typical required cooling capacity for such cabinets is normally higher than 12 kW. The described test methods of this standard address a cooling capacity of more than 12 kW. However, since IT equipment varies the h

35、eat load to a cabinet the test also considers values below 12 kW for partial heat load. BS EN 62610-4:2013 6 62610-4 IEC:2013 MECHANICAL STRUCTURES FOR ELECTRONIC EQUIPMENT THERMAL MANAGEMENT FOR CABINETS IN ACCORDANCE WITH IEC 60297 AND IEC 60917 SERIES Part 4: Cooling performance tests for water s

36、upplied heat exchangers in electronic cabinets 1 Scope and object This part of IEC 62610 specifies the test setup and test parameters for water supplied heat exchangers within single electronic cabinet configurations. The tests are focused on cabinets for the installation of high power dissipation e

37、lectronic equipment. The cabinets concerned are from the IEC 60297 (19 in) and IEC 60917 (25 mm) series. The purpose of this standard is to provide comparable data for the cooling performance of cabinets according to defined test setups and cooling parameters. 2 Normative references The following do

38、cuments, in whole or in part, are normatively referenced in this document and are indispensable for its application. For dated references, only the edition cited applies. For undated references, the latest edition of the referenced document (including any amendments) applies. IEC 60297 (all parts),

39、Dimensions of mechanical structures of the 482,6 mm (19 in) series IEC 60917 (all parts), Modular order for the development of mechanical structures for electronic equipment practices 3 Terms and definitions, symbols and units 3.1 Terms and definitions For the purposes of this document, the followin

40、g terms and definitions apply. 3.1.1cooling capacity Qremoved heat load given by the electronic equipment mounted inside the electronic cabinet kW 3.1.2absolute humidity mass content of water (gram of water) per defined mass of dry air (kilogram of air) g/kg g of water per kg dry air 3.1.3dummy devi

41、ce to generate heat load similar to most common electronic devices in information technology: horizontal air flow with air intake at the front and air outlet at the rear side of the equipment. BS EN 62610-4:201362610-4 IEC:2013 7 Note 1 to entry: The air flow orientation is defined in IEC 60297 (19

42、in) and IEC 60917 (25 mm) standard series cabinet design. 3.1.4sensible cooling cooling capacity to provide air temperature change only. The absolute humidity of air in sensible cooling process is unchanged. 3.1.5simplified test this test method does not consider the influence of the heat transfer t

43、hrough the walls of the electronic cabinet nor the heat transfer by leaking air in and out of the housing of the electronic equipment 3.1.6extended test this test method does not consider the heat transfer by leaking air in and out of the housing of the electronic equipment 3.2 Symbols and units elP

44、 electrical power consumption kW T Temperature C airQheat flow of the cooling air kW airv air velocity (test result) m/s airA air cross-section m2 air air density (related to 101,325 kPa air pressure) kg/m3 airpc,specific heat capacity of air kJ/kgK T temperature difference K CWT temperature differe

45、nce of the chilled water between supply and return K airT temperature difference of the cooling air between equipment air inlet and air outlet K ffactor based on specific heat capacity of water l/s, l/min, m3/h CWQheat flow in chilled water kW CWVchilled-water flow l/s, l/min, m3/h Qcooling capacity

46、 kW SQcooling capacity of the IT equipment kW BS EN 62610-4:2013 8 62610-4 IEC:2013 4 Performance test for the heat exchanger 4.1 General For testing the heat exchanger performance, the following parameters shall be applied: The heat load of the dummy equipment shall be unchanged during the test. Th

47、e heat dissipation of the heat load dummies shall be measured during the test and be recorded in the test report as the main result of the test according to Table B.1. The determination of the heat dissipation of the heat load shall be measured in accordance to the electrical power consumption. Duri

48、ng all measurements all control function and algorithm of the tested unit shall be disabled. The air temperature in front of the electronic equipment (between its front panel and door) shall be in the range defined in Annex A, with a max. tolerance of 1 K at the different temperature sensors. The te

49、mperature difference between air inlet and air outlet of the dummy heat loads shall be equal or less than the temperature difference defined in Annex A. The measured temperature difference during the test shall be recorded in the test report. The temperature difference of the air temperature in the test report shall be determined with an accuracy of 0,2 K. The maximum temperature difference between the chilled water supply temperature and air inlet te