BS EN 62321-2-2014 Determination of certain substances in electrotechnical products Disassembly disjointment and mechanical sample preparation《电工技术产品中某些物质的测定 拆卸 拆分和机械样品制备》.pdf

《BS EN 62321-2-2014 Determination of certain substances in electrotechnical products Disassembly disjointment and mechanical sample preparation《电工技术产品中某些物质的测定 拆卸 拆分和机械样品制备》.pdf》由会员分享，可在线阅读，更多相关《BS EN 62321-2-2014 Determination of certain substances in electrotechnical products Disassembly disjointment and mechanical sample preparation《电工技术产品中某些物质的测定 拆卸 拆分和机械样品制备》.pdf（54页珍藏版）》请在麦多课文档分享上搜索。

1、BSI Standards PublicationDetermination of certain substances in electrotechnicalproductsPart 2: Disassembly, disjointment and mechanical sample preparationBS EN 62321-2:2014The UK participation in its preparation was entrusted to TechnicalCommittee GEL/111, Electrotechnical environment committee.A l

2、ist of organizations represented on this committee can be obtained onrequest to its secretary.This publication does not purport to include all the necessary provisions ofa contract. Users are responsible for its correct application. The British Standards Institution 2014.Published by BSI Standards L

3、imited 2014ISBN 978 0 580 71851 9Compliance with a British Standard cannot confer immunity fromlegal obligations.This British Standard was published under the authority of theStandards Policy and Strategy Committee on 31 May 2014.Amendments/corrigenda issued since publicationDate Text affectedNation

4、al forewordBRITISH STANDARDBS EN 62321-2:2014This British Standard is the UK implementation of EN 62321-2:2014. It is identical to IEC 62321-2:2013. Together with BS EN 62321-1:2013, BS EN 62321-3-1:2014, BS EN 62321-3-2:2014, BS EN 62321-4:2014, BS EN 62321-5:2014, BS EN 62321-6, BS EN 62321-7-1, B

5、S EN 62321-7-2 andBS EN 62321-8 it supersedes BS EN 62321:2009, which will be withdrawnupon publication of all parts of the BS EN 62321 series.ICS 13.020.40; 29.020; 31.020 EUROPEAN STANDARD EN 62321-2 NORME EUROPENNE EUROPISCHE NORM April 2014 CENELEC European Committee for Electrotechnical Standar

6、dization Comit Europen de Normalisation Electrotechnique Europisches Komitee fr Elektrotechnische Normung CEN-CENELEC Management Centre: Avenue Marnix 17, B - 1000 Brussels 2014 CENELEC - All rights of exploitation in any form and by any means reserved worldwide for CENELEC members. Ref. No. EN 6232

7、1-2:2014 E ICS 13.020; 43.040.10 Supersedes EN 62321:2009 (partially) English version Determination of certain substances in electrotechnical products - Part 2: Disassembly, disjointment and mechanical sample preparation (IEC 62321-2:2013) Dtermination de certaines substances dans les produits lectr

8、otechniques - Partie 2: Dmontage, dsassemblage et prparation mcanique de lchantillon (CEI 62321-2:2013) Verfahren zur Bestimmung von bestimmten Substanzen in Produkten der Elektrotechnik - Teil 2: Demontage, Zerlegung und mechanische Probenvorbereitung (IEC 62321-2:2013) This European Standard was a

9、pproved by CENELEC on 2013-11-15. CENELEC members are bound to comply with the CEN/CENELEC Internal Regulations which stipulate the conditions for giving this European Standard the status of a national standard without any alteration. Up-to-date lists and bibliographical references concerning such n

10、ational standards may be obtained on application to the CEN-CENELEC Management Centre or to any CENELEC member. This European Standard exists in three official versions (English, French, German). A version in any other language made by translation under the responsibility of a CENELEC member into it

11、s own language and notified to the CEN-CENELEC Management Centre has the same status as the official versions. CENELEC members are the national electrotechnical committees of Austria, Belgium, Bulgaria, Croatia, Cyprus, the Czech Republic, Denmark, Estonia, Finland, Former Yugoslav Republic of Maced

12、onia, France, Germany, Greece, Hungary, Iceland, Ireland, Italy, Latvia, Lithuania, Luxembourg, Malta, the Netherlands, Norway, Poland, Portugal, Romania, Slovakia, Slovenia, Spain, Sweden, Switzerland, Turkey and the United Kingdom. BS EN 62321-2:2014EN 62321-2:2014 - 2 - Foreword The text of docum

13、ent 111/301/FDIS, future edition 1 of IEC 62321-2, prepared by IEC/TC 111 “Environmental standardization for electrical and electronic products and systems“ was submitted to the IEC-CENELEC parallel vote and approved by CENELEC as EN 62321-2:2014. The following dates are fixed: latest date by which

14、the document has to be implemented at national level by publication of an identical national standard or by endorsement (dop) 2014-10-25 latest date by which the national standards conflicting with the document have to be withdrawn (dow) 2016-11-15 EN 62321-2:2014 is a partial replacement of EN 6232

15、1:2009, forming a structural revision and generally replacing Clause 5 and incorporating IEC/PAS 62596:2009 11)which will be withdrawn upon publication of IEC 62321-2. Future parts in the EN 62321 series will gradually replace the corresponding clauses in EN 62321:2009. Until such time as all parts

16、are published, however, EN 62321:2009 remains valid for those clauses not yet re-published as a separate part. Attention is drawn to the possibility that some of the elements of this document may be the subject of patent rights. CENELEC and/or CEN shall not be held responsible for identifying any or

17、 all such patent rights. Endorsement notice The text of the International Standard IEC 62321-2:2013 was approved by CENELEC as a European Standard without any modification. In the official version, for Bibliography, the following notes have to be added for the standards indicated: IEC 62554 NOTE Har

18、monised as EN 62554 (not modified). IEC 62542 NOTE Harmonised as EN 62542 (not modified). IEC 62321-6 NOTE Harmonised as EN 62321-6 (not modified). IEC 62321-7-1 NOTE Harmonised as EN 62321-7-1 (not modified). IEC 62137-1-2 NOTE Harmonised as EN 62137-1-2 (not modified). 1)Numbers in square brackets

19、 refer to the Bibliography. BS EN 62321-2:2014EN 62321-2:2014 - 2 - Foreword The text of document 111/301/FDIS, future edition 1 of IEC 62321-2, prepared by IEC/TC 111 “Environmental standardization for electrical and electronic products and systems“ was submitted to the IEC-CENELEC parallel vote an

20、d approved by CENELEC as EN 62321-2:2014. The following dates are fixed: latest date by which the document has to be implemented at national level by publication of an identical national standard or by endorsement (dop) 2014-10-25 latest date by which the national standards conflicting with the docu

21、ment have to be withdrawn (dow) 2016-11-15 EN 62321-2:2014 is a partial replacement of EN 62321:2009, forming a structural revision and generally replacing Clause 5 and incorporating IEC/PAS 62596:2009 11)which will be withdrawn upon publication of IEC 62321-2. Future parts in the EN 62321 series wi

22、ll gradually replace the corresponding clauses in EN 62321:2009. Until such time as all parts are published, however, EN 62321:2009 remains valid for those clauses not yet re-published as a separate part. Attention is drawn to the possibility that some of the elements of this document may be the sub

23、ject of patent rights. CENELEC and/or CEN shall not be held responsible for identifying any or all such patent rights. Endorsement notice The text of the International Standard IEC 62321-2:2013 was approved by CENELEC as a European Standard without any modification. In the official version, for Bibl

24、iography, the following notes have to be added for the standards indicated: IEC 62554 NOTE Harmonised as EN 62554 (not modified). IEC 62542 NOTE Harmonised as EN 62542 (not modified). IEC 62321-6 NOTE Harmonised as EN 62321-6 (not modified). IEC 62321-7-1 NOTE Harmonised as EN 62321-7-1 (not modifie

25、d). IEC 62137-1-2 NOTE Harmonised as EN 62137-1-2 (not modified). 1)Numbers in square brackets refer to the Bibliography. BS EN 62321-2:2014- 3 - EN 62321-2:2014 Annex ZA (normative) Normative references to international publications with their corresponding European publications The following docum

26、ents, in whole or in part, are normatively referenced in this document and are indispensable for its application. For dated references, only the edition cited applies. For undated references, the latest edition of the referenced document (including any amendments) applies. NOTE When an international

27、 publication has been modified by common modifications, indicated by (mod), the relevant EN/HD applies. Publication Year Title EN/HD Year IEC 62321-1 - Determination of certain substances in electrotechnical products - Part 1: Introduction and overview EN 62321-1 - IEC 62321-3-1 - Determination of c

28、ertain substances in electrotechnical products - Part 3-1: Screening electrotechnical products for lead, mercury, cadmium, total chromium and total bromine using X-ray Fluorescence Spectrometry EN 62321-3-1 - IEC 62321-3-2 - Determination of certain substances in electrotechnical products - Part 3-2

29、: Screening of total bromine in electric and electronic products by combustion-ion chromatography (C-IC) EN 62321-3-2 - IEC 62321-4 - Determination of certain substances in electrotechnical products - Part 4: Determination of mercury in polymers, metals and electronics by CV-AAS, CV-AFS, ICP-OES and

30、 ICP-MS EN 62321-4 - IEC 62321-5 - Determination of certain substances in electrotechnical products - Part 5: Determination of cadmium, lead and chromium in polymers and electronics, and cadmium and lead in metals by AAS, AFS, ICP-OES and ICP-MS EN 62321-5 - BS EN 62321-2:2014 2 62321-2 IEC:2013 CON

31、TENTS INTRODUCTION . 6 1 Scope . 7 2 Normative references . 7 3 Terms, definitions and abbreviations 8 3.1 Terms and definitions 8 3.2 Abbreviations 8 4 Introduction to sampling . 9 4.1 Introductory remark . 9 4.2 Requirements and concerns for substances of concern . 9 4.3 Complexity of electrotechn

32、ical products and related challenges. 9 4.4 Strategies for sampling 10 5 Sampling 13 5.1 Introductory remark . 13 5.2 Complete product 14 5.3 Partial disassembly . 14 5.4 Complete disassembly . 14 5.5 Partial disjointment 14 5.6 Complete disjointment . 15 5.7 Considerations of sampling and disjointm

33、ent . 15 5.7.1 Introductory remark . 15 5.7.2 Sample size required . 15 5.7.3 Sample size versus detection limit . 17 5.7.4 Composite testing of disjointable samples . 17 5.7.5 Non-uniform “homogeneous materials” 18 5.7.6 Determination of sampling position of homogeneous materials 19 6 Conclusions a

34、nd recommendations for sampling 19 7 Mechanical sample preparation 20 7.1 Overview . 20 7.1.1 Field of application 20 7.1.2 Quality assurance 20 7.2 Apparatus, equipment and materials 21 7.3 Procedure . 21 7.3.1 Manual cutting . 21 7.3.2 Coarse grinding/milling 22 7.3.3 Homogenizing 22 7.3.4 Fine gr

35、inding/milling 22 7.3.5 Very fine grinding of polymers and organic materials . 22 Annex A (informative) Examples of procedures for sampling and disjointment . 23 Annex B (informative) Probability of the presence of certain substances 32 Annex C (informative) Composite testing and sampling 35 Annex D

36、 (informative) Tools used in sampling 38 Annex E (informative) Examples of mobile phone disassembly and component disjointment 39 Bibliography 50 BS EN 62321-2:2014 2 62321-2 IEC:2013 CONTENTS INTRODUCTION . 6 1 Scope . 7 2 Normative references . 7 3 Terms, definitions and abbreviations 8 3.1 Terms

37、and definitions 8 3.2 Abbreviations 8 4 Introduction to sampling . 9 4.1 Introductory remark . 9 4.2 Requirements and concerns for substances of concern . 9 4.3 Complexity of electrotechnical products and related challenges. 9 4.4 Strategies for sampling 10 5 Sampling 13 5.1 Introductory remark . 13

38、 5.2 Complete product 14 5.3 Partial disassembly . 14 5.4 Complete disassembly . 14 5.5 Partial disjointment 14 5.6 Complete disjointment . 15 5.7 Considerations of sampling and disjointment . 15 5.7.1 Introductory remark . 15 5.7.2 Sample size required . 15 5.7.3 Sample size versus detection limit

39、. 17 5.7.4 Composite testing of disjointable samples . 17 5.7.5 Non-uniform “homogeneous materials” 18 5.7.6 Determination of sampling position of homogeneous materials 19 6 Conclusions and recommendations for sampling 19 7 Mechanical sample preparation 20 7.1 Overview . 20 7.1.1 Field of applicatio

40、n 20 7.1.2 Quality assurance 20 7.2 Apparatus, equipment and materials 21 7.3 Procedure . 21 7.3.1 Manual cutting . 21 7.3.2 Coarse grinding/milling 22 7.3.3 Homogenizing 22 7.3.4 Fine grinding/milling 22 7.3.5 Very fine grinding of polymers and organic materials . 22 Annex A (informative) Examples

41、of procedures for sampling and disjointment . 23 Annex B (informative) Probability of the presence of certain substances 32 Annex C (informative) Composite testing and sampling 35 Annex D (informative) Tools used in sampling 38 Annex E (informative) Examples of mobile phone disassembly and component

42、 disjointment 39 Bibliography 50 BS EN 62321-2:201462321-2 IEC:2013 3 Figure 1 Generic iterative procedure for sampling 11 Figure 2 Cross-section of a 900 m wide lead oxide-based resistor (SMD) 19 Figure A.1 Methodology for sampling and disjointment . 24 Figure A.2 Sampling of DVD player 25 Figure A

43、.3 Sampling of CRT 26 Figure A.4 Sampling of LCD TV . 27 Figure A.5 Sampling of PDA/phone 28 Figure A.6 Sampling of desk fan 29 Figure A.7 Sampling of components Thick film resistor . 30 Figure A.8 Sampling of components SMD potentiometer . 31 Figure D.1 Hot gas gun for removing the electronic compo

44、nents 38 Figure D.2 Vacuum pin to remove the target electronic devices . 38 Figure E.1 Mobile phone type A with battery charger and camera lens cap 39 Figure E.2 Mobile phone type A with battery and back cover removed . 40 Figure E.3 Partial disassembly of a mobile phone (type B) into its major comp

45、onents 41 Figure E.4 Complete disassembly of the key pad . 42 Figure E.5 Complete disassembly of the bottom housing . 42 Figure E.6 Complete disassembly of the other housing/frame 43 Figure E.7 Components of the TFT display of the mobile phoneafter partial disjointment 43 Figure E.8 Components of th

46、e main PWB of the mobile phone after partial disjointment 44 Figure E.9 Disjointment of lead frame component 46 Figure E.10 BGA package prior to disjointment 47 Figure E.11 BGA package disjointed by the hand removal procedure . 47 Figure E.12 Solder ball material collected from BGA using a hand remo

47、val procedure . 48 Figure E.13 BGA solder ball removal using the ball shear procedure . 48 Table 1 Minimum number of lead frame samples required for analytical testing . 16 Table 2 Levels of a certain substance in a composite sample 18 Table B.1 Probability of the presence of certain substances in m

48、aterials and components used in electrotechnical products (1 of 3) 32 Table C.1 Calculated maximum concentration for a composite sample based on detection limit . 36 Table C.2 Required detection limit for a composite sample based on the maximum allowable concentration 37 Table E.1 Possible certain s

49、ubstances or screening substances from a mobile phone . 40 Table E.2 Possible certain substances in major components of the mobile phone 41 Table E.3 Examples of disjointment for typical small electronic components 45 BS EN 62321-2:2014 6 62321-2 IEC:2013 INTRODUCTION The widespread use of electrotechnical products has drawn increased attention to their impact on the environment. In many countries this has resulted in the adaptation of regulations affecting wastes, subs