BS EN 62137-3-2012 Electronics assembly technology Selection guidance of environmental and endurance test methods for solder joints《电子装配技术 焊缝用环境和耐久性试验方法的选择指南》.pdf

《BS EN 62137-3-2012 Electronics assembly technology Selection guidance of environmental and endurance test methods for solder joints《电子装配技术 焊缝用环境和耐久性试验方法的选择指南》.pdf》由会员分享，可在线阅读，更多相关《BS EN 62137-3-2012 Electronics assembly technology Selection guidance of environmental and endurance test methods for solder joints《电子装配技术 焊缝用环境和耐久性试验方法的选择指南》.pdf（47页珍藏版）》请在麦多课文档分享上搜索。

1、raising standards worldwideNO COPYING WITHOUT BSI PERMISSION EXCEPT AS PERMITTED BY COPYRIGHT LAWBSI Standards PublicationElectronics assembly technologyPart 3: Selection guidance of environmental and endurance test methods for solder jointsBS EN 62137-3:2012National forewordThis British Standard is

2、 the UK implementation of EN 62137-3:2012. It is identical to IEC 62137-3:2011. It supersedes DD IEC/PAS 62137-3:2008 which is withdrawn.The UK participation in its preparation was entrusted to Technical Committee EPL/501, Electronic assembly technology.A list of organizations represented on this co

3、mmittee can be obtained on request to its secretary.This publication does not purport to include all the necessary provisions of a contract. Users are responsible for its correct application. The British Standards Institution 2012Published by BSI Standards Limited 2012 ISBN 978 0 580 68370 1 ICS 31.

4、190Compliance with a British Standard cannot confer immunity from legal obligations.This British Standard was published under the authority of the Standards Policy and Strategy Committee on 31 March 2012.Amendments issued since publicationAmd. No. Date Text affectedBRITISH STANDARDBS EN 62137-3:2012

5、EUROPEAN STANDARD EN 62137-3 NORME EUROPENNE EUROPISCHE NORM January 2012 CENELEC European Committee for Electrotechnical Standardization Comit Europen de Normalisation Electrotechnique Europisches Komitee fr Elektrotechnische Normung Management Centre: Avenue Marnix 17, B - 1000 Brussels 2012 CENEL

6、EC - All rights of exploitation in any form and by any means reserved worldwide for CENELEC members. Ref. No. EN 62137-3:2012 E ICS 31.190 English version Electronics assembly technology - Part 3: Selection guidance of environmental and endurance test methods for solder joints (IEC 62137-3:2011) Tec

7、hniques dassemblage des composants lectroniques - Partie 3: Guide de choix des mthodes dessai denvironnement et dendurance des joints brass (CEI 62137-3:2011) Montageverfahren fr elektronische Baugruppen - Teil 3: Leitfaden fr die Auswahl von Umwelt- und (Lebens)dauerprfungen fr Ltverbindungen (IEC

8、62137-3:2011) This European Standard was approved by CENELEC on 2011-12-13. CENELEC members are bound to comply with the CEN/CENELEC Internal Regulations which stipulate the conditions for giving this European Standard the status of a national standard without any alteration. Up-to-date lists and bi

9、bliographical references concerning such national standards may be obtained on application to the CEN-CENELEC Management Centre or to any CENELEC member. This European Standard exists in three official versions (English, French, German). A version in any other language made by translation under the

10、responsibility of a CENELEC member into its own language and notified to the CEN-CENELEC Management Centre has the same status as the official versions. CENELEC members are the national electrotechnical committees of Austria, Belgium, Bulgaria, Croatia, Cyprus, the Czech Republic, Denmark, Estonia,

11、Finland, France, Germany, Greece, Hungary, Iceland, Ireland, Italy, Latvia, Lithuania, Luxembourg, Malta, the Netherlands, Norway, Poland, Portugal, Romania, Slovakia, Slovenia, Spain, Sweden, Switzerland, Turkey and the United Kingdom. BS EN 62137-3:2012EN 62137-3:2012 - 2 - Foreword The text of do

12、cument 91/986/FDIS, future edition 1 of IEC 62137-3, prepared by IEC/TC 91 “Electronics assembly technology“ was submitted to the IEC-CENELEC parallel vote and approved by CENELEC as EN 62137-3:2012. The following dates are fixed: latest date by which the document has to be implemented at national l

13、evel by publication of an identical national standard or by endorsement (dop) 2012-09-13 latest date by which the national standards conflicting with the document have to be withdrawn (dow) 2014-12-13 Attention is drawn to the possibility that some of the elements of this document may be the subject

14、 of patent rights. CENELEC and/or CEN shall not be held responsible for identifying any or all such patent rights. Endorsement notice The text of the International Standard IEC 62137-3:2011 was approved by CENELEC as a European Standard without any modification. In the official version, for Bibliogr

15、aphy, the following notes have to be added for the standards indicated: IEC 60068-1:1988 + A1:1992 NOTE Harmonized as EN 60068-1:1994 (not modified). IEC 60068-2-2 NOTE Harmonized as EN 60068-2-2. IEC 60068-2-14 NOTE Harmonized as EN 60068-2-14. IEC 60068-2-78 NOTE Harmonized as EN 60068-2-78. IEC 6

16、1760-1 NOTE Harmonized as EN 61760-1. IEC 62137:2004 NOTE Harmonized as EN 62137:2004 (not modified). BS EN 62137-3:2012- 3 - EN 62137-3:2012 Annex ZA (normative) Normative references to international publications with their corresponding European publications The following documents, in whole or in

17、 part, are normatively referenced in this document and are indispensable for its application. For dated references, only the edition cited applies. For undated references, the latest edition of the referenced document (including any amendments) applies. NOTE When an international publication has bee

18、n modified by common modifications, indicated by (mod), the relevant EN/HD applies. Publication Year Title EN/HD Year IEC 60194 - Printed board design, manufacture and assembly - Terms and definitions EN 60194 - IEC 61188-5 Series Printed boards and printed board assemblies -Design and use - Part 5:

19、 Attachment (land/joint) considerations EN 61188-5 Series IEC 61249-2-7 - Materials for printed boards and other interconnecting structures - Part 2-7: Reinforced base materials, clad and unclad - Epoxide woven E-glass laminated sheet of defined flammability (vertical burning test), copper-clad EN 6

20、1249-2-7 - IEC 62137-1-1 2007 Surface mounting technology - Environmental and endurance test methods for surface mount solder joint - Part 1-1: Pull strength test EN 62137-1-1 2007 IEC 62137-1-2 2007 Surface-mounting technology - Environmental and endurance test methods for surface mount solder join

21、t - Part 1-2: Shear strength test EN 62137-1-2 2007 IEC 62137-1-3 2008 Surface mounting technology - Environmental and endurance test methods for surface mount solder joint - Part 1-3: Cyclic drop test EN 62137-1-3 2009 IEC 62137-1-4 2009 Surface mounting technology - Environmental and endurance tes

22、t methods for surface mount solder joint - Part 1-4: Cyclic bending test EN 62137-1-4 2009 IEC 62137-1-5 2009 Surface mounting technology - Environmental and endurance test methods for surface mount solder joint - Part 1-5: Mechanical shear fatigue test EN 62137-1-5 2009 BS EN 62137-3:2012 2 62137-3

23、 IEC:2011 CONTENTS 1 Scope . 7 2 Normative references . 7 3 Terms and definitions . 7 4 General remarks . 9 5 Procedure of selecting the applicable test method 10 5.1 Stress to solder joints in the field and test methods . 10 5.2 Selection of test methods based on the shapes and terminations/leads o

24、f electronic devices 12 5.2.1 Surface mount devices 12 5.2.2 Lead insertion type device . 13 6 Common subjects in each test method . 14 6.1 Mounting device and materials used 14 6.2 Soldering condition 15 6.2.1 General . 15 6.2.2 Reflow soldering 15 6.2.3 Wave soldering 17 6.3 Accelerated stress con

25、ditioning . 18 6.3.1 Rapid temperature change (applies to all solder alloys in this document) . 18 6.3.2 Dry heat (applies to Bi58Sn42 alloy solder only) 19 6.3.3 Damp heat (steady state) (applies to Sn91Zn9 and Sn89Zn8Bi3 alloy solder) . 19 6.4 Selection of test conditions and judgement of test res

26、ults 19 7 Evaluation test method . 19 7.1 Solder joint strength test of SMD . 19 7.1.1 General . 19 7.1.2 Pull strength test . 19 7.1.3 Shear strength test 20 7.1.4 Torque shear strength test . 21 7.1.5 Monotonic bending strength test 21 7.2 Cyclic bending strength test 22 7.3 Mechanical shear fatig

27、ue test 23 7.4 Cyclic drop test and cyclic steel ball drop strength test 24 7.4.1 Overview . 24 7.4.2 Cyclic steel ball drop strength test . 25 7.5 Solder joint strength test for lead insertion type device 26 7.5.1 Pull strength test for insertion type device . 26 7.5.2 Creep strength test for lead

28、insertion type device 26 Annex A (informative) Condition of rapid temperature change 28 Annex B (informative) Electrical continuity test for solder joint . 30 Annex C (informative) Torque shear strength test 31 Annex D (informative) Monotonic bending strength test . 34 Annex E (informative) Cyclic s

29、teel ball drop strength test . 36 Annex F (informative) Pull strength test . 38 Annex G (informative) Creep strength test . 39 BS EN 62137-3:201262137-3 IEC:2011 3 Annex H (informative) Evaluation method for the fillet lifting phenomenon of a lead insertion type device solder joint . 41 Bibliography

30、 43 Figure 1 Joint regions for the reliability tests 9 Figure 2 Factors affecting the joint reliability made by lead-free solder 10 Figure 3 An example of the mounting position of SMD for monotonic bending and cyclic bending tests 15 Figure 4 An example of reflow soldering temperature profile (Sn96,

31、5Ag3Cu,5) 16 Figure 5 Examples of reflow soldering temperature profile other than Sn96,5Ag3Cu,5 16 Figure 6 An example of wave soldering temperature profile (Sn96,5Ag3Cu,5) 17 Figure 7 An example of wave soldering temperature profile . 18 Figure 8 Pull strength test 20 Figure 9 Shear strength test.

32、20 Figure 10 Torque shear strength test . 21 Figure 11 Monotonic bending strength test . 21 Figure 12 Cyclic bending strength test . 22 Figure 13 Structure of cyclic bending strength test . 23 Figure 14 Schematic diagram of mechanical shear fatigue for solder joint 24 Figure 15 Cyclic drop test 25 F

33、igure 16 Cyclic steel ball drop test . 25 Figure 17 Pull strength test 26 Figure 18 Creep strength test 27 Figure A.1 Stress relation curve for a given strain to a solder joint (Sn96,5Ag3Cu,5) . 28 Figure A.2 Time to reach steady state in the temperature cycle chamber . 29 Figure B.1 Example of the

34、test circuit for an electrical continuity test of a solder joint 30 Figure C.1 Fixing of substrate for torque shear strength test 32 Figure C.2 Torque shear strength test jig and position adjustment . 33 Figure C.3 Torque shear strength test for a connector . 33 Figure D.1 Example of a board bending

35、 jig . 34 Figure E.1 Cyclic steel ball drop test 37 Figure E.2 Comparison of cyclic drop test and cyclic steel ball drop test 37 Figure F.1 Pull strength test . 38 Figure G.1 Creep strength test . 39 Figure H.1 Fillet lifting phenomenon of solder joint . 41 Figure H.2 Example of an electrical contin

36、uity test circuit for a lead insertion type device solder joint . 42 Table 1 Correlations between test methods and actual stresses in the field . 11 Table 2 Recommended test methods suitable for specific shapes and terminations/leads of SMDs 12 Table 3 Recommended test methods suitable for applicati

37、on and mass of the lead insertion type device . 13 Table 4 Solder alloy composition . 14 BS EN 62137-3:2012 4 62137-3 IEC:2011 Table 5 Diameters of through holes and lands in respect to the nominal cross section and nominal diameter of lead wire 15 Table 6 Temperature condition for rapid temperature

38、 change. 18 BS EN 62137-3:201262137-3 IEC:2011 7 ELECTRONICS ASSEMBLY TECHNOLOGY Part 3: Selection guidance of environmental and endurance test methods for solder joints 1 Scope This part of IEC 62137 describes the selection methodology of an appropriate test method for a reliability test for solder

39、 joints of various shapes and types of surface mount devices (SMD), array type devices and leaded devices, and lead insertion type devices using various types of solder material alloys. 2 Normative references The following referenced documents are indispensable for the application of this document.

40、For a dated reference, only the edition cited applies. For an undated reference, the latest edition of the referenced document (including any amendment) applies. IEC 60194, Printed board design, manufacture and assembly Terms and definitions IEC 61188-5 (all parts), Printed boards and printed board

41、assemblies Design and use IEC 61249-2-7, Materials for printed boards and other interconnecting structures Part 2-7: Reinforced base materials clad and unclad Epoxide woven E-glass laminated sheet of defined flammability (vertical burning test), copper-clad IEC 62137-1-1:2007, Surface mounting techn

42、ology Environmental and endurance test methods for surface mount solder joint Part 1-1: Pull strength test IEC 62137-1-2:2007, Surface mounting technology Environmental and endurance test methods for surface mount solder joint Part 1-2: Shear strength test IEC 62137-1-3:2008, Surface mounting techno

43、logy Environmental and endurance test methods for surface mount solder joint Part 1-3: Cyclic drop test IEC 62137-1-4:2009, Surface mounting technology Environmental and endurance test methods for surface mount solder joint Part 1-4: Cyclic bending test IEC 62137-1-5:2009, Surface mounting technolog

44、y Environmental and endurance test methods for surface mount solder joints Part 1-5: Mechanical shear fatigue test 3 Terms and definitions For the purposes of this document, the terms and definitions in IEC 60194, as well as the following, apply. 3.1 pull strength for SMD maximum force to break the

45、joint of a lead to substrate when a gull-wing lead of a surface mount device is pulled using a pulling tool at an angle of 45 to the substrate surface IEC 62137-1-1:2007, modified BS EN 62137-3:2012 8 62137-3 IEC:2011 3.2 shear strength for SMD maximum force applied parallel to the substrate and per

46、pendicular to the specimen lateral surface to break the joint of SMD mounted on a substrate IEC 62137-1-2:2007, modified 3.3 torque shear strength for SMD maximum rotation moment to SMD which is applied in parallel to the substrate surface, to break the solder joint between an SMD termination/lead a

47、nd the land on the substrate 3.4 monotonic bending strength for SMD strength of solder joints of SMD mounted on substrate when the substrate is bent convex toward to the mounted SMDs expressed by the maximum bending depth to the break of joints 3.5 cyclic bending strength for SMD intensity of the st

48、rength, which is expressed in the number of cycles to attain the joint fracture between SMD termination/lead mounted on the substrate and the copper land of the substrate after bending the substrate cyclically to a specified degree to allow the surface of the device side of the substrate to become a

49、 convex shape IEC 62137-1-4:2009, modified 3.6 mechanical shear fatigue strength for SMD imposition of cyclic shear deformation on the solder joints by mechanical displacement instead of relative displacement generated by CTE (coefficient of thermal expansion) mismatch in thermal cycling testing NOTE The mechanical shear fatigue tests continues until the maximum force decreases to a specified value, which