BS EN 61188-5-3-2007 Printed boards and printed board assemblies - Design and use - Attachment (land joint) considerations - Components with gull- wing leads on two sides《印制电路板和印制电.pdf

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1、BRITISH STANDARDBS EN 61188-5-3:2007Printed boards and printed board assemblies Design and use Part 5-3: Attachment (land/joint) considerations Components with gull-wing leads on two sidesThe European Standard EN 61188-5-3:2007 has the status of a British StandardICS 31.180g49g50g3g38g50g51g60g44g49

2、g42g3g58g44g55g43g50g56g55g3g37g54g44g3g51g40g53g48g44g54g54g44g50g49g3g40g59g38g40g51g55g3g36g54g3g51g40g53g48g44g55g55g40g39g3g37g60g3g38g50g51g60g53g44g42g43g55g3g47g36g58BS EN 61188-5-3:2007This British Standard was published under the authority of the Standards Policy and Strategy Committee on

3、31 December 2007 BSI 2007ISBN 978 0 580 60178 1National forewordThis British Standard is the UK implementation of EN 61188-5-3:2007. It is identical to IEC 61188-5-3:2007.The UK participation in its preparation was entrusted to Technical Committee EPL/501, Electronic assembly technology.A list of or

4、ganizations represented on this committee can be obtained on request to its secretary.This publication does not purport to include all the necessary provisions of a contract. Users are responsible for its correct application.Compliance with a British Standard cannot confer immunity from legal obliga

5、tions. Amendments issued since publicationAmd. No. Date CommentsEUROPEAN STANDARD EN 61188-5-3 NORME EUROPENNE EUROPISCHE NORM November 2007 CENELEC European Committee for Electrotechnical Standardization Comit Europen de Normalisation Electrotechnique Europisches Komitee fr Elektrotechnische Normun

6、g Central Secretariat: rue de Stassart 35, B - 1050 Brussels 2007 CENELEC - All rights of exploitation in any form and by any means reserved worldwide for CENELEC members. Ref. No. EN 61188-5-3:2007 E ICS 31.180 English version Printed boards and printed board assemblies - Design and use - Part 5-3:

7、 Attachment (land/joint) considerations - Components with gull-wing leads on two sides (IEC 61188-5-3:2007) Cartes imprimes et cartes imprimes quipes - Conception et utilisation - Partie 5-3: Considrations sur les liaisons pistes-soudures - Composants sorties en aile de mouette sur deux cts (CEI 611

8、88-5-3:2007) Leiterplatten und Flachbaugruppen - Konstruktion und Anwendung - Teil 5-3: Betrachtungen zur Montage (Anschlussflche/Verbindung) - Bauelemente mit Gullwing-Anschlssen auf zwei Seiten (IEC 61188-5-3:2007) This European Standard was approved by CENELEC on 2007-11-01. CENELEC members are b

9、ound to comply with the CEN/CENELEC Internal Regulations which stipulate the conditions for giving this European Standard the status of a national standard without any alteration. Up-to-date lists and bibliographical references concerning such national standards may be obtained on application to the

10、 Central Secretariat or to any CENELEC member. This European Standard exists in three official versions (English, French, German). A version in any other language made by translation under the responsibility of a CENELEC member into its own language and notified to the Central Secretariat has the sa

11、me status as the official versions. CENELEC members are the national electrotechnical committees of Austria, Belgium, Bulgaria, Cyprus, the Czech Republic, Denmark, Estonia, Finland, France, Germany, Greece, Hungary, Iceland, Ireland, Italy, Latvia, Lithuania, Luxembourg, Malta, the Netherlands, Nor

12、way, Poland, Portugal, Romania, Slovakia, Slovenia, Spain, Sweden, Switzerland and the United Kingdom. Foreword The text of document 91/702/FDIS, future edition 1 of IEC 61188-5-3, prepared by IEC TC 91, Electronics assembly technology, was submitted to the IEC-CENELEC parallel vote and was approved

13、 by CENELEC as EN 61188-5-3 on 2007-11-01. This standard is to be used in conjunction with EN 61188-5-1. The following dates were fixed: latest date by which the EN has to be implemented at national level by publication of an identical national standard or by endorsement (dop) 2008-08-01 latest date

14、 by which the national standards conflicting with the EN have to be withdrawn (dow) 2010-11-01 Annex ZA has been added by CENELEC. _ Endorsement notice The text of the International Standard IEC 61188-5-3:2007 was approved by CENELEC as a European Standard without any modification. _ EN 61188-5-3:20

15、07 2 CONTENTS INTRODUCTION.5 1 Scope.6 2 Normative references .6 3 General information6 3.1 General component description .6 3.2 Marking .6 3.3 Carrier packaging format .6 3.4 Process considerations .6 4 TSOP (Type 1) .7 4.1 Field of application 7 4.2 Component description7 4.3 Component dimensions

16、.7 4.4 Solder joint fillet design .8 4.5 Land pattern dimensions .10 5 TSOP (Type 2) .11 5.1 Field of application 12 5.2 Component description12 5.3 Component dimensions .12 5.4 Solder joint fillet design .13 5.5 Land pattern dimensions .15 6 SOP .17 6.1 Field of application 17 6.2 Component descrip

17、tion17 6.3 Component dimensions .17 6.4 Solder joint fillet design .18 6.5 Land pattern dimensions .20 7 SSOP .22 7.1 Field of application 22 7.2 Component description22 7.3 Component dimensions .23 7.4 Solder joint fillet design .23 7.5 Land pattern dimensions .25 Bibliography28 Figure 1 TSOP (Type

18、 1) construction .7 Figure 2 TSOP (Type 1) Component dimensions.8 Figure 3 Solder joint fillet design (see IEC 61188-5-1, Tables 2 and 3) 10 Figure 4 TSOP (Type 1) Land pattern dimensions.12 Figure 5 TSOP (Type 2) construction .12 Figure 6 TSOP (Type 2) Component dimensions.13 Figure 7 Solder joint

19、fillet design (see IEC 61188-5-1, Tables 2 and 3) 15 Figure 8 TSOP (Type 2) Land pattern dimensions.17 EN 61188-5-3:2007 3 Annex ZA (normative) Normative references to international publications with their corresponding European publications .29 Figure 9 SOPIC construction17 Figure 10 SOP component

20、dimensions 18 Figure 11 Solder joint fillet design (see IEC 61188-5-1, Table 2)20 Figure 12 SOP Land pattern dimensions22 Figure 13 SSOP construction.22 Figure 14 Component dimensions23 Figure 15 Solder joint fillet design (see IEC 61188-5-1, Table 2)25 Figure 16 Land pattern dimensions 27 EN 61188-

21、5-3:2007 4 INTRODUCTION This part of IEC 61188 covers land patterns for components with gull-wing leads on two sides. Each clause contains information in accordance with the following format: The proposed land pattern dimensions in this standard are based upon the fundamental tolerance calculation c

22、ombined with the given land protrusions and courtyard excesses (see IEC 61188-5-1, Generic requirements). The courtyard includes all issues of the normal manufacturing necessities. The unaltered land pattern dimensions of this part are generally applicable for the solder paste application plus reflo

23、w soldering process. For application of the wave soldering process, the land pattern dimensions normally have to be modified. Orientation parallel to the wave direction is preferable and special, suitably dimensioned solder thieves should be added. This standard offers a threefold land pattern dimen

24、sioning (levels 1, 2, and 3) on the basis of a threefold set of land protrusions and courtyard excesses: maximum (max.); median (mdn) and minimum (min.). Each land pattern has been assigned an identification number to indicate the characteristics of the specific robustness of the land patterns. User

25、s also have the opportunity to organize the information so that it is most useful for their particular design. If a user has good reason to use a concept different from that of IEC 61188-5-1 or if the user prefers unusual land protrusions, this standard should be used for checking the resulting sold

26、er fillet size. It is the responsibility of the user to verify the SMD land patterns used for achieving an undisturbed mounting process including testing and an ensured reliability for the product stress conditions in use. Component dimensions listed in this standard are those available on the marke

27、t and regarded as for reference only. EN 61188-5-3:2007 5 PRINTED BOARDS AND PRINTED BOARD ASSEMBLIES DESIGN AND USE Part 5-3: Attachment (land/joint) considerations Components with gull-wing leads on two sides 1 Scope This part of IEC 61188 provides information on land pattern geometries used for t

28、he surface attachment of electronic components with gull-wing leads on two sides. The intent of the information presented herein is to provide the appropriate size, shape and tolerances of surface mount land patterns to ensure sufficient area for the appropriate solder fillet, and also allow for ins

29、pection, testing and reworking of those solder joints. Each clause contains a specific set of criteria such that the information presented is consistent, providing information on the component, the component dimensions, the solder joint design, and the land pattern dimensions. 2 Normative references

30、 The following referenced documents are indispensable for the application of this document. For dated references, only the edition cited applies. For undated references, the latest edition of the referenced document (including any amendments) applies. IEC 61188-5-1, Printed boards and printed board

31、assemblies Design and use Part 5-1: Attachment (land/joint) considerations Generic requirements 3 General information 3.1 General component description The acronyms TSOP (thin small outline package), SOP (small outline package) and SSOP (shrink small outline package) are also used to describe the fa

32、mily. 3.2 Marking The TSOP, SOP and SSOP families of parts are generally marked with the manufacturers part numbers, manufacturers name or symbol, and a pin 1 indicator. Some parts may have a pin 1 feature in the case shape instead of pin 1 marking. Additional markings may include date-code manufact

33、uring lot and/or manufacturing location. 3.3 Carrier packaging format Carrier packaging format may be provided in a tray carrier, but tape and reel carriers are preferred for best handling and high volume applications. Bulk packaging is not acceptable because of lead co-planarity required for placem

34、ent and soldering. 3.4 Process considerations TSOP, SOP and SSOP packages are normally processed by reflow solder operations. The land pattern dimensions are based on a mathematical model that establishes a platform for a solder joint attachment to the printed board. The existing models create a pla

35、tform that is EN 61188-5-3:2007 6 capable of establishing a reliable solder joint no matter what solder alloy is used to make that joint (lead-free, tin lead, etc.) Process requirements for solder reflow are different based on the solder alloy and should be analyzed in order that the process is abov

36、e the liquidus temperature of the alloy, and remains above that temperature a sufficient time to form a reliable metallurgical bond. 4 TSOP (Type 1) 4.1 Field of application This clause provides the component and land pattern dimensions for TSOP (Type 1) components. Basic construction is also covere

37、d. Subclause 4.4 lists the tolerances and target solder joint dimensions used to arrive at the land pattern dimensions. 4.2 Component description Figure 1 shows a typical construction example. IEC 2009/07 Figure 1 TSOP (Type 1) construction 4.3 Component dimensions Figure 2 shows the component dimen

38、sions for TSOP (Type 1) components. Land pattern dimensional data may need to be adjusted if the component dimensional data does not match JEDEC and/or JEITA data sheets. EN 61188-5-3:2007 7 LSBTA W P IEC 2010/07 Dimensions in millimetresL W T S* A B H P Component identification Pin count Min. Max.

39、Min. Max. Min. Max. Min. Max. Min. Max. Min. Max. Max. BasicTSOP 6x14 16 13,8 14,2 0,17 0,27 0,40 0,75 12,3 12,94 5,80 6,20 12,2 12,6 1,20 0,65 TSOP 6x16 24 15,8 16,2 0,17 0,23 0,40 0,75 14,3 14,94 5,80 6,20 14,2 14,6 1,20 0,5 TSOP 6x18 28 17,8 18,2 0,13 0,19 0,40 0,75 16,3 16,94 5,80 6,20 16,2 16,6

40、 1,20 0,4 TSOP 6x20 36 19,8 20,2 0,09 0,15 0,40 0,75 18,3 18,94 5,80 6,20 18,2 18,6 1,20 0,3 TSOP 8x14 24 13,8 14,2 0,17 0,27 0,40 0,75 12,3 12,94 7,80 8,20 12,2 12,6 1,20 0,65 TSOP 8x16 32 15,8 16,2 0,17 0,23 0,40 0,75 14,3 14,94 7,80 8,20 14,2 14,6 1,20 0,5 TSOP 8x18 40 17,8 18,2 0,13 0,19 0,40 0,

41、75 16,3 16,94 7,80 8,20 16,2 16,6 1,20 0,4 TSOP 8x20 52 19,8 20,2 0,09 0,15 0,40 0,75 18,3 18,94 7,80 8,20 18,2 18,6 1,20 0,3 TSOP 10x14 28 13,8 14,2 0,17 0,27 0,40 0,75 12,3 12,94 9,80 10,20 12,2 12,6 1,20 0,65 TSOP 10x16 40 15,8 16,2 0,17 0,23 0,40 0,75 14,3 14,94 9,80 10,20 14,2 14,6 1,20 0,5 TSO

42、P 10x18 48 17,8 18,2 0,13 0,19 0,40 0,75 16,3 16,94 9,80 10,20 16,2 16,6 1,20 0,4 TSOP 10x20 64 19,8 20,2 0,09 0,15 0,40 0,75 18,3 18,94 9,80 10,20 18,2 18,6 1,20 0,3 TSOP 12x14 36 13,8 14,2 0,17 0,27 0,40 0,75 12,3 12,94 11,80 12,20 12,2 12,6 1,20 0,65 TSOP 12x16 48 15,8 16,2 0,17 0,23 0,40 0,75 14

43、,3 14,94 11,80 12,20 14,2 14,6 1,20 0,5 TSOP 12x18 60 17,8 18,2 0,13 0,19 0,40 0,75 16,3 16,94 11,80 12,20 16,2 16,6 1,20 0,4 TSOP 12x20 76 19,8 20,2 0,09 0,15 0,40 0,75 18,3 18,94 11,80 12,20 18,2 18,6 1,20 0,3 * Calculated value. Figure 2 TSOP (Type 1) Component dimensions 4.4 Solder joint fillet

44、design Figure 3 shows the dimensions of the solder fillet after the soldering process. The minimum, median and maximum dimensions of each of toe, heel and side fillet are determined by taking into consideration solder joint reliability and also quality and productivity in the mounting process of par

45、ts. In designing land patterns, three accuracy factors need to be taken into consideration: parts dimensions accuracy (C); parts mount accuracy on PWBs (P); land shape accuracy of PWBs (F), in addition to fillet dimensions. The formulae to obtain the tolerance resulting from these factors are basica

46、lly as follows: a) Design consideration when soldered without self-alignment effect (level 1) In the flow soldering process, there is no self-alignment effect. Thus, the formulae cannot be simplified but remain the same, as follows: EN 61188-5-3:2007 8 Zmax = Lmin + 2JTmax + TT TT=CPFL21L21L2+ Gmin

47、= Smax (rms) 2JH max THTH= CPFS21L21L2+ Xmax = Wmin + 2JSmax + TSTS = CPFW21L21L2+ b) Design consideration when soldered without self-alignment effect (Level 2) Zmax = Lmin + 2JTmdn + TTTT= CPFL22L22L2+Gmin = Smax(rms) 2JH mdn THTH= CPFS22L22L2+ Xmax = Wmin + 2JS mdn + TSTS = CPFW22L22L2+c) Design c

48、onsideration when soldered with self-alignment effect (Level 3) Zmax = Lmin + 2JTmin + TTTT= CPFL23L23L2+Gmin = Smax(rms) 2JH min THTH= CPFS23L23L2+ Xmax = Wmin + 2 JS min + TSTS = CPFW23L23L2+In the reflow soldering process, there is a self-alignment effect. In the surface mount process of reflow s

49、oldering, parts mount displacement when soldered can be cancelled by self-alignment effect (therefore factor P can be regarded as 0). In addition, the tolerance of the land shape accuracy of PWBs is about 30 m, and this is extremely small when compared with that of the parts dimensions accuracy (therefore factor F can be regarded also as 0). Thus, the formulae can be simplified as follows: TT = CL, Zmax = Lmin + 2JTmin + CL = Lmax + 2JTmin TH=