BS 123500-2001 System of quality assessment - Sectional specification - Flexible single-sided and double-sided printed boards with through-connections《质量评估体系 分规范 直通连接的挠性单面和双面印制板》.pdf

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1、BRITISH STANDARD BS 123500:2001 System of quality assessment Sectional specification Flexible single-sided and double-sided printed boards with through-connections ICS 31.180 NO COPYING WITHOUT BSI PERMISSION EXCEPT AS PERMITTED BY COPYRIGHT LAWBS 123500:2001 This British Standard, having been prepa

2、red under the direction of the Electrotechnical Sector Policy and Strategy Committee, was published under the authority of the Standards Policy and Strategy Committee on 17 December 2001 BSI 17 December 2001 The following BSI references relate to the work on this British Standard: Committee referenc

3、e EPL/501 Draft for comment 01/204160 DC ISBN 0 580 38527 2 Committees responsible for this British Standard The preparation of this British Standard was entrusted to Technical Committee EPL/501, Electronic assembly technology, upon which the following bodies were represented: Association of Contrac

4、t Engineers Manufacturers Federation of the Electronics Industry GAMBICA Ministry of Defence National Supervising Inspectorate Printed Circuit Interconnection Federation Surface Mounting and Related Technologies (Smart Group) Ltd. Amendments issued since publication Amd. No. Date CommentsBS 123500:2

5、001 BSI 17 December 2001 i Contents Page Committees responsible Inside front cover Foreword ii 1S c o p e 1 2 Normative references 1 3T e r m s a n d d e f i n i t i o n s 1 4 General requirements 1 5 Capability approval 1 6 Relevant specification 2 7 Capability test programme 2 8 Quality conformity

6、 inspection 2 9 Test patterns and test boards 6 Bibliography 13 Figure 1 Composite test pattern 7 Figure 2 Composite test pattern (detailed dimensions) 8 Figure 3 Examples of multiple arrangements 9 Figure 4 Examples of soldered holes 10 Figure 5 Examples relating to access holes 11 Figure 6 Example

7、s of delamination 12 Table 1 Group A quality conformity inspection 3 Table 2 Group B quality conformity inspection 4 Table 3 Group C quality conformity inspection 5 Table 4 Test specimen details 6BS 123500:2001 ii BSI 17 December 2001 Foreword This British Standard has been prepared by Technical Com

8、mittee EPL/501, Electronic assembly technology. The BS 123000:2001 series of British Standards is based on draft proposals to revise the EN 123000 series dated 1992 and 1997. These were circulated and voted on in CENELEC, but the CENELEC Technical Board decided not to approve them for publication. F

9、ollowing repeated attempts by the British National Committee to get them published, the Technical Board agreed to grant derogation from standstill to the British National Committee to publish national standards on the basis of the prEN 123000 series (Technical Board decision D106/092). These standar

10、ds are published to complement the BS EN 123000 series, which remains current. They will be withdrawn only if they are replaced by revised EN standards. They have been published because they are considered to be an improvement upon the EN series, for the following reasons. a) Requirements for modern

11、 materials and surface finishes required by the electronics industry have been incorporated. b) Reference is made to ANSI/IPC A-600F for many of the inspection criteria. This has been undertaken in response to industry requests. c) References to obsolete CECC regulatory documents have been replaced.

12、 d) Tests and requirements that are no longer considered relevant have been removed. e) The UK electronics industry requires standards that are subject to ongoing revision, in order to take account of new European Eco-Directives. This British Standard is a sectional specification. It should be read

13、in conjunction with the generic specification, BS 123000, and any associated capability detail specification. It has been assumed in the preparation of this British Standard that the execution of its provisions will be entrusted to appropriately qualified and experienced people, for whose use it has

14、 been produced. A British Standard does not purport to include all the necessary provisions of a contract. Users of British Standards are responsible for their correct application. Compliance with a British Standard does not of itself confer immunity from legal obligations. Summary of pages This doc

15、ument comprises a front cover, an inside front cover, pages i and ii, pages 1 to 13 and a back cover. The BSI copyright notice displayed in this document indicates when the document was last issued.BS 123500:2001 BSI 17 December 2001 1 1 Scope This British Standard specifies characteristics to be as

16、sessed and test methods to be used for capability approval testing and for quality conformity inspection (lot-by-lot and periodic inspection). It is applicable for all flexible single-sided and double-sided printed boards with through-connections, irrespective of their method of manufacture, when th

17、ey are ready for the mounting of components. This British Standard is a sectional specification intended for use with the IECQ system of quality assessment for electronic components. 2 Normative references The following normative documents contain provisions which, through reference in this text, co

18、nstitute provisions of this British Standard. For dated references, subsequent amendments to, or revisions of, any of these publications do not apply. For undated references, the latest edition of the publication referred to applies. BS 4727-1:Group 11 (IEC 60194), Glossary of electrotechnical, powe

19、r, telecommunication, electronics, lighting and colour terms Part 1: Terms common to power, telecommunications and electronics Group 11: Printed circuits. BS 6001-1:1999 (ISO 2859-1:1999), Sampling procedures for inspection by attributes Part 1: Sampling schemes indexed by acceptance quality limit (

20、AQL) for lot-by-lot inspection. BS 6221-2:1991 (IEC 60326-2:1990), Printed wiring boards Part 2: Methods of test. BS 6221-3 (IEC 60326-3), Printed wiring boards Guide for the design and use of printed wiring boards. BS 123000:2001, System of quality assessment Generic specification Printed boards. 3

21、 Terms and definitions For the purposes of this British Standard the terms and definitions given in BS 4727-1:Group 11 and BS 123000 together with the following apply. 3.1 relevant specification product specification for an actual batch of printed boards, i.e. a customer detail specification as well

22、 as a capability detail specification applied to a specific material, surface finish etc., as applicable 4 General requirements The following specifications for flexible single-sided and double-sided printed boards with through-connections shall be prepared, unless a suitable capability detail speci

23、fication already exists, using this British Standard as a basis: a) capability detail specifications for general use or applying to specific applications; b) customer detail specifications, which shall be prepared in accordance with BS 123000:2001, 7.2. NOTE 1 BS 123500-003 is an example of a capabi

24、lity detail specification for flexible single-sided and double-sided printed boards with through-connections. NOTE 2 A capability detail specification is prepared either by an international or national body or by a manufacturer (see also BS CECC 00111-4). A customer detail specification should prefe

25、rably be written by the customer and allocated a number within the customers own system. Further details are given in BS 123000 and BS CECC 00114-3. 5 Capability approval 5.1 Basic capability Testing shall be carried out on the composite test pattern detailed in clause 9. 5.2 Additional capability B

26、S 123000:2001, 5.3.3 shall apply. NOTE For multiple arrangements see also clause 9. 5.3 Maintenance of capability approval BS 123000:2001, 5.6 shall apply. BS 123500:2001 2 BSI 17 December 2001 6 Relevant specification The relevant specification shall contain all the information necessary to define

27、the printed board clearly and completely. Care shall be taken to avoid unnecessary proscriptions. Tolerances shall be stated as necessary. Nominal values without tolerances, or simple maximum or minimum values, shall be given where these are sufficient. Where tolerances are necessary for certain are

28、as or parts of the printed board only, they shall be applied and restricted to those areas or parts. If there are several possibilities of presentation, of tolerance classes etc., the selections given in BS 6221-3 shall be applied as practical. In the case of discrepancy between the customer detail

29、specification and other pertinent specifications (e.g. generic specification, sectional specification or capability detail specification), the customer detail specification shall prevail. 7 Capability test programme For initial demonstration and subsequent re-demonstration, the capability approval t

30、est programme shall be in accordance with the relevant capability detail specification. Demonstration of additional capability shall be in accordance with BS 123000:2001, 5.3.3. NOTE For composite test pattern specimens, see clause 9 and Figure 1 and Figure 2. Examples of multiple arrangements of te

31、st patterns are shown in Figure 3. Examples of soldered holes are shown in Figure 4, examples relating to access holes in Figure 5, and examples of delamination in Figure 6. 8 Quality conformity inspection 8.1 General Quality conformity inspection shall be conducted on samples which are either taken

32、 from the production batch, or which are representative of the production batch (i.e. manufactured using the same processes, having the same features, and concurrent with the released batch). 8.2 Sampling plans The sampling plans of BS 6001-1, as referenced in Table 1, Table 2 and Table 3, shall be

33、used. In all cases there shall be no defects. NOTE 1 Unless otherwise specified, production boards and/or specially designed test patterns may be used for carrying out tests for the lot-by-lot and periodic inspection. NOTE 2 Where specially designed test patterns are used, they may be included in th

34、e panel. They may be based upon the appropriate pattern of the composite test pattern as detailed in clause 9. 8.3 Inspection groups Inspection level C shall be used, unless another inspection level is specified in the customer detail specification. Other inspection levels shall be in accordance wit

35、h Table 1 and Table 2. Printed boards shall be aggregated into inspection lots in accordance with BS 123000:2001, 6.1. NOTE For definition of the inspection groups, see BS 123000:2001, 6.3. Quality conformity inspection shall be carried out in accordance with Table 1, Table 2 and Table 3.BS 123500:2

36、001 BSI 17 December 2001 3 Table 1 Group A quality conformity inspection Inspection group Characteristics Test no. aAssessment level A Assessment level B Assessment level C Assessment level D IL b AQL c IL AQL IL AQL IL AQL Sub-group A1 Visual inspection See BS 123000:2001, 7.2.5 See BS 123000:2001,

37、 7.2.5 Conformity 1 S2 2.5 % 100 % Identification 1 S2 2.5 % 100 % Appearance 1a S2 2.5 % 100 % Workmanship 1a S2 2.5 % 100 % Board edges 1a S2 2.5 % 100 % Eyelets S2 2.5 % 100 % Bonding, conductor to substrate 1a S2 2.5 % 100 % Bonding, coverlayer to substrate and pattern 1a S2 2.5 % 100 % Bonding,

38、 flexible substrate to rigidizing component 1a S2 2.5 % 100 % Plated-through holes 1a S2 2.5 % 100 % Conductor defects 1b S2 2.5 % 100 % Misalignment of solder resist and land 1a S2 2.5 % 100 % Particles between conductors 1b, 1c S2 2.5 % 100 % Sub-group A2 Dimensional examination Board dimensions 2

39、 S1 4.0 % S4 2.5 % Holes 2 S1 4.0 % S4 2.5 % Access holes 2 S1 4.0 % S4 2.5 % Slots, notches 2 S1 4.0 % S4 2.5 % Conductor width 2 S1 4.0 % S4 2.5 % Conductor spacing 2 S1 4.0 % S4 2.5 % Misalignment of hole and land 2 S1 4.0 % S4 2.5 % Misalignment of access hole and land 2a S1 4.0 % S4 2.5 % Posit

40、ional tolerance of hole centres 2 S1 4.0 % S4 2.5 % Sub-group A3 Spare group for additional group A tests NOTE This listing may be subject to continuing review, as required by the publication and revision of new capability detail specifications. a As specified in BS 6221-2:1991. b Inspection level (

41、defined in BS 6001-1:1999, Table 1). c Acceptability quality level.BS 123500:2001 4 BSI 17 December 2001 Table 2 Group B quality conformity inspection Inspection group Characteristics Test no. a Assessment level A Assessment level B Assessment level C Assessment level D IL b AQL c IL AQL IL AQL IL A

42、QL Sub-group B1 Dimensional interchangeability See BS 123000:2001, 7.2.5 See BS 123000:2001, 7.2.5 Board thickness (contact zone) 2 S2 2.5 % Sub-group B2 Solderability As received 14a S2 2.5 % S3 2.5 % After accelerated ageing 20a S2 2.5 % S3 2.5 % Sub-group B3 Thermal shock tests Through-hole plati

43、ngs 19c S1 4.0 % S2 2.5 % Interlaminar bond # S2 2.5 % Sub-group B4 Mechanical tests Peel strength, conductor to base material 10c S2 2.5 % Pull-out strength, plated-through holes 11a S2 2.5 % Peel strength, coverlayer to conductor 11b S2 2.5 % Peel strength, flexible substrate to rigidizing compone

44、nt 10c S2 2.5 % Sub-group B5 Surface finish tests Adhesion of plating 13a S1 2.5 % S2 2.5 % Porosity of edge contact plating 13d #, 13e S1 2.5 % S2 2.5 % Thickness of plating, contact areas 13f S2 2.5 % Sub-group B6 Spare group for additional group B tests Testing details marked “#” shall be include

45、d in the relevant capability detail specification. NOTE This listing may be subject to continuing review, as required by the publication and revision of new capability detail specifications. a As specified in BS 6221-2:1991. b Inspection level (defined in BS 6001-1:1999, Table 1). c Acceptability qu

46、ality level.BS 123500:2001 BSI 17 December 2001 5 Table 3 Group C quality conformity inspection Inspection group Characteristics Test no. a Assessment level A Assessment level B Assessment level C Assessment level D No. of specimens No. of specimens No. of specimens No. of specimens Sub-group C1 Tes

47、ts in 3-month intervals See BS 123000:2001, 7.2.5 See BS 123000:2001, 7.2.5 Change in resistance of plated-through holes 3c 6 Process contamination # 20 Resistance to solder of coverlayer/resist # 6 Solvent and flux resistance of coverlayer/resist # 6 Flexural fatigue 21a # Sub-group C2 Tests in 12-

48、month intervals Not applicable Sub-group C3 Spare group for additional intervals Testing details marked “#” shall be included in the relevant capability detail specification. There shall be no failures. NOTE This listing may be subject to continuing review, as required by the publication and revisio

49、n of new capability detail specifications. a As specified in BS 6221-2:1991.BS 123500:2001 6 BSI 17 December 2001 9 Test patterns and test boards 9.1 General A test pattern shall consist of: a) a part of a conductive pattern on a production board (and used in the application of the printed board); or b) a special test pattern particularly designed and prepared for the purpose of testing only. A test pattern shall be located: 1) on a test coupon (a portion of a printed board or a panel detached prior t