BS 123400-2001 System of quality assessment - Sectional specification - Flexible single-sided and double-sided printed boards without through-connections《质量评估体系 分规范 无直通连接的挠性单面和双面印制.pdf

《BS 123400-2001 System of quality assessment - Sectional specification - Flexible single-sided and double-sided printed boards without through-connections《质量评估体系 分规范 无直通连接的挠性单面和双面印制.pdf》由会员分享，可在线阅读，更多相关《BS 123400-2001 System of quality assessment - Sectional specification - Flexible single-sided and double-sided printed boards without through-connections《质量评估体系 分规范 无直通连接的挠性单面和双面印制.pdf（18页珍藏版）》请在麦多课文档分享上搜索。

1、BRITISH STANDARD BS 123400:2001 System of quality assessment Sectional specification Flexible single-sided and double-sided printed boards without through-connections ICS 31.180 NO COPYING WITHOUT BSI PERMISSION EXCEPT AS PERMITTED BY COPYRIGHT LAWBS 123400:2001 This British Standard, having been pr

2、epared under the direction of the Electrotechnical Sector Policy and Strategy Committee, was published under the authority of the Standards Policy and Strategy Committee on 17 December 2001 BSI 17X December 2001 The following BSI references relate to the work on this British Standard: Committee refe

3、rence EPL/501 Draft for comment 01/204158 DC ISBN 0 580 38525 6 Committees responsible for this British Standard The preparation of this British Standard was entrusted to Technical Committee EPL/501, Electronic assembly technology, upon which the following bodies were represented: Association of Con

4、tract Engineers Manufacturers Federation of the Electronics Industry GAMBICA Ministry of Defence National Supervising Inspectorate Printed Circuit Interconnection Federation Surface Mounting and Related Technologies (Smart Group) Ltd. Amendments issued since publication Amd. No. Date CommentsBS 1234

5、00:2001 BSI 17 December 2001 i Contents Page Committees responsible Inside front cover Foreword ii 1S c o p e 1 2 Normative references 1 3T e r m s a n d d e f i n i t i o n s 1 4 General requirements 1 5 Capability approval 1 6 Relevant specification 2 7 Capability test programme 2 8 Quality confor

6、mity inspection 2 9 Test patterns and test boards 6 Bibliography 13 Figure 1 Composite test pattern 7 Figure 2 Composite test pattern (detailed dimensions) 8 Figure 3 Examples of multiple arrangements 9 Figure 4 Examples relating to access holes 10 Figure 5 Examples of delamination 11 Table 1 Group

7、A quality conformity inspection 3 Table 2 Group B quality conformity inspection 4 Table 3 Group C quality conformity inspection 5 Table 4 Test specimen details 6BS 123400:2001 ii BSI 17 December 2001 Foreword This British Standard has been prepared by Technical Committee EPL/501, Electronic assembly

8、 technology. The BS 123000:2001 series of British Standards is based on draft proposals to revise the EN 123000 series dated 1992 and 1997. These were circulated and voted on in CENELEC, but the CENELEC Technical Board decided not to approve them for publication. Following repeated attempts by the B

9、ritish National Committee to get them published, the Technical Board agreed to grant derogation from standstill to the British National Committee to publish national standards on the basis of the prEN 123000 series (Technical Board decision D106/092). These standards are published to complement the

10、BS EN 123000 series, which remains current. They will be withdrawn only if they are replaced by revised EN standards. They have been published because they are considered to be an improvement upon the EN series, for the following reasons. a) Requirements for modern materials and surface finishes req

11、uired by the electronics industry have been incorporated. b) Reference is made to ANSI/IPC A-600F for many of the inspection criteria. This has been undertaken in response to industry requests. c) References to obsolete CECC regulatory documents have been replaced. d) Tests and requirements that are

12、 no longer considered relevant have been removed. e) The UK electronics industry requires standards that are subject to ongoing revision, in order to take account of new European Eco-Directives. This British Standard is a sectional specification. It should be read in conjunction with the generic spe

13、cification, BS 123000, and any associated capability detail specification. It has been assumed in the preparation of this British Standard that the execution of its provisions will be entrusted to appropriately qualified and experienced people, for whose use it has been produced. A British Standard

14、does not purport to include all the necessary provisions of a contract. Users of British Standards are responsible for their correct application. Compliance with a British Standard does not of itself confer immunity from legal obligations. Summary of pages This document comprises a front cover, an i

15、nside front cover, pages i and ii, pages 1 to 13 and a back cover. The BSI copyright notice displayed in this document indicates when the document was last issued.BS 123400:2001 BSI 17 December 2001 1 1 Scope This British Standard specifies characteristics to be assessed and test methods to be used

16、for capability approval testing and for quality conformity inspection (lot-by-lot and periodic inspection). It is applicable for all flexible single-sided and double-sided printed boards without through-connections, irrespective of their method of manufacture, when they are ready for the mounting of

17、 components. This British Standard is a sectional specification intended for use with the IECQ system of quality assessment for electronic components. 2 Normative references The following normative documents contain provisions which, through reference in this text, constitute provisions of this Brit

18、ish Standard. For dated references, subsequent amendments to, or revisions of, any of these publications do not apply. For undated references, the latest edition of the publication referred to applies. BS 4727-1:Group 11 (IEC 60194), Glossary of electrotechnical, power, telecommunication, electronic

19、s, lighting and colour terms Part 1: Terms common to power, telecommunications and electronics Group 11: Printed circuits. BS 6001-1:1999 (ISO 2859-1:1999), Sampling procedures for inspection by attributes Part 1: Sampling schemes indexed by acceptance quality limit (AQL) for lot-by-lot inspection.

20、BS 6221-2:1991 (IEC 60326-2:1990), Printed wiring boards Part 2: Methods of test. BS 6221-3 (IEC 60326-3), Printed wiring boards Guide for the design and use of printed wiring boards. BS 123000:2001, System of quality assessment Generic specification Printed boards. 3 Terms and definitions For the p

21、urposes of this British Standard the terms and definitions given in BS 4727-1:Group 11 and BS 123000 together with the following apply. 3.1 relevant specification product specification for an actual batch of printed boards, i.e. a customer detail specification as well as a capability detail specific

22、ation applied to a specific material, surface finish etc., as applicable 4 General requirements The following specifications for flexible single-sided and double-sided printed boards without through-connections shall be prepared, unless a suitable capability detail specification already exists, usin

23、g this British Standard as a basis: a) capability detail specifications for general use or applying to specific applications; b) customer detail specifications, which shall be prepared in accordance with BS 123000:2001, 7.2. NOTE 1 BS 123400-003 is an example of a capability detail specification for

24、 flexible single-sided and double-sided printed boards without through-connections. NOTE 2 A capability detail specification is prepared either by an international or national body or by a manufacturer (see also BS CECC 00111-4). A customer detail specification should preferably be written by the cu

25、stomer and allocated a number within the customers own system. Further details are given in BS 123000 and BS CECC 00114-3. 5 Capability approval 5.1 Basic capability Testing shall be carried out on the composite test pattern detailed in clause 9. 5.2 Additional capability BS 123000:2001, 5.3.3 shall

26、 apply. NOTE For multiple arrangements see also clause 9. 5.3 Maintenance of capability approval BS 123000:2001, 5.6 shall apply.BS 123400:2001 2 BSI 17 December 2001 6 Relevant specification The relevant specification shall contain all the information necessary to define the printed board clearly a

27、nd completely. Care shall be taken to avoid unnecessary proscriptions. Tolerances shall be stated as necessary. Nominal values without tolerances, or simple maximum or minimum values, shall be given where these are sufficient. Where tolerances are necessary for certain areas or parts of the printed

28、board only, they shall be applied and restricted to those areas or parts. If there are several possibilities of presentation, of tolerance classes etc., the selections given in BS 6221-3 shall be applied as practical. In the case of discrepancy between the customer detail specification and other per

29、tinent specifications (e.g. generic specification, sectional specification or capability detail specification), the customer detail specification shall prevail. 7 Capability test programme For initial demonstration and subsequent re-demonstration, the capability approval test programme shall be in a

30、ccordance with the relevant capability detail specification. Demonstration of additional capability shall be in accordance with BS 123000:2001, 5.3.3. NOTE For composite test pattern specimens, see clause 9 and Figure 1 and Figure 2. Examples of multiple arrangements of test patterns are shown in Fi

31、gure 3. Examples relating to access holes are shown in Figure 4, and examples of delamination are shown in Figure 5. There shall be no failures during any demonstration of capability. 8 Quality conformity inspection 8.1 General Quality conformity inspection shall be conducted on samples which are ei

32、ther taken from the production batch, or which are representative of the production batch (i.e. manufactured using the same processes, having the same features, and concurrent with the released batch). 8.2 Sampling plans The sampling plans of BS 6001-1, as referenced in Table 1, Table 2 and Table 3,

33、 shall be used. In all cases there shall be no defects. NOTE 1 Unless otherwise specified, production boards and/or specially designed test patterns may be used for carrying out tests for the lot-by-lot and periodic inspection. NOTE 2 Where specially designed test patterns are used, they may be incl

34、uded in the panel. They may be based upon the appropriate pattern of the composite test pattern as detailed in clause 9. 8.3 Inspection groups Inspection level C shall be used, unless another inspection level is specified in the customer detail specification. Other inspection levels shall be in acco

35、rdance with Table 1 and Table 2. Printed boards shall be aggregated into inspection lots in accordance with BS 123000:2001, 6.1. NOTE For definition of the inspection groups, see BS 123000:2001, 6.3. Quality conformity inspection shall be carried out in accordance with Table 1, Table 2 and Table 3.B

36、S 123400:2001 BSI 17 December 2001 3 Table 1 Group A quality conformity inspection Inspection group Characteristics Test no. aAssessment level A Assessment level B Assessment level C Assessment level D IL b AQL c IL AQL IL AQL IL AQL Sub-group A1 Visual inspection See BS 123000:2001, 7.2.5 See BS 12

37、3000:2001, 7.2.5 Conformity 1 S2 2.5 % 100 % Identification 1 S2 2.5 % 100 % Appearance 1a S2 2.5 % 100 % Workmanship 1a S2 2.5 % 100 % Board edges 1a S2 2.5 % 100 % Bonding, conductor to substrate 1a S2 2.5 % 100 % Bonding, coverlayer to substrate and pattern 1a S2 2.5 % 100 % Bonding, flexible sub

38、strate to rigidizing component 1a S2 2.5 % 100 % Conductor defects 1b S2 2.5 % 100 % Misalignment of solder resist and land 1a S2 2.5 % 100 % Particles between conductors 1b, 1c S2 2.5 % 100 % Sub-group A2 Dimensional examination Board dimensions 2 S1 4.0 % S4 2.5 % Holes 2 S1 4.0 % S4 2.5 % Access

39、holes 2 S1 4.0 % S4 2.5 % Slots, notches 2 S1 4.0 % S4 2.5 % Conductor width 2 S1 4.0 % S4 2.5 % Conductor spacing 2 S1 4.0 % S4 2.5 % Misalignment of hole and land 2 S1 4.0 % S4 2.5 % Misalignment of solder resist and land 2a S1 4.0 % S4 2.5 % Positional tolerance of hole centres 2 S1 4.0 % S4 2.5

40、% Sub-group A3 Spare group for additional group A tests NOTE This listing may be subject to continuing review, as required by the publication and revision of new capability detail specifications. a As specified in BS 6221-2:1991. b Inspection level (defined in BS 6001-1:1999, Table 1). c Acceptabili

41、ty quality level.BS 123400:2001 4 BSI 17 December 2001 Table 2 Group B quality conformity inspection Inspection group Characteristics Test no. a Assessment level A Assessment level B Assessment level C Assessment level D IL b AQL c IL AQL IL AQL IL AQL Sub-group B1 Dimensional interchangeability See

42、 BS 123000:2001, 7.2.5 See BS 123000:2001, 7.2.5 Board thickness (contact zone) 2 S2 2.5 % Sub-group B2 Solderability As received 14a S2 2.5 % S3 2.5 % After accelerated ageing 20a S2 2.5 % S3 2.5 % Sub-group B3 Thermal shock tests Interlaminar bond # S2 2.5 % Sub-group B4 Mechanical tests Peel stre

43、ngth, conductor to base material 10c S2 2.5 % Peel strength, coverlayer to conductor 11b S2 2.5 % Peel strength, flexible substrate to rigidizing component 10c S2 2.5 % Sub-group B5 Surface finish tests Adhesion of plating 13a S1 2.5 % S2 2.5 % Porosity of edge contact plating 13d #, 13e S1 2.5 % S2

44、 2.5 % Thickness of plating, contact areas 13f S2 2.5 % Sub-group B6 Spare group for additional group B tests Testing details marked “#” shall be included in the relevant capability detail specification. NOTE This listing may be subject to continuing review, as required by the publication and revisi

45、on of new capability detail specifications. a As specified in BS 6221-2:1991. b Inspection level (defined in BS 6001-1:1999, Table 1). c Acceptability quality level.BS 123400:2001 BSI 17 December 2001 5 Table 3 Group C quality conformity inspection Inspection group Characteristics Test no. a Assessm

46、ent level A Assessment level B Assessment level C Assessment level D No. of specimens No. of specimens No. of specimens No. of specimens Sub-group C1 Tests in 3-month intervals See BS 123000:2001, 7.2.5 See BS 123000:2001, 7.2.5 Process contamination # 20 Resistance to solder of coverlayer/resist #

47、6 Solvent and flux resistance of coverlayer/resist # 6 Flexural fatigue 21a Sub-group C2 Tests in 12-month intervals Not applicable Sub-group C3 Spare group for additional intervals Testing details marked “#” shall be included in the relevant capability detail specification. There shall be no failur

48、es. NOTE This listing may be subject to continuing review, as required by the publication and revision of new capability detail specifications. a As specified in BS 6221-2:1991.BS 123400:2001 6 BSI 17 December 2001 9 Test patterns and test boards 9.1 General A test pattern shall consist of: a) a par

49、t of a conductive pattern on a production board (and used in the application of the printed board); or b) a special test pattern particularly designed and prepared for the purpose of testing only. A test pattern shall be located: 1) on a test coupon (a portion of a printed board or a panel detached prior to using the printed board); or 2) on a separate test board. 9.2 Capability approval testing Basic capability shall be assessed using the composite test pattern given in 9.3. Where additional capability claim