Application Book (1-2).ppt

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1、Application Book (1/2),Silicon dioxide :Thermal oxide, TEOS, PETEOS, SOG, BSG, BPSG, repeatability, stability, mapping, multi-layers.Nitride : SiNx, GAP measurement.ONO, OPO and ONOPO stacks : ONO, OPO, ONOPO, crystallinity of Poly-Si, rugged poly,mappings, repeatability.Metals : Al, Cu, Cr, Mo, Pt,

2、 TiN, TaN, Wsix, AlCu, mappings.Photoresist-Anti Reflective Coatings : Photoresists, Oxinitride, ARC, mappings, reflectivity simulations.Flat Panel Display : Glass substrate, SiO2, SiN, ITO, metal, a-Si, polymer, colour filter, multilayer, repeatability, mappings, stress measurement, PDP application

3、 (Enamel, MgO, Al2O3).,Materials (1/3),a-C Ag AgInP AgInSbTe Al Al2O3* AlAs AlCr* AlCu* AlGaAs AlGaInP AgInSbTe* AlON AlOx AlSb AlSi AlSiCu AlSiTi,AlTi* Amorphous silicon* (doped and undoped, various hydrogen content) ARC* (inorganic top and bottom ARC) Au BaF2 BPSG* BSG BST* CaF2 Carbon Carbon-diam

4、ond CCl4 Cd CdSe CdTe Co Cr*,CoFe CoSi2 CoTi CrSi2 Cr3Si Cr5Si3 CSi Cu* CuOx Colour filters* (Blue, Red, Green & Black matrix) Enamel* Fe FeSi2 FOX* Glass* (BK7,7059,1737,LaSF9,SF11 ) GaAs,*Materials presented in the Application Book,Materials (2/3),GaAsOx GaN GaP GaPOx GaSb Ge* GeOx H2O HfSi2 HfO2

5、HgCdTe HSG* (rugged Poly) In2O3 InAs InAsOx InGaAs (stress and relaxed) InGaAsP InGaSbTe*,InP InPOx InSb Ir Ir3Si5 IrO2 ITO* KCl Li LiF Low K materials* MgF2 MgO* Mo MoSi2 Nb NbSi2 Ni,NiCr NiCrOx NiFe NiO NiSi Ni2Si Ni3Si Os Pb PbS PbSe Pd Pd2Si Pet Photoresist* (all photolithographic wavelengths) P

6、olycarbonate* Polyimide*,*Materials presented in the Application Book,Materials (3/3),Polymer Poly-Si* (doped, undoped, rugged) Pt PTEOS* PtSi PZT* ReSi Rh Ru RuOx SBT* Si* (crystalline, aSi & PolySi, doped undoped) SiAs SiC SiGex* (strained and relaxed) SiNx* (with different GAP) SiOx*,SiOH SiON:H * (with different SiH4 content) Sn SOG* Ta Ta2O5 TaN* TaSi2 TEOS ThF4 Ti TiN* TiO2 TiON TiSi2 TiSiOx TiW V,Void VaSi2 W WSix* Y2O3 YFeO ZnCdTe ZnS ZnSe ZnSeTe ZnSMg2 ZnS-SiO2* ZrN ZrOx ZrSi2,*Materials presented in the Application Book,