IEC 62137-1-3-2008 Surface mounting technology - Environmental and endurance test methods for surface mount solder joint - Part1-3 Cyclic drop test《表面安装技术 表面安装焊.pdf
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1、 IEC 62137-1-3 Edition 1.0 2008-11 INTERNATIONAL STANDARD NORME INTERNATIONALE Surface mounting technology Environmental and endurance test methods for surface mount solder joint Part 1-3: Cyclic drop test Technologie de montage en surface Mthodes dessais denvironnement et dendurance des joints bras
2、s monts en surface Partie 1-3: Essai de chute cyclique IEC 62137-1-3:2008 THIS PUBLICATION IS COPYRIGHT PROTECTED Copyright 2008 IEC, Geneva, Switzerland All rights reserved. Unless otherwise specified, no part of this publication may be reproduced or utilized in any form or by any means, electronic
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6、ational de la CEI de votre pays de rsidence. IEC Central Office 3, rue de Varemb CH-1211 Geneva 20 Switzerland Email: inmailiec.ch Web: www.iec.chAbout the IEC The International Electrotechnical Commission (IEC) is the leading global organization that prepares and publishes International Standards f
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16、publication ou si vous avez des questions, visitez le FAQ du Service clients ou contactez-nous: Email: csciec.ch Tl.: +41 22 919 02 11 Fax: +41 22 919 03 00 IEC 62137-1-3 Edition 1.0 2008-11 INTERNATIONAL STANDARD NORME INTERNATIONALE Surface mounting technology Environmental and endurance test meth
17、ods for surface mount solder joint Part 1-3: Cyclic drop test Technologie de montage en surface Mthodes dessais denvironnement et dendurance des joints brass monts en surface Partie 1-3: Essai de chute cyclique INTERNATIONAL ELECTROTECHNICAL COMMISSION COMMISSION ELECTROTECHNIQUE INTERNATIONALE T IC
18、S 31.190 PRICE CODE CODE PRIX ISBN 2-8318-1018-1 Registered trademark of the International Electrotechnical Commission Marque dpose de la Commission Electrotechnique Internationale 2 62137-1-3 IEC:2008 CONTENTS FOREWORD.3 1 Scope.5 2 Normative references .5 3 Terms and definitions .5 4 General remar
19、ks.6 5 Test equipment and materials.7 5.1 Reflow soldering oven .7 5.2 Drop impact test equipment.7 5.3 Test substrate .7 5.4 Solder alloy .7 5.5 Solder paste7 5.6 Specimen components 7 5.7 Strain gauge8 6 Mounting method8 7 Test method and procedure, and judgment conditions 8 7.1 Test procedure8 7.
20、2 Judgment conditions .9 8 Items to be included in the test report.9 9 Items to be given in the product specification .9 Annex A (normative) Drop impact test equipment.11 Annex B (normative) Test method and procedure.13 Annex C (informative) An example of test equipment and procedure16 Annex D (info
21、rmative) An example of strain gauge attachment procedure18 Bibliography23 Figure 1 Area for evaluation in the cyclic drop test.6 Figure 2 Typical reflow soldering profile.8 Figure A.1 Conceptual illustration of a substrate securing jig (reference) .12 Figure B.1 Strain gauge attachment example and g
22、uide mark 13 Figure B.2 Strain and other waveforms (example)14 Figure B.3 Examples of crack (fracture) modes14 Figure B.4 Correlation between the number of failures and the maximum strain.15 Figure C.1 Example of drop impact test equipment and connections for testing .16 Figure D.1 Items to use19 Fi
23、gure D.2 Strain gauge attachment procedures 21 Figure D.3 Gauge factor compensation 21 Figure D.4 Example of attaching strain gauge and guide mark dimensions 22 62137-1-3 IEC:2008 3 INTERNATIONAL ELECTROTECHNICAL COMMISSION _ SURFACE MOUNTING TECHNOLOGY ENVIRONMENTAL AND ENDURANCE TEST METHODS FOR S
24、URFACE MOUNT SOLDER JOINT Part 1-3: Cyclic drop test FOREWORD 1) The International Electrotechnical Commission (IEC) is a worldwide organization for standardization comprising all national electrotechnical committees (IEC National Committees). The object of IEC is to promote international co-operati
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