EN 61189-5-2-2015 en Test methods for electrical materials printed boards and other interconnection structures and assemblies - Part 5-2 General test methods for materials and asse.pdf

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1、BSI Standards PublicationTest methods for electrical materials, printed boards and other interconnection structures and assembliesPart 5-2: General test methods for materials and assemblies Soldering flux for printed board assembliesBS IEC 61189-5-2:2015BS EN 61189-5-2:2015BS EN 61189-5-2:2015 BRITI

2、SH STANDARDNational forewordThis British Standard is the UK implementation of EN 61189-5-2:2015. It is identical to IEC 61189-5-2:2015. It supersedes BS IEC 61189-5-2:2015, which is withdrawn.The UK participation in its preparation was entrusted to Technical Committee EPL/501, Electronic Assembly Te

3、chnology.A list of organizations represented on this committee can be obtained on request to its secretary.This publication does not purport to include all the necessary provisions of a contract. Users are responsible for its correct application. The British Standards Institution 2015. Published by

4、BSI Standards Limited 2015ISBN 978 0 580 90018 1ICS 31.180Compliance with a British Standard cannot confer immunity from legal obligations.This British Standard was published under the authority of the Standards Policy and Strategy Committee on 31 January 2015.Amendments/corrigenda issued since publ

5、icationDate Text affected30 April 2015 This corrigendum renumbers BS IEC 61189-5-2:2015 as BS EN 61189-5-2:2015EUROPEAN STANDARD NORME EUROPENNE EUROPISCHE NORM EN 61189-5-2 March 2015 ICS 31.180 English Version Test methods for electrical materials, printed boards and other interconnection structur

6、es and assemblies - Part 5-2: General test methods for materials and assemblies - Soldering flux for printed board assemblies (IEC 61189-5-2:2015) Mthodes dessai pour les matriaux lectriques, les cartes imprimes et autres structures dinterconnexion et ensembles - Partie 5-2: Mthodes dessai gnrales p

7、our les matriaux et les assemblages - Flux de brasage pour les assemblages de cartes imprimes (IEC 61189-5-2:2015) Prfverfahren fr Elektromaterialien, Verbindungsstrukturen und Baugruppen - Teil 5-2: Prfverfahren fr bestckte Leiterplatten - Teil Ltflussmittel (IEC 61189-5-2:2015) This European Stand

8、ard was approved by CENELEC on 2015-02-12. CENELEC members are bound to comply with the CEN/CENELEC Internal Regulations which stipulate the conditions for giving this European Standard the status of a national standard without any alteration. Up-to-date lists and bibliographical references concerni

9、ng such national standards may be obtained on application to the CEN-CENELEC Management Centre or to any CENELEC member. This European Standard exists in three official versions (English, French, German). A version in any other language made by translation under the responsibility of a CENELEC membe

10、r into its own language and notified to the CEN-CENELEC Management Centre has the same status as the official versions. CENELEC members are the national electrotechnical committees of Austria, Belgium, Bulgaria, Croatia, Cyprus, the Czech Republic, Denmark, Estonia, Finland, Former Yugoslav Republic

11、 of Macedonia, France, Germany, Greece, Hungary, Iceland, Ireland, Italy, Latvia, Lithuania, Luxembourg, Malta, the Netherlands, Norway, Poland, Portugal, Romania, Slovakia, Slovenia, Spain, Sweden, Switzerland, Turkey and the United Kingdom. European Committee for Electrotechnical Standardization C

12、omit Europen de Normalisation Electrotechnique Europisches Komitee fr Elektrotechnische Normung CEN-CENELEC Management Centre: Avenue Marnix 17, B-1000 Brussels 2015 CENELEC All rights of exploitation in any form and by any means reserved worldwide for CENELEC Members. Ref. No. EN 61189-5-2:2015 E E

13、N 61189-5-2:2015 - 2 - Foreword The text of document 91/1210/FDIS, future edition 1 of IEC 61189-5-2, prepared by IEC/TC 91 “Electronics assembly technology“ was submitted to the IEC-CENELEC parallel vote and approved by CENELEC as EN 61189-5-2:2015. The following dates are fixed: latest date by whi

14、ch the document has to be implemented at national level by publication of an identical national standard or by endorsement (dop) 2015-11-12 latest date by which the national standards conflicting with the document have to be withdrawn (dow) 2018-02-12 Attention is drawn to the possibility that some

15、of the elements of this document may be the subject of patent rights. CENELEC and/or CEN shall not be held responsible for identifying any or all such patent rights. Endorsement notice The text of the International Standard IEC 61189-5-2:2015 was approved by CENELEC as a European Standard without an

16、y modification. In the official version, for Bibliography, the following notes have to be added for the standards indicated: IEC 60068 Series NOTE Harmonized as EN 60068 Series. IEC 60068-1:2013 NOTE Harmonized as EN 60068-1:2014 (not modified). IEC 60068-2-20 NOTE Harmonized as EN 60068-2-20. IEC 6

17、1189-1 NOTE Harmonized as EN 61189-1. IEC 61189-2 NOTE Harmonized as EN 61189-2. IEC 61189-3 NOTE Harmonized as EN 61189-3. IEC 61190-1-2 NOTE Harmonized as EN 61190-1-2. IEC 61249-2-7 NOTE Harmonized as EN 61249-2-7. IEC 62137:2004 NOTE Harmonized as EN 62137:2004 (not modified). ISO 9001 NOTE Harm

18、onized as EN ISO 9001. 2 BS EN 61189-5-2:2015EN 61189-5-2:2015EN 61189-5-2:2015 - 2 - Foreword The text of document 91/1210/FDIS, future edition 1 of IEC 61189-5-2, prepared by IEC/TC 91 “Electronics assembly technology“ was submitted to the IEC-CENELEC parallel vote and approved by CENELEC as EN 61

19、189-5-2:2015. The following dates are fixed: latest date by which the document has to be implemented at national level by publication of an identical national standard or by endorsement (dop) 2015-11-12 latest date by which the national standards conflicting with the document have to be withdrawn (d

20、ow) 2018-02-12 Attention is drawn to the possibility that some of the elements of this document may be the subject of patent rights. CENELEC and/or CEN shall not be held responsible for identifying any or all such patent rights. Endorsement notice The text of the International Standard IEC 61189-5-2

21、:2015 was approved by CENELEC as a European Standard without any modification. In the official version, for Bibliography, the following notes have to be added for the standards indicated: IEC 60068 Series NOTE Harmonized as EN 60068 Series. IEC 60068-1:2013 NOTE Harmonized as EN 60068-1:2014 (not mo

22、dified). IEC 60068-2-20 NOTE Harmonized as EN 60068-2-20. IEC 61189-1 NOTE Harmonized as EN 61189-1. IEC 61189-2 NOTE Harmonized as EN 61189-2. IEC 61189-3 NOTE Harmonized as EN 61189-3. IEC 61190-1-2 NOTE Harmonized as EN 61190-1-2. IEC 61249-2-7 NOTE Harmonized as EN 61249-2-7. IEC 62137:2004 NOTE

23、 Harmonized as EN 62137:2004 (not modified). ISO 9001 NOTE Harmonized as EN ISO 9001. - 3 - EN 61189-5-2:2015 Annex ZA (normative) Normative references to international publications with their corresponding European publications The following documents, in whole or in part, are normatively reference

24、d in this document and are indispensable for its application. For dated references, only the edition cited applies. For undated references, the latest edition of the referenced document (including any amendments) applies. NOTE 1 When an International Publication has been modified by common modificat

25、ions, indicated by (mod), the relevant EN/HD applies. NOTE 2 Up-to-date information on the latest versions of the European Standards listed in this annex is available here: www.cenelec.eu Publication Year Title EN/HD Year IEC 61189-5 - Test methods for electrical materials, interconnection structure

26、s and assemblies - Part 5: Test methods for printed board assemblies EN 61189-5 - IEC 61189-6 - Test methods for electrical materials, interconnection structures and assemblies - Part 6: Test methods for materials used in manufacturing electronic assemblies EN 61189-6 - IEC 61190-1-1 - Attachment ma

27、terials for electronic assembly - Part 1-1: Requirements for soldering fluxes for high-quality interconnections in electronics assembly EN 61190-1-1 - IEC 61190-1-3 - Attachment materials for electronic assembly - Part 1-3: Requirements for electronic grade solder alloys and fluxed and non-fluxed so

28、lid solders for electronic soldering applications EN 61190-1-3 - ISO 9455 Series Soft soldering fluxes - Test methods EN ISO 9455 Series ISO 9455-1 - Soft soldering fluxes - Test methods - Part 1: Determination of non-volatile matter, gravimetric method EN 29455-1 - ISO 9455-2 - Soft soldering fluxe

29、s - Test methods - Part 2: Determination of non-volatile matter, ebulliometric method EN ISO 9455-2 - 3 BS EN 61189-5-2:2015EN 61189-5-2:2015 2 IEC 61189-5-2:2015 IEC 2015 CONTENTS FOREWORD . 5 INTRODUCTION . 7 1 Scope 8 2 Normative references 8 3 Accuracy, precision and resolution 8 3.1 General . 8

30、 3.2 Accuracy . 9 3.3 Precision . 9 3.4 Resolution 10 3.5 Report. 10 3.6 Students t distribution 10 3.7 Suggested uncertainty limits . 11 4 C: Chemical test methods 12 4.1 Test 5-2C01: Corrosion, flux . 12 4.1.1 Object 12 4.1.2 Test specimen . 12 4.1.3 Apparatus and reagents . 12 4.1.4 Procedures 12

31、 4.1.5 Additional information 14 4.2 Test 5-2C02: Determination of acid value of liquid soldering flux potentiometric and visual titration methods . 14 4.2.1 Object 14 4.2.2 Test specimen . 14 4.2.3 Apparatus and reagents . 14 4.2.4 Procedures 15 4.2.5 Additional information 16 4.3 Test 5-2C03: Acid

32、 number of rosin 16 4.4 Test 5-2C04: Determination of halides in fluxes, silver chromate method 16 4.4.1 Object 16 4.4.2 Test specimen . 17 4.4.3 Apparatus and reagents . 17 4.4.4 Procedure 17 4.4.5 Evaluation . 17 4.4.6 Additional information 17 4.5 Test 5-2C05: Solids content, flux 18 4.5.1 Object

33、 18 4.5.2 Test specimen . 18 4.5.3 Apparatus and reagents . 18 4.5.4 Procedures 19 4.5.5 Evaluation . 19 4.5.6 Additional information 19 4.6 Test 5-2C06: Quantitative determination of halide content in fluxes (chloride and bromide) 19 4.6.1 Object 19 4.6.2 Test specimen . 20 4.6.3 Apparatus and reag

34、ents . 20 BS IEC 61189-5-2:2015 4 BS EN 61189-5-2:2015EN 61189-5-2:20156899991010111111121313131313131515151515161717171718181818181919191920202020202121 2 IEC 61189-5-2:2015 IEC 2015 CONTENTS FOREWORD . 5 INTRODUCTION . 7 1 Scope 8 2 Normative references 8 3 Accuracy, precision and resolution 8 3.1

35、 General . 8 3.2 Accuracy . 9 3.3 Precision . 9 3.4 Resolution 10 3.5 Report. 10 3.6 Students t distribution 10 3.7 Suggested uncertainty limits . 11 4 C: Chemical test methods 12 4.1 Test 5-2C01: Corrosion, flux . 12 4.1.1 Object 12 4.1.2 Test specimen . 12 4.1.3 Apparatus and reagents . 12 4.1.4 P

36、rocedures 12 4.1.5 Additional information 14 4.2 Test 5-2C02: Determination of acid value of liquid soldering flux potentiometric and visual titration methods . 14 4.2.1 Object 14 4.2.2 Test specimen . 14 4.2.3 Apparatus and reagents . 14 4.2.4 Procedures 15 4.2.5 Additional information 16 4.3 Test

37、5-2C03: Acid number of rosin 16 4.4 Test 5-2C04: Determination of halides in fluxes, silver chromate method 16 4.4.1 Object 16 4.4.2 Test specimen . 17 4.4.3 Apparatus and reagents . 17 4.4.4 Procedure 17 4.4.5 Evaluation . 17 4.4.6 Additional information 17 4.5 Test 5-2C05: Solids content, flux 18

38、4.5.1 Object 18 4.5.2 Test specimen . 18 4.5.3 Apparatus and reagents . 18 4.5.4 Procedures 19 4.5.5 Evaluation . 19 4.5.6 Additional information 19 4.6 Test 5-2C06: Quantitative determination of halide content in fluxes (chloride and bromide) 19 4.6.1 Object 19 4.6.2 Test specimen . 20 4.6.3 Appara

39、tus and reagents . 20 BS IEC 61189-5-2:2015 4 IEC 61189-5-2:2015 IEC 2015 5.3.5 Evaluation . 39 5.3.6 Additional information 39 Bibliography 40 Figure 1 Chlorides and/or bromides test results . 18 Figure 2 Test equipment of specific gravity (hydrometer reading) . 28 Figure 3 Flux type classification

40、 by copper mirror test 30 Figure 4 Wetting balance apparatus . 32 Figure 5 Wetting balance curve 33 Table 1 Students t distribution . 11 Table 2 Relation between halide content and mass of specimen 22 Table 3 Mixing ratio from specimen size to water quantity 25 Table 4 Specimen size to chloroform mi

41、xture . 26 Table 5 Typical spread areas defined in mm235 BS IEC 61189-5-2:2015BS EN 61189-5-2:2015IEC 61189-5-2:2015 5 40404119293133341223262736IEC 61189-5-2:2015 IEC 2015 5 INTERNATIONAL ELECTROTECHNICAL COMMISSION _ TEST METHODS FOR ELECTRICAL MATERIALS, PRINTED BOARDS AND OTHER INTERCONNECTION S

42、TRUCTURES AND ASSEMBLIES Part 5-2: General test methods for materials and assemblies Soldering flux for printed board assemblies FOREWORD 1) The International Electrotechnical Commission (IEC) is a worldwide organization for standardization comprising all national electrotechnical committees (IEC Na

43、tional Committees). The object of IEC is to promote international co-operation on all questions concerning standardization in the electrical and electronic fields. To this end and in addition to other activities, IEC publishes International Standards, Technical Specifications, Technical Reports, Pub

44、licly Available Specifications (PAS) and Guides (hereafter referred to as “IEC Publication(s)”). Their preparation is entrusted to technical committees; any IEC National Committee interested in the subject dealt with may participate in this preparatory work. International, governmental and non-gover

45、nmental organizations liaising with the IEC also participate in this preparation. IEC collaborates closely with the International Organization for Standardization (ISO) in accordance with conditions determined by agreement between the two organizations. 2) The formal decisions or agreements of IEC o

46、n technical matters express, as nearly as possible, an international consensus of opinion on the relevant subjects since each technical committee has representation from all interested IEC National Committees. 3) IEC Publications have the form of recommendations for international use and are accepte

47、d by IEC National Committees in that sense. While all reasonable efforts are made to ensure that the technical content of IEC Publications is accurate, IEC cannot be held responsible for the way in which they are used or for any misinterpretation by any end user. 4) In order to promote international

48、 uniformity, IEC National Committees undertake to apply IEC Publications transparently to the maximum extent possible in their national and regional publications. Any divergence between any IEC Publication and the corresponding national or regional publication shall be clearly indicated in the latte

49、r. 5) IEC itself does not provide any attestation of conformity. Independent certification bodies provide conformity assessment services and, in some areas, access to IEC marks of conformity. IEC is not responsible for any services carried out by independent certification bodies. 6) All users should ensure that they have the latest edition of this publication. 7) No liability shall attach to IEC or its directors, employees, servants or agents including individual experts