EN 60749-9-2017 en Semiconductor devices - Mechanical and climatic test methods - Part 9 Permanence of marking.pdf

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1、Semiconductor devices - Mechanical and climatic test methodsPart 9: Permanence of marking (IEC 60749-9:2017)BS EN 60749-9:2017BSI Standards PublicationWB11885_BSI_StandardCovs_2013_AW.indd 1 15/05/2013 15:06EUROPEAN STANDARD NORME EUROPENNE EUROPISCHE NORM EN 60749-9 June 2017 ICS 31.080.01 Supersed

2、es EN 60749-9:2002 English Version Semiconductor devices - Mechanical and climatic test methods - Part 9: Permanence of marking (IEC 60749-9:2017) Dispositifs semiconducteurs - Mthodes dessais mcaniques et climatiques - Partie 9: Permanence du marquage (IEC 60749-9:2017) Halbleiterbauelemente - Mech

3、anische und klimatische Prfverfahren - Teil 9: Bestndigkeit der Kennzeichnung (IEC 60749-9:2017) This European Standard was approved by CENELEC on 2017-04-07. CENELEC members are bound to comply with the CEN/CENELEC Internal Regulations which stipulate the conditions for giving this European Standar

4、d the status of a national standard without any alteration. Up-to-date lists and bibliographical references concerning such national standards may be obtained on application to the CEN-CENELEC Management Centre or to any CENELEC member. This European Standard exists in three official versions (Engli

5、sh, French, German). A version in any other language made by translation under the responsibility of a CENELEC member into its own language and notified to the CEN-CENELEC Management Centre has the same status as the official versions. CENELEC members are the national electrotechnical committees of

6、Austria, Belgium, Bulgaria, Croatia, Cyprus, the Czech Republic, Denmark, Estonia, Finland, Former Yugoslav Republic of Macedonia, France, Germany, Greece, Hungary, Iceland, Ireland, Italy, Latvia, Lithuania, Luxembourg, Malta, the Netherlands, Norway, Poland, Portugal, Romania, Serbia, Slovakia, Sl

7、ovenia, Spain, Sweden, Switzerland, Turkey and the United Kingdom. European Committee for Electrotechnical Standardization Comit Europen de Normalisation Electrotechnique Europisches Komitee fr Elektrotechnische Normung CEN-CENELEC Management Centre: Avenue Marnix 17, B-1000 Brussels 2017 CENELEC Al

8、l rights of exploitation in any form and by any means reserved worldwide for CENELEC Members. Ref. No. EN 60749-9:2017 E National forewordThis British Standard is the UK implementation of EN 60749-9:2017. It is identical to IEC 60749-9:2017. It supersedes BS EN 60749-9:2002, which is withdrawn.The U

9、K participation in its preparation was entrusted to Technical Committee EPL/47, Semiconductors.A list of organizations represented on this committee can be obtained on request to its secretary.This publication does not purport to include all the necessary provisions of a contract. Users are responsi

10、ble for its correct application. The British Standards Institution 2017 Published by BSI Standards Limited 2017ISBN 978 0 580 94935 7ICS 31.080.01Compliance with a British Standard cannot confer immunity from legal obligations.This British Standard was published under the authority of the Standards

11、Policy and Strategy Committee on 30 November 2017.Amendments/corrigenda issued since publicationDate Text affectedBRITISH STANDARDBS EN 607499:2017EUROPEAN STANDARD NORME EUROPENNE EUROPISCHE NORM EN 60749-9 June 2017 ICS 31.080.01 Supersedes EN 60749-9:2002 English Version Semiconductor devices - M

12、echanical and climatic test methods - Part 9: Permanence of marking (IEC 60749-9:2017) Dispositifs semiconducteurs - Mthodes dessais mcaniques et climatiques - Partie 9: Permanence du marquage (IEC 60749-9:2017) Halbleiterbauelemente - Mechanische und klimatische Prfverfahren - Teil 9: Bestndigkeit

13、der Kennzeichnung (IEC 60749-9:2017) This European Standard was approved by CENELEC on 2017-04-07. CENELEC members are bound to comply with the CEN/CENELEC Internal Regulations which stipulate the conditions for giving this European Standard the status of a national standard without any alteration.

14、Up-to-date lists and bibliographical references concerning such national standards may be obtained on application to the CEN-CENELEC Management Centre or to any CENELEC member. This European Standard exists in three official versions (English, French, German). A version in any other language made by

15、 translation under the responsibility of a CENELEC member into its own language and notified to the CEN-CENELEC Management Centre has the same status as the official versions. CENELEC members are the national electrotechnical committees of Austria, Belgium, Bulgaria, Croatia, Cyprus, the Czech Repub

16、lic, Denmark, Estonia, Finland, Former Yugoslav Republic of Macedonia, France, Germany, Greece, Hungary, Iceland, Ireland, Italy, Latvia, Lithuania, Luxembourg, Malta, the Netherlands, Norway, Poland, Portugal, Romania, Serbia, Slovakia, Slovenia, Spain, Sweden, Switzerland, Turkey and the United Ki

17、ngdom. European Committee for Electrotechnical Standardization Comit Europen de Normalisation Electrotechnique Europisches Komitee fr Elektrotechnische Normung CEN-CENELEC Management Centre: Avenue Marnix 17, B-1000 Brussels 2017 CENELEC All rights of exploitation in any form and by any means reserv

18、ed worldwide for CENELEC Members. Ref. No. EN 60749-9:2017 E BS EN 607499:2017EN 60749-9:2017 2 European foreword The text of document 47/2348/FDIS, future edition 2 of IEC 60749-9, prepared by IEC/TC 47 “Semiconductor devices“ was submitted to the IEC-CENELEC parallel vote and approved by CENELEC a

19、s EN 60749-9:2017. The following dates are fixed: latest date by which the document has to be implemented at national level by publication of an identical national standard or by endorsement (dop) 2018-01-07 latest date by which the national standards conflicting with the document have to be withdra

20、wn (dow) 2020-04-07 This document supersedes EN 60749-9:2002. Attention is drawn to the possibility that some of the elements of this document may be the subject of patent rights. CENELEC shall not be held responsible for identifying any or all such patent rights. Endorsement notice The text of the

21、International Standard IEC 60749-9:2017 was approved by CENELEC as a European Standard without any modification. In the official version, for Bibliography, the following note has to be added for the standard indicated : IEC 61340-2-3:2016 NOTE Harmonized as EN 61340-2-3:2016 (not modified). 2 IEC 60

22、749-9:2017 IEC 2017 CONTENTS FOREWORD . 3 1 Scope 5 2 Normative references 5 3 Terms and definitions 5 4 Equipment . 6 5 Safety precautions . 7 6 Procedure 7 6.1 Solvents test . 7 6.2 Tape pull test 7 7 Failure criteria . 8 8 Summary . 8 Bibliography 9 BS EN 607499:2017EN 60749-9:2017 2 European for

23、eword The text of document 47/2348/FDIS, future edition 2 of IEC 60749-9, prepared by IEC/TC 47 “Semiconductor devices“ was submitted to the IEC-CENELEC parallel vote and approved by CENELEC as EN 60749-9:2017. The following dates are fixed: latest date by which the document has to be implemented at

24、 national level by publication of an identical national standard or by endorsement (dop) 2018-01-07 latest date by which the national standards conflicting with the document have to be withdrawn (dow) 2020-04-07 This document supersedes EN 60749-9:2002. Attention is drawn to the possibility that som

25、e of the elements of this document may be the subject of patent rights. CENELEC shall not be held responsible for identifying any or all such patent rights. Endorsement notice The text of the International Standard IEC 60749-9:2017 was approved by CENELEC as a European Standard without any modificat

26、ion. In the official version, for Bibliography, the following note has to be added for the standard indicated : IEC 61340-2-3:2016 NOTE Harmonized as EN 61340-2-3:2016 (not modified). 2 IEC 60749-9:2017 IEC 2017 CONTENTS FOREWORD . 3 1 Scope 5 2 Normative references 5 3 Terms and definitions 5 4 Equ

27、ipment . 6 5 Safety precautions . 7 6 Procedure 7 6.1 Solvents test . 7 6.2 Tape pull test 7 7 Failure criteria . 8 8 Summary . 8 Bibliography 9 BS EN 607499:2017IEC 60749-9:2017 IEC 2017 3 INTERNATIONAL ELECTROTECHNICAL COMMISSION _ SEMICONDUCTOR DEVICES MECHANICAL AND CLIMATIC TEST METHODS Part 9:

28、 Permanence of marking FOREWORD 1) The International Electrotechnical Commission (IEC) is a worldwide organization for standardization comprising all national electrotechnical committees (IEC National Committees). The object of IEC is to promote international co-operation on all questions concerning

29、 standardization in the electrical and electronic fields. To this end and in addition to other activities, IEC publishes International Standards, Technical Specifications, Technical Reports, Publicly Available Specifications (PAS) and Guides (hereafter referred to as “IEC Publication(s)”). Their pre

30、paration is entrusted to technical committees; any IEC National Committee interested in the subject dealt with may participate in this preparatory work. International, governmental and non-governmental organizations liaising with the IEC also participate in this preparation. IEC collaborates closely

31、 with the International Organization for Standardization (ISO) in accordance with conditions determined by agreement between the two organizations. 2) The formal decisions or agreements of IEC on technical matters express, as nearly as possible, an international consensus of opinion on the relevant

32、subjects since each technical committee has representation from all interested IEC National Committees. 3) IEC Publications have the form of recommendations for international use and are accepted by IEC National Committees in that sense. While all reasonable efforts are made to ensure that the techn

33、ical content of IEC Publications is accurate, IEC cannot be held responsible for the way in which they are used or for any misinterpretation by any end user. 4) In order to promote international uniformity, IEC National Committees undertake to apply IEC Publications transparently to the maximum exte

34、nt possible in their national and regional publications. Any divergence between any IEC Publication and the corresponding national or regional publication shall be clearly indicated in the latter. 5) IEC itself does not provide any attestation of conformity. Independent certification bodies provide

35、conformity assessment services and, in some areas, access to IEC marks of conformity. IEC is not responsible for any services carried out by independent certification bodies. 6) All users should ensure that they have the latest edition of this publication. 7) No liability shall attach to IEC or its

36、directors, employees, servants or agents including individual experts and members of its technical committees and IEC National Committees for any personal injury, property damage or other damage of any nature whatsoever, whether direct or indirect, or for costs (including legal fees) and expenses ar

37、ising out of the publication, use of, or reliance upon, this IEC Publication or any other IEC Publications. 8) Attention is drawn to the Normative references cited in this publication. Use of the referenced publications is indispensable for the correct application of this publication. 9) Attention i

38、s drawn to the possibility that some of the elements of this IEC Publication may be the subject of patent rights. IEC shall not be held responsible for identifying any or all such patent rights. International Standard IEC 60749-9 has been prepared by IEC technical committee 47: Semiconductor devices

39、. This second edition cancels and replaces the first edition published in 2002. This edition constitutes a technical revision. This edition includes the following significant technical changes with respect to the previous edition: a) revision to Clause 4 Equipment by a complete rewriting of Clause 3

40、 Terms and definitions; b) additional variant adhesive tape pull test. BS EN 607499:2017IEC 60749-9:2017 IEC 2017 3 INTERNATIONAL ELECTROTECHNICAL COMMISSION _ SEMICONDUCTOR DEVICES MECHANICAL AND CLIMATIC TEST METHODS Part 9: Permanence of marking FOREWORD 1) The International Electrotechnical Comm

41、ission (IEC) is a worldwide organization for standardization comprising all national electrotechnical committees (IEC National Committees). The object of IEC is to promote international co-operation on all questions concerning standardization in the electrical and electronic fields. To this end and

42、in addition to other activities, IEC publishes International Standards, Technical Specifications, Technical Reports, Publicly Available Specifications (PAS) and Guides (hereafter referred to as “IEC Publication(s)”). Their preparation is entrusted to technical committees; any IEC National Committee

43、interested in the subject dealt with may participate in this preparatory work. International, governmental and non-governmental organizations liaising with the IEC also participate in this preparation. IEC collaborates closely with the International Organization for Standardization (ISO) in accordan

44、ce with conditions determined by agreement between the two organizations. 2) The formal decisions or agreements of IEC on technical matters express, as nearly as possible, an international consensus of opinion on the relevant subjects since each technical committee has representation from all intere

45、sted IEC National Committees. 3) IEC Publications have the form of recommendations for international use and are accepted by IEC National Committees in that sense. While all reasonable efforts are made to ensure that the technical content of IEC Publications is accurate, IEC cannot be held responsib

46、le for the way in which they are used or for any misinterpretation by any end user. 4) In order to promote international uniformity, IEC National Committees undertake to apply IEC Publications transparently to the maximum extent possible in their national and regional publications. Any divergence be

47、tween any IEC Publication and the corresponding national or regional publication shall be clearly indicated in the latter. 5) IEC itself does not provide any attestation of conformity. Independent certification bodies provide conformity assessment services and, in some areas, access to IEC marks of

48、conformity. IEC is not responsible for any services carried out by independent certification bodies. 6) All users should ensure that they have the latest edition of this publication. 7) No liability shall attach to IEC or its directors, employees, servants or agents including individual experts and

49、members of its technical committees and IEC National Committees for any personal injury, property damage or other damage of any nature whatsoever, whether direct or indirect, or for costs (including legal fees) and expenses arising out of the publication, use of, or reliance upon, this IEC Publication or any other IEC Publications. 8) Attention is drawn to the Normative references cited in this publication. Use of the referenced publications is indispensable for the correct applicati