DLA SMD-5962-96878 REV C-2009 MICROCIRCUIT DIGITAL BIPOLAR SCHOTTKY TTL HEX BUFFERS LINE DRIVERS WITH 3-STATE OUTPUTS WITH 2 INDEPENDENT OR 2 DEPENDENT INPUTS MONOLITHIC SILICON.pdf
《DLA SMD-5962-96878 REV C-2009 MICROCIRCUIT DIGITAL BIPOLAR SCHOTTKY TTL HEX BUFFERS LINE DRIVERS WITH 3-STATE OUTPUTS WITH 2 INDEPENDENT OR 2 DEPENDENT INPUTS MONOLITHIC SILICON.pdf》由会员分享,可在线阅读,更多相关《DLA SMD-5962-96878 REV C-2009 MICROCIRCUIT DIGITAL BIPOLAR SCHOTTKY TTL HEX BUFFERS LINE DRIVERS WITH 3-STATE OUTPUTS WITH 2 INDEPENDENT OR 2 DEPENDENT INPUTS MONOLITHIC SILICON.pdf(13页珍藏版)》请在麦多课文档分享上搜索。
1、 REVISIONS LTR DESCRIPTION DATE (YR-MO-DA) APPROVED A Changes in accordance with NOR 5962-R150-97. 96-12-10 Raymond L. Monnin B Changes in accordance with NOR 5962-R194-97. 97-01-24 Raymond L. Monnin C Update drawing to current requirements. Editorial changes throughout. - gap 09-05-14 Joseph D. Rod
2、enbeck REV SHET REV SHET REV STATUS REV C C C C C C C C C C C C OF SHEETS SHEET 1 2 3 4 5 6 7 8 9 10 11 12 PMIC N/A PREPARED BY Larry E. Shaw DEFENSE SUPPLY CENTER COLUMBUS COLUMBUS, OHIO 43218-3990 http:/www.dscc.dla.mil STANDARD MICROCIRCUIT DRAWING THIS DRAWING IS AVAILABLE FOR USE BY ALL DEPARTM
3、ENTS AND AGENCIES OF THE DEPARTMENT OF DEFENSE CHECKED BY Tuan D Nguyen APPROVED BY Raymond Monnin MICROCIRCUIT, DIGITAL, BIPOLAR, SCHOTTKY TTL, HEX BUFFERS/LINE DRIVERS WITH 3-STATE OUTPUTS WITH 2 INDEPENDENT OR 2 DEPENDENT INPUTS, MONOLITHIC SILICON DRAWING APPROVAL DATE 96-09-04 AMSC N/A REVISION
4、 LEVEL C SIZE A CAGE CODE 67268 5962-96878 SHEET 1 OF 12 DSCC FORM 2233 APR 97 5962-E060-09 Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-STANDARD MICROCIRCUIT DRAWING SIZE A 5962-96878 DEFENSE SUPPLY CENTER COLUMBUS COLUMBUS, OHIO 43218-3990 REVIS
5、ION LEVEL C SHEET 2 DSCC FORM 2234 APR 97 1. SCOPE 1.1 Scope. This drawing documents two product assurance class levels consisting of high reliability (device classes Q and M) and space application (device class V). A choice of case outlines and lead finishes are available and are reflected in the P
6、art or Identifying Number (PIN). When available, a choice of Radiation Hardness Assurance (RHA) levels is reflected in the PIN. 1.2 PIN. The PIN is as shown in the following example: 5962 - 96878 01 Q E X Federal stock class designator RHA designator (see 1.2.1) Devicetype (see 1.2.2)Deviceclass des
7、ignatorCaseoutline (see 1.2.4) Leadfinish (see 1.2.5) / (see 1.2.3) / Drawing number 1.2.1 RHA designator. Device classes Q and V RHA marked devices meet the MIL-PRF-38535 specified RHA levels and are marked with the appropriate RHA designator. Device class M RHA marked devices meet the MIL-PRF-3853
8、5, appendix A specified RHA levels and are marked with the appropriate RHA designator. A dash (-) indicates a non-RHA device. 1.2.2 Device type(s). The device type(s) identify the circuit function as follows: Device type Generic number Circuit function 01 54365A Hex bus driver, non-inverted, 3-state
9、 outputs 02 54366A Hex bus driver, inverted, 3-state outputs 03 54367A Hex bus driver, non-inverted, 3-state outputs, w/2 independent enable inputs 04 54368A Hex bus driver, inverted, 3-state outputs, w/2 independent enable inputs 1.2.3 Device class designator. The device class designator is a singl
10、e letter identifying the product assurance level as follows: Device class Device requirements documentation M Vendor self-certification to the requirements for MIL-STD-883 compliant, non-JAN class level B microcircuits in accordance with MIL-PRF-38535, appendix A Q or V Certification and qualificati
11、on to MIL-PRF-38535 1.2.4 Case outline(s). The case outline(s) are as designated in MIL-STD-1835 and as follows: Outline letter Descriptive designator Terminals Package style E GDIP1-T16 or CDIP2-T16 16 Dual-in-line F GDFP2-F16 or CDFP3-F16 16 Flat package 1.2.5 Lead finish. The lead finish is as sp
12、ecified in MIL-PRF-38535 for device classes Q and V or MIL-PRF-38535, appendix A for device class M. Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-STANDARD MICROCIRCUIT DRAWING SIZE A 5962-96878 DEFENSE SUPPLY CENTER COLUMBUS COLUMBUS, OHIO 43218-3
13、990 REVISION LEVEL C SHEET 3 DSCC FORM 2234 APR 97 1.3 Absolute maximum ratings. 1/ Supply voltage range (VCC) -0.5 V dc to +7.0 V dc Input voltage range (VIN) -0.5 V dc to +7.0 V dc Input current range (IIN) -30 mA to 5.0 mA Standard output . -0.5 V to VCCThree-state output . -0.5 V to 5.5 V Storag
14、e temperature range . -65C to +150C Lead temperature (soldering, 10 seconds) . +300C Junction temperature (TJ) +175C Maximum power dissipation (PD) 2/ 500 mW 2/ Thermal resistance, junction-to-case (JC) See MIL-STD-1835 1.4 Recommended operating conditions. Supply voltage range (VCC) 4.5 V dc to 5.5
15、 V dc High level input voltage (VIH) 2.0 V Low level input voltage (VIL) . -0.8 V Case operating temperature range (TC) -55C to +125C 2. APPLICABLE DOCUMENTS 2.1 Government specification, standards, and handbooks. The following specification, standards, and handbooks form a part of this drawing to t
16、he extent specified herein. Unless otherwise specified, the issues of these documents are those cited in the solicitation or contract. DEPARTMENT OF DEFENSE SPECIFICATION MIL-PRF-38535 - Integrated Circuits, Manufacturing, General Specification for. DEPARTMENT OF DEFENSE STANDARDS MIL-STD-883 - Test
17、 Method Standard Microcircuits. MIL-STD-1835 - Interface Standard Electronic Component Case Outlines. DEPARTMENT OF DEFENSE HANDBOOKS MIL-HDBK-103 - List of Standard Microcircuit Drawings. MIL-HDBK-780 - Standard Microcircuit Drawings. (Copies of these documents are available online at http:/assist.
18、daps.dla.mil/quicksearch/ or from the Standardization Document Order Desk, 700 Robbins Avenue, Building 4D, Philadelphia, PA 19111-5094.) 2.2 Order of precedence. In the event of a conflict between the text of this drawing and the references cited herein, the text of this drawing takes precedence. N
19、othing in this document, however, supersedes applicable laws and regulations unless a specific exemption has been obtained. _ 1/ Stresses above the absolute maximum rating may cause permanent damage to the device. Extended operation at the maximum levels may degrade performance and affect reliabilit
20、y. 2/ Maximum power dissipation is defined as VCCx ICCand must withstand the added PDdue to the short circuit output test (e.g., IOS). Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-STANDARD MICROCIRCUIT DRAWING SIZE A 5962-96878 DEFENSE SUPPLY CENT
21、ER COLUMBUS COLUMBUS, OHIO 43218-3990 REVISION LEVEL C SHEET 4 DSCC FORM 2234 APR 97 3. REQUIREMENTS 3.1 Item requirements. The individual item requirements for device classes Q and V shall be in accordance with MIL-PRF-38535 and as specified herein or as modified in the device manufacturers Quality
22、 Management (QM) plan. The modification in the QM plan shall not affect the form, fit, or function as described herein. The individual item requirements for device class M shall be in accordance with MIL-PRF-38535, appendix A for non-JAN class level B devices and as specified herein. 3.2 Design, con
23、struction, and physical dimensions. The design, construction, and physical dimensions shall be as specified in MIL-PRF-38535 and herein for device classes Q and V or MIL-PRF-38535, appendix A and herein for device class M. 3.2.1 Case outlines. The case outlines shall be in accordance with 1.2.4 here
24、in. 3.2.2 Terminal connections. The terminal connections shall be as specified on figure 1. 3.2.3 Truth tables. The truth tables shall be as specified on figure 2. 3.2.4 Logic diagrams. The logic diagrams shall be as specified on figure 3. 3.2.5 Test circuit and switching waveforms. The test circuit
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