DLA SMD-5962-95837-1995 MICROCIRCUIT DIGITAL 32-BIT RISC MICROPROCESSOR 3 3 V JTAG MONOLITHIC SILICON《3 3伏特 32-BIT精简指令集计算机微处理器硅单片电路线型微电路》.pdf
《DLA SMD-5962-95837-1995 MICROCIRCUIT DIGITAL 32-BIT RISC MICROPROCESSOR 3 3 V JTAG MONOLITHIC SILICON《3 3伏特 32-BIT精简指令集计算机微处理器硅单片电路线型微电路》.pdf》由会员分享,可在线阅读,更多相关《DLA SMD-5962-95837-1995 MICROCIRCUIT DIGITAL 32-BIT RISC MICROPROCESSOR 3 3 V JTAG MONOLITHIC SILICON《3 3伏特 32-BIT精简指令集计算机微处理器硅单片电路线型微电路》.pdf(27页珍藏版)》请在麦多课文档分享上搜索。
1、SMD-5962-95837 999999b 008L988 5LT LTR DESCRIPTION DATE W.MO-DA) APPROVED REV SHEET REV SHEET I 15 I 16 I 17 REV STATUS OF SHEETS PMIC NIA STANDARD MICROCIRCUIT DRAWING THIS DRAWING IS AVAILABLE FOR USE BY ALL DEPARTMENTS AND AGENCIES OF THE DEPARTMENT OF DEFENSE AMSC NIA REV 111 SHEET PREPARED BY T
2、homas M. Hess CHECKED BY Thomas M. Hess APPROVED BY Monica L. Poelking DRAWING APPROVAL DATE 95-11-22 REVISION LEVEL DEFENSE ELECTRONICS SUPPLY CENTER DAYTON, OHIO 45444 MICROCIRCUIT, DIGITAL, 32-BIT RISC MICROPROCESSOR, 3.3 V, JTAG, MONOLITHIC SILICON SIZE I CAiYiOE8 I 5962995837 A SHEET I OF 26 ES
3、C FORM 193 JUL 94 DISTRIBUTION STATEMENT A. Approved for public release; distribution is unlimited. 5962-El 91 -96 Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-SMD-59b2-95837 = 999999b 008l1989 456 = STANDARD MICROCIRCUIT DRAWING DEFENSE ELECTRONI
4、CS SUPPLY CENTER DAYTON, OHIO 45444 1. SCOPE 1.1 a. This drawing forms a part of a one part - one part number documentation system (see 6.6 herein). Three product assurance classes consisting of space application (device class V), military high reliability (device classes M and 9). and non-tradition
5、al military (device class N) with a choice of case outlines and lead finishes are available and are reflected in the Part or Identifying Number (PIN). Device class M microcircuits represent non-JAN class E microcircuits in accordance with 1.2.1 of MIL-STD-883, “Provisions for the use of MIL-STD-883
6、in conjunction with comp1iant non-JAN devices“. the application environment. When available, a choice of Radiation Hardness Assurance (RHA) levels are reflected in the PIN. For device class N, the user is cautioned to assure that the device is appropriate for 1.2 m. The PIN shall be as shown i.n,the
7、 following example: 95837 Federa 1 RHA $“ILL Devi ce Devi ce Case Lead 11 stock class designator trie class outline finish designator (see 1.2.1) / Drawing nunber (see 1.2.2) des i gnator (see 1.2.4) (see 1.2.5) / (see 1.2.3) 1.2.1 RHA desianator. Device classes N, Q, and V RHA marked devices shall
8、meet the MIL-1-38535 specified RHA 1.2.2 Device tme(s.1. The device type(s) shall identify the circuit function as follows: levels and shall be marked with the appropriate RHA designator. A dash (-) indicates a non-RHA device. Device tme Generic number Circuit function Temerature ranae o1 80486DX4 3
9、2-bit microprocessor -55.C to 125C 75 MHz 02 80486DX4 32-bit microprocessor -5PC to 1250C 100 MHz 03 80486DX4 32-bit microprocessor -40eC to 125C 75 MHz 04 80486DX4 32-bit microprocessor -4OC to 125C 100 MHz 05 80486DX4 32-bi t microprocessor -4PC to llPC 75 MHz 06 80486DX4 32-bit microprocessor -40
10、-C to llOC 100 MHz SIZE A 5962-95837 REVISION LEVEL SHEET 2 1.2.3 Device class desianator. The device class designator shall be a single letter identifying the product assurance level as follows: Device class Device reau irements documentat ion M N Vendor self-certif ication to the requirements for
11、non-JAN class B microcircuits in accordance with 1.2.1 of MIL-STD-883 l/ Certification and qualification to MIL-1-38535 with a non-traditional performance environment 2/ Q or V Certification and qualification to MIL-1-38535 1.2.4 Case outlines). The case outline(s) shall be as designated in MIL-STD-
12、1835 and as follows: Out1 ine letter Descri Dt ive des ianator Termi na 1 s Packaae stvle X Y CMGA9-Pl68 See Figure 1 168 Ceramic, pin grid array 196 Leaded chip carrier with unformed 1 eads 1.2.5 Lead finish. The lead finish shall be as specified in MIL-1-38535 for device classes N, Q, and V. Finis
13、h letter “X“ shall not be marked on the microcircuit or its packaging. The “X“ designation is for use in specifications when lead finishes A, B, and C are considered acceptable and interchangeable without preference. L/ For this drawing device class M shall not apply. - 2/ Any device outside the tra
14、ditional performance environment (i.e., an operating temperature range of -55C to t125C and which requires hermetic packaging). 8 DESC FORM 193A JUL 94 Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-SHD-59b2-95837 W 999999b OOB1990 178 W SIZE A STAN
15、DARD MICROCIRCUIT DRAWING DEFENSE ELECTRONICS SUPPLY CENTER DAYTON, OHIO 45444 REVISION LEVEL 1.3 Absolute maximm ratinqs .u Storage temperature range . Supply voltage with respect to ground range . Voltage on any pin with respect to ground range Maximm power dissipation (PD) Lead temperature (solde
16、ring, 10 seconds) Thermal resistance, junction-to-case (BJC): . Case X . Case Y . Maxim junction temperature (TJ) . 1.4 in. 5962-95837 SHEET 3 . -65% to +150C . Vc . 0.5 V to +4.6 V . -0.5 V to Vcc + 0.5 V . 5u . 3DOC . See MIL-STD-1835 . 2.5C/U . 150C Case operating temperature range See 1.2.2 Supp
17、ly voltage, (VCC) 3.3 V i5% 1.5 Diaital loaic test ina for device classes Q and V. Fault coverage measurement of manufacturing logic tests (MIL-STD-883, test method 5012) 98.5 percent 2. APPLICABLE DOCUMENTS 2.1 Govermient stxc ification. standards. bullet in. and handbook. Unless otherwise specifie
18、d, the following specification, standards, bulletin, and handbaok of the issue listed in that issue of the Department of Defense Index of Specifications and Standards specified in the solicitation, form a part of this drawing to the extent specified herein. SPECIFICATION MI LI TARY MIL-1-38535 - Int
19、egrated Circuits, Manufacturing, General Specification for. STANDARDS MI LI TARY MIL-STD-883 - Test Methods and Procedures for Microelectronics. MIL-STD-973 - Configuration Management MIL-STD-1835 - Microcircuit Case Outlines. BULLETIN MILITARY MIL-BUL-103 - List of Standardized Military Drawings (S
20、MDIS). HANDBOOK MIL I TARY MIL-HDBK-780 - Standardized Military Drawings. (Copies of the specification, standards, bulletin, and handbook required by manufacturers in connection with specific acquisition functions should be obtained from the contracting activity or as directed by the contracting act
21、ivity.) 1/ Stresses above the absolute maximm rating may cause permanent damage to the device. Extended operation at the maxim levels may degrade performance and affect reliability. - DESC FORM 193A JUL 94 Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-
22、,-,- 2.2 Qee figure 4 9.10.11 01.03.05 02.04 ,O6 14 11 ns System clock fall time S/ t4 2.0 V to 0.8 V iee figure 4 9,10,11 01,03 ,O5 02,04 ,O6 4 3 ns System clock rise time B/ t5 0.8 V to 2.0 V ;ee figure 4 9,10,11 01,03 ,O5 02 ,O4 ,O6 4 3 ns mA31 ,PWT, PCD, BEO-3#,M/IO# I D/C#, WIR# ,ADS#,LOCK#, FE
23、RR#,BREQ,HLDA VALID DELAY, CACHE#, HITM# t6 iee figure 4 9,10,11 01,03,05 02.04.06 19 14 ns 2 2 jee figure 4 81 9.10.11 O1 .O3 ,O5 02,04 ,O6 28 20 t7 ns A2-A31 ,PWT , PCD, BEO-3# ,M/IO#, D/C#,W/R#,ADS#.LOCK# FLOAT DELAY ,CACHE# See footnotes at end of tablc t I 5962-95837 STANDARD MICROCIRCUIT DRAWI
24、NG DEFENSE ELECTRONICS SUPPLY CENTER DAYTON, OHIO 45444 I SHEET REVISION LEVEL DESC FORM 193A JUL 94 Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-SUD-5962-95837 9999996 0081994 813 Group A subgroups Device type 9,10,11 01,03,05 02,04,06 9,10,11 01
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