DLA SMD-5962-95808 REV A-1998 MICROCIRCUIT DIGITAL RADIATION HARDENED HIGH SPEED CMOS SYNCHRONOUS BCD DECADE UP DOWN COUNTER MONOLITHIC SILICON《高速抗辐射互补金属氧化物半导体 同步二进制编码的十进制上下计数器 硅单片.pdf

《DLA SMD-5962-95808 REV A-1998 MICROCIRCUIT DIGITAL RADIATION HARDENED HIGH SPEED CMOS SYNCHRONOUS BCD DECADE UP DOWN COUNTER MONOLITHIC SILICON《高速抗辐射互补金属氧化物半导体 同步二进制编码的十进制上下计数器 硅单片.pdf》由会员分享，可在线阅读，更多相关《DLA SMD-5962-95808 REV A-1998 MICROCIRCUIT DIGITAL RADIATION HARDENED HIGH SPEED CMOS SYNCHRONOUS BCD DECADE UP DOWN COUNTER MONOLITHIC SILICON《高速抗辐射互补金属氧化物半导体 同步二进制编码的十进制上下计数器 硅单片.pdf（29页珍藏版）》请在麦多课文档分享上搜索。

1、m 9999996 0123466 b8 U fxone) NOTICE OF REVISION (NOR) X (1) Existing document supplemented by the NOR may be used in manufacture. (2) Revised document must be received before manufacturer may incorporate this change. (3) Custodian of master document shall make above revision and furnish revised doc

2、ument. THIS REVISION DESCRIBED BELOW HAS BEEN AUTHORIZED FOR THE DOCUMENT LISTED. 1. ACTIVITY AUTHORIZED TO APPROVE CHANGE FOR GOVERNMENT DSCC-VAC 1. DATE (YYMMDD) 98-07-31 c. TYPED NAME (First, Midd/e /nitiaA Last) MONICA L. POELKING 4. ORIGINATOR i. TITLE CHIEF, CUSTOM MICROELECTRONICS TEAM a. TYP

3、ED NAME (First, Middie Initia4 Last) e. SIGNATURE f. DATE SIGNED (WMMDD) MONICA L. POELKING 98-07-31 b. ADDRESS (Street, Ci add “A. Revisions description column; add “Changes in accordance with NOR 5962-R149-98. Revisions date column; add “98-07-31“. Revision level block; add “A“. Rev status of shee

4、ts; for sheets 1,4, and 20 through 26, add “A“. this document.“ Revision level block; add “A. Sheets 20 through 26: Add attached appendix A. Sheet 4: Add new paragraph which states; “3.1.1 Microcircuit die. For the requirements for microcircuit die, see appendix A to CONTINUED ON NEXT SHEETS 14. THI

5、S SECTION FOR GOVERNMENT USE ONLY c. DATE SIGNED (YYMMDD) 98-07-31 Licensed by Information Handling ServicesAPPENDIX A APPENDIX A FORMS A PART OF SMD 5962-95808 STANDARD MICROCIRCUIT DRAWING DEFENSE SUPPLY CENTER COLUMBUS COLUMBUS, OHIO 4321 6-5000 Document No: 5962-95808 Revision: A Sheet: 2 of 8 N

6、OR NO: 5962-R149-98 SIZE 5962-95808 A SHEET REVISION LEVEL A 20 10.1 Scope. This appendix establishes minimum requirements for microcircuit die to be supplied under the Qualified Manufacturers List (QML) Program. QML microcircuit die meeting the requirements of MIL-PRF-38535 and the manufacturers ap

7、proved QM plan for use in monolithic microcircuits, rnultichip modules (MCMs), hybrids, electronic modules, or devices using chip and wire designs in accordance with MIL-PRF-38534 are specified herein. Two product assurance classes consisting of military high reliability (device class Q) and space a

8、pplication (device Class V) are reflected in the Part or Identification Number (PIN). When available a choice of Radiation Hardiness Assurance (RHA) levels are reflected in the PIN. 10.2 m. The PIN shall be as shown in the following example: 59,62 95808 i f k Federal RHA Device Device Die Die Stock

9、class designator type class code Details designator (see 10.2.1) (see 10.2.2) designator (see 10.2.4) (see 10.2.3) 3 Drawing Number 10.2.1 RHA desianator. Device classes Q and V RHA identified die shall meet the MIL-PRF-38535 specified RHA levels. A dash (-) indicates a non-RHA die. 10.2.2 Device tv

10、Dek.1. The device type(c) shall identify the circuit function as follows: Device tvpe Generic number Circuit function o1 HCS190 Radiation Hardened, SOS, high speed CMOS, synchronous BCD decade upidown counter. Licensed by Information Handling Services999999b OL234bB 451 m APPENDIX A APPENDIX A FORMS

11、 A PART OF SMD 5962-95808 Document No: 5962-95808 Revision: A Sheet: 3 of 8 NOR NO: 59624149-98 10.2. Die Details. The die details designation shall be a unique letter which designates the die?s physical dimensions, bonding pad location(s) and related electrical function(s), interface materials, and

12、 other assembly related information, for each product and variant supplied to this appendix. 10.2.4.1 Die Phvsical dimensions. Die TvDes Fiaure number o1 A- 1 10.2.4.2 Die Bondina Dad locations and Electrical functions. Die TvDes o1 10.2.4.3 Interface Materials. Die TvDes o1 10.2.4.4 Assemblv relate

13、d information. o1 Fiaure number A-1 Fiaure number A- 1 A- 1 10.3 Absolute maximum ratinas. See paragraph 1.3 within the body of this drawing for details. 10.4 Recommended operatina conditions. See paragraph 1.4 within the body of this drawing for details. 20. APPLICABLE DOCUMENTS 20.1 Government sDe

14、cifications. standards. bulletin, and handbooks. Unless otherwise specified, the following specifications, standards, bulletin, and handbook of the issue listed in that issue of the Department of Defense Index of Specifications and Standards specified in the solicitation, form a part of this drawing

15、 to the extent specified herein. STANDARD MICROCIRCUIT DRAWING DEFENSE SUPPLY CENTER COLUMBUS COLUMBUS, OHIO 43216-5000 I 5962-95808 1 REVISION LEVEL SHEET A I 21 I I l SCC FORM 2234 APR 97 Licensed by Information Handling Services9999996 0323469 398 STANDARD MICROCIRCUIT DRAWING COLUMBUS, OHIO 4321

16、6-5000 DEFENSE SUPPLY CENTER COLUMBUS APPENDIX A APPENDIX A FORMS A PART OF SMD 5962-95808 SIZE 5962-95808 A REVISION LEVEL SHEET A 22 Document No: 5962-95808 Revision: A Sheet: 4 of 8 NOR NO: 5962-R149-98 SPECIFICATION DEPARTMENT OF DEFENSE MIL-PRF-38535 - Integrated Circuits, Manufacturing, Genera

17、l Specification for. STANDARDS DEPARTMENT OF DEFENSE MIL-STD-883 - Test Methods and Procedures for Microelectronics. HANDBOOK DEPARTMENT OF DEFENSE MIL-HDBK-103 - List of Standardized Military Drawings (SMDs). (Copies of the specification, standards, bulletin, and handbook required by manufacturers

18、in connection with specific acquisition functions should be obtained from the contracting activity or as directed by the contracting activity). text of this drawing shall take precedence. 20.2 Order of precedence. In the event of a conflict between the text of this drawing and the references cited h

19、erein, the 30. REQUIREMENTS 30.1 Item Reauirements. The individual item requirements for device classes Q and V shall be in accordance with MIL-PRF-38535 and as specified herein or as modified in the device manufacturers Quality Management (QM) plan. The modification in the QM plan shall not effect

20、the form, fit or function as described herein. 30.2 Desian. construction and phvsical dimensions. The design, construction and physical dimensions shall be as 30.2.1 Die Phvsical dimensions. The die physical dimensions shall be as specified in 10.2.4.1 and on figure A-1. 30.2.2 Die bondina pad locat

21、ions and electrical functions. The die bonding pad locations and electrical functions shall be 30.2.3 Interface materials. The interface materials for the die shall be as specified in 10.2.4.3 and on figure A-1 . 30.2.4 Assemblv related information. The assembly related information shall be as speci

22、fied in 10.2.4.4 and figure A-1 . 30.2.5 Truth table. The truth table shall be as defined within paragraph 3.2.3 of the body of this document. 30.2.6 Radiation exposure circuit. The radiation exposure circuit shall be as defined within paragraph 3.2.6 of the body of specified in MIL-PRF-38535 and th

23、e manufacturers QM plan, for device classes Q and V and herein. as specified in 10.2.4.2 and on figure A-1. this document. ISCC FORM 2234 4PR 97 Licensed by Information Handling Servicesb 0323470 OOT 9 STANDARD MICROCIRCUIT DRAWING COLUMBUS, OHIO 4321 6-5000 DEFENSE SUPPLY CENTER COLUMBUS APPENDIX A

24、 APPENDIX A FORMS A PART OF SMD 5962-95808 SIZE 5962-95808 A REVISION LEVEL SHEET A 23 Document No: 5962-95808 Revision: A Sheet: 5 of 8 NOR NO: 596243149-98 30.3 Electrical performance characteristics and post-irradiation parameter limits. Unless otherwise specified herein, the electrical performan

25、ce characteristics and post-irradiation parameter limits are as specified in table I of the body of this document. 30.4 Electrical test reuuirements. The wafer probe test requirements shall include functional and parametric testing sufficient to make the packaged die capable of meeting the electrica

26、l performance requirements in table I. 30.5 Markinq. As a minimum, each unique lot of die, loaded in single or multiple stack of carriers, for shipment to a customer, shall be identified with the wafer lot number, the certification mark, the manufacturers identification and the PIN listed in 10.2 he

27、rein. The certification mark shall be a “QML“ or “Q“ as required by MIL-PRF-38535. 30.6 Certification of comeliance. For device classes Q and V, a certificate of compliance shall be required from a QML-38535 listed manufacturer in order to supply to the requirements of this drawing (see 60.4 herein)

28、. The certificate of compliance submitted to DSCC-VA prior to listing as an approved source of supply for this appendix shall affirm that the manufacturers product meets, for device classes Q and V, the requirements of MIL-PRF-38535 and the requirements herein. 30.7 Certificate of conformance. A cer

29、tificate of conformance as required for device classes Q and V in MIL-PRF-38535 shall be provided with each lot of microcircuit die delivered to this drawing. 40. QUALITY ASSURANCE PROVISIONS 40.1 Samdinci and inspection. For device classes Q and V, die sampling and inspection procedures shall be in

30、 accordance with MIL-PRF-38535 or as modified in the device manufacturers Quality Management (QM) plan. The modifications in the QM plan shall not effect the form, fit or function as described herein. manufacturers QM plan. As a minimum it shall consist of: 40.2 Screeninq. For device classes Q and V

31、, screening shall be in accordance with MIL-PRF-38535, and as defined in the a) Wafer Lot acceptance for Class V product using the criteria defined within MIL-STD-883 TM 5007. b) 100% wafer probe (see paragraph 30.4). c) 100% internal visual inspection to the applicable class Q or V criteria defined

32、 within MIL-STD-883 TM2010 or the alternate procedures allowed within MIL-STD-883 TM5004. ISCC FORM 2234 iPR 97 Licensed by Information Handling ServicesW 9999996 0123473 T4b M APPENDIX A APPENDIX A FORMS A PART OF SMD 5962-95808 Document No: 5962-95808 Revision: A Sheet: 6 of 8 NOR NO: 5962-R149-98

33、 50.1 Die carrier reauirements. The requirements for the die carrier shall be accordance with the manufacturers QM plan or as specified in the purchase order by the acquiring activity. The die carrier shall provide adequate physical, mechanical and electrostatic protection. 60. NOTES 60.1 Intended u

34、se. Microcircuit die conforming to this drawing are intended for use in microcircuits built in accordance with MIL-PRF-38535 or MIL-PRF-38534 for government microcircuit applications (original equipment), design applications and logistics purposes. STANDARD MICROCIRCUIT DRAWING DEFENSE SUPPLY CENTER

35、 COLUMBUS COLUMBUS, OHIO 43216-5000 60.2 Comments. Comments on this appendix should be directed to DSCC-VA, Columbus, Ohio, 4321 6-5000 or telephone 60.3 Abbreviations. svmbols and definitions. The abbreviations, symbols, and definitions used herein are defined with (61 4)-692-0674, MIL-PRF-38535 an

36、d MIL-HDBK-1331. SIZE 5962-9580a A REVISION LEVEL SHEET A 24 Licensed by Information Handling ServicesD b 0323472 982 W APPENDIX A APPENDIX A FORMS A PART OF SMD 5962-95808 FIGURE A-1 o DIE PHYSICAL DIMENSIONS Document No: 5962-95808 Revision: A Sheet: 7 of 8 NOR NO: 5962-R149-98 I Die Size: Die Thi

37、ckness: 21 90 x 2650 microns. 21 +/-2 mils. o DIE BONDING PAD LOCATIONS AND ELECTRICAL FUNCTIONS The following metallization diagram supplies the locations and electrical functions of the bonding pads. The internal metallization layout and alphanumeric information contained within this diagram may o

38、r may not represent the actual circuit defined by this SMD. NOTE: Pad numbers (14) CP (12)TC (ltK igure 1). STANDARD MICROCIRCUIT DRAWING DEFENSE SUPPLY CENTER COLUMBUS COLUMBUS, OHIO 43216-5000 I 5962-95808 I SHEET 25 1 REVISION LEVEL A DSCC FORM 2234 APR 97 Licensed by Information Handling Service

39、sb 0123473 819 APPENDIX A APPENDIX A FORMS A PART OF SMD 5962-95808 Document No: 5962-95808 Revision: A Sheet: 8 of a NOR NO: 596243149-98 STANDARD MICROCIRCUIT DRAWING DEFENSE SUPPLY CENTER COLUMBUS COLUMBUS, OHIO 4321 6-5000 SIZE 5962-95808 A REVISION LEVEL SHEET A 26 Licensed by Information Handl

40、ing Services999999b 0123474 755 W STANDARD MICROCIRCUIT DRAWING BULLETIN DATE: 98-07-31 Approved sources of supply for SMD 5962-95808 are listed below for immediate acquisition information only and shall be added to MIL-HDBK-103 and QML-38535 during the next revision. MIL-HDBK-103 and QML-38535 will

41、 be revised to include the addition or deletion of sources. The vendors listed below have agreed to this drawing and a certificate of compliance has been submitted to and accepted by DSCC-VA. This bulletin is superseded by the next dated revision of MIL-HDBK-103 and QML-38535. Standard Vendor Vendor

42、 similar number PIN Il HCS1 9OHMSR - 11 Caution. Do not use this number for item acquisition. Items acquired to this number may not satisfy the performance requirements of this drawing. Vendor CAGE number 34371 Vendor name and address Harris Semiconductor P.O. Box 883 Melbourne, FL 32902-0883 The in

43、formation contained herein is disseminated for convenience only and the Government assumes no liability whatsoever for any inaccuracies in the information bulletin. Licensed by Information Handling ServicesSMD-5962-95808 9999796 00825b9 921 DESCRIPTION LTR REVISIONS DATE (YR-MO-DA) APPROVED SHEET 15

44、 16 REV I 17 SHEET * SIZE A 5962-95808 CAGE CODE 67268 REV STATUS OF SHEETS PMIC NIA STANDARD MICROCIRCUIT DRAWING THIS DRAWING IS AVAILABLE FOR USE BY ALL DEPARTMENTS AND AGENCIES OF THE DEPARTMENT OF DEFENSE AMSC NIA PREPARED BY Rick C. Officer CHECKED BY Thanh V. Nguyen APPROVED BY Monica L. Poel

45、king DRAWING APPROVAL DATE 95-1 1-29 REVISION LEVEL DEFENSEELECTRONICSSUPPLYCENTER DAYTON, OHIO 45444 MICROCIRCUIT, DIGITAL, RADIATION HARDENED, HIGH SPEED CMOS, SYNCHRONOUS BCD DECADE UPIDOWN COUNTER, MONOLITHIC SILICON SHEET I OF 19 DESC FORM 193 JUL 94 DISTRIBUTION STATEMENT A. Approved for publi

46、c release: distribution is unlimited. 5962-E076-96 Licensed by Information Handling Services SMD-5962-95808 m 9999996 0082570 643 m MICROCIRCUIT DRAWING DEFENSE ELECTRONICS SUPPLY CENTER DAYTON, OHIO 45444 REVISION LEVEL 1. SCOPE 1.1 SEpBe. This drawing forms a part of a one part - one part number d

47、ocwntation system (see 6.6 herein). Two product assurance classes consisting of military high reliability (device classes P and M) and space application (device class V), and a choice of case outlines and lead finishes are available and are reflected in the Part or Identifying Nrniber (PIN). 1.2.1 o

48、f MIL-STD-883, lProvisions for the use of MIL-STD-883 in conjunction with compliant non-JAN devices“. available, a choice of Radiation Hardness Assurance (RHA) levels are reflected in the PIN. Device class M microcircuits represent non-JAN class B microcircuits in accordance with Uhen 1.2 m. The PIN

49、 shall be as shown in the following example: 95808 Federal RHA Ilfr Device Devi ce Case Lead i stock class designator t YPe class outline finish designator (see 1.2.1) (see 1.2.2) designator (see 1.2.4) (see 1.2.5) LA (see 1.2.3) w Drawing number 1.2.1 RHA desisnator. Device class M RHA marked devices shall meet the MIL-1-38535 appendix A specified RHA levels and shall be marked with the appropriate RHA designator. MIL-1-38535 specified RHA levels and shall be marked with the appropriate RHA designator. non-RHA device. Device classes P and V RHA marked de