DLA SMD-5962-93211 REV B-2007 MICROCIRCUIT LINEAR DUAL DIFFERENTIAL LINE RECEIVER MONOLITHIC SILICON《硅单片 双重差动线路驱动器 线性微型电路》.pdf

《DLA SMD-5962-93211 REV B-2007 MICROCIRCUIT LINEAR DUAL DIFFERENTIAL LINE RECEIVER MONOLITHIC SILICON《硅单片 双重差动线路驱动器 线性微型电路》.pdf》由会员分享，可在线阅读，更多相关《DLA SMD-5962-93211 REV B-2007 MICROCIRCUIT LINEAR DUAL DIFFERENTIAL LINE RECEIVER MONOLITHIC SILICON《硅单片 双重差动线路驱动器 线性微型电路》.pdf（12页珍藏版）》请在麦多课文档分享上搜索。

1、 REVISIONS LTR DESCRIPTION DATE (YR-MO-DA) APPROVED A Drawing updated to reflect current requirements. rrp 02-07-03 Raymond Monnin B Title block corrected. Update drawing to current requirements. Editorial changes throughout. - drw 07-04-11 Robert M. Heber REV SHET REV SHET REV STATUS REV B B B B B

2、B B B B B B OF SHEETS SHEET 1 2 3 4 5 6 7 8 9 10 11 PMIC N/A PREPARED BY Rick C. Officer DEFENSE SUPPLY CENTER COLUMBUS STANDARD MICROCIRCUIT DRAWING CHECKED BY Charles E. Besore COLUMBUS, OHIO 43218-3990 http:/www.dscc.dla.mil THIS DRAWING IS AVAILABLE FOR USE BY ALL DEPARTMENTS APPROVED BY Michael

3、 A. Frye MICROCIRCUIT, LINEAR, DUAL, DIFFERENTIAL AND AGENCIES OF THE DEPARTMENT OF DEFENSE DRAWING APPROVAL DATE 93-07-14 LINE RECEIVER, MONOLITHIC SILICON AMSC N/A REVISION LEVEL B SIZE A CAGE CODE 67268 5962-93211 SHEET 1 OF 11 DSCC FORM 2233 APR 97 5962-E348-07 Provided by IHSNot for ResaleNo re

4、production or networking permitted without license from IHS-,-,-STANDARD MICROCIRCUIT DRAWING SIZE A 5962-93211 DEFENSE SUPPLY CENTER COLUMBUS COLUMBUS, OHIO 43218-3990 REVISION LEVEL B SHEET 2 DSCC FORM 2234 APR 97 1. SCOPE 1.1 Scope. This drawing documents two product assurance class levels consis

5、ting of high reliability (device classes Q and M) and space application (device class V). A choice of case outlines and lead finishes are available and are reflected in the Part or Identifying Number (PIN). When available, a choice of Radiation Hardness Assurance (RHA) levels are reflected in the PI

6、N. 1.2 PIN. The PIN is as shown in the following example: 5962 - 93211 01 M C A Federal stock class designator RHA designator (see 1.2.1) Device type (see 1.2.2)Device class designatorCase outline (see 1.2.4) Lead finish (see 1.2.5) / (see 1.2.3) / Drawing number 1.2.1 RHA designator. Device classes

7、 Q and V RHA marked devices meet the MIL-PRF-38535 specified RHA levels and are marked with the appropriate RHA designator. Device class M RHA marked devices meet the MIL-PRF-38535, appendix A specified RHA levels and are marked with the appropriate RHA designator. A dash (-) indicates a non-RHA dev

8、ice. 1.2.2 Device type. The device type identifies the circuit function as follows: Device type Generic number Circuit function 01 78C20 Dual differential line receiver 1.2.3 Device class designator. The device class designator is a single letter identifying the product assurance level as follows: D

9、evice class Device requirements documentation M Vendor self-certification to the requirements for MIL-STD-883 compliant, non-JAN class level B microcircuits in accordance with MIL-PRF-38535, appendix A Q or V Certification and qualification to MIL-PRF-38535 1.2.4 Case outline. The case outline is as

10、 designated in MIL-STD-1835 as follows: Outline letter Descriptive designator Terminals Package style C GDIP1-T14 or CDIP2-T14 14 Dual-in-line 1.2.5 Lead finish. The lead finish is as specified in MIL-PRF-38535 for device classes Q and V or MIL-PRF-38535, appendix A for device class M. Provided by I

11、HSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-STANDARD MICROCIRCUIT DRAWING SIZE A 5962-93211 DEFENSE SUPPLY CENTER COLUMBUS COLUMBUS, OHIO 43218-3990 REVISION LEVEL B SHEET 3 DSCC FORM 2234 APR 97 1.3 Absolute maximum ratings. 1/ Supply voltage (VCC). 18 V Com

12、mon-mode voltage (VCM). 25 V Differential input voltage (VDIN) . 25 V Output sink current . 50 mA Power dissipation (PD) 1364 mW 2/ Lead temperature (soldering, 10 seconds) . +260C Junction temperature (TJ) . +150C Storage temperature range. -65C to +150C Thermal resistance, junction-to-case (JC) Se

13、e MIL-STD-1835 Thermal resistance, junction-to-ambient (JA). 95C/W 1.4 Recommended operating conditions. Supply voltage range (VCC). +4.5 V to +15 V Ambient operating temperature range (TA). -55C to +125C 2. APPLICABLE DOCUMENTS 2.1 Government specification, standards, and handbooks. The following s

14、pecification, standards, and handbooks form a part of this drawing to the extent specified herein. Unless otherwise specified, the issues of these documents are those cited in the solicitation or contract. DEPARTMENT OF DEFENSE SPECIFICATION MIL-PRF-38535 - Integrated Circuits, Manufacturing, Genera

15、l Specification for. DEPARTMENT OF DEFENSE STANDARDS MIL-STD-883 - Test Method Standard Microcircuits. MIL-STD-1835 - Interface Standard Electronic Component Case Outlines. DEPARTMENT OF DEFENSE HANDBOOKS MIL-HDBK-103 - List of Standard Microcircuit Drawings. MIL-HDBK-780 - Standard Microcircuit Dra

16、wings. (Copies of these documents are available online at http:/assist.daps.dla.mil/quicksearch/ or http:/assist.daps.dla.mil or from the Standardization Document Order Desk, 700 Robbins Avenue, Building 4D, Philadelphia, PA 19111-5094.) 2.2 Order of precedence. In the event of a conflict between th

17、e text of this drawing and the references cited herein, the text of this drawing takes precedence. Nothing in this document, however, supersedes applicable laws and regulations unless a specific exemption has been obtained. _ 1/ Stresses above the absolute maximum rating may cause permanent damage t

18、o the device. Extended operation at the maximum levels may degrade performance and affect reliability. 2/ Derate package at 8.7 mW/C. Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-STANDARD MICROCIRCUIT DRAWING SIZE A 5962-93211 DEFENSE SUPPLY CENTE

19、R COLUMBUS COLUMBUS, OHIO 43218-3990 REVISION LEVEL B SHEET 4 DSCC FORM 2234 APR 97 3. REQUIREMENTS 3.1 Item requirements. The individual item requirements for device classes Q and V shall be in accordance with MIL-PRF-38535 and as specified herein or as modified in the device manufacturers Quality

20、Management (QM) plan. The modification in the QM plan shall not affect the form, fit, or function as described herein. The individual item requirements for device class M shall be in accordance with MIL-PRF-38535, appendix A for non-JAN class level B devices and as specified herein. 3.2 Design, cons

21、truction, and physical dimensions. The design, construction, and physical dimensions shall be as specified in MIL-PRF-38535 and herein for device classes Q and V or MIL-PRF-38535, appendix A and herein for device class M. 3.2.1 Case outline. The case outline shall be in accordance with 1.2.4 herein.

22、 3.2.2 Terminal connections. The terminal connections shall be as specified on figure 1. 3.3 Electrical performance characteristics and postirradiation parameter limits. Unless otherwise specified herein, the electrical performance characteristics and postirradiation parameter limits are as specifie

23、d in table I and shall apply over the full ambient operating temperature range. 3.4 Electrical test requirements. The electrical test requirements shall be the subgroups specified in table II. The electrical tests for each subgroup are defined in table I. 3.5 Marking. The part shall be marked with t

24、he PIN listed in 1.2 herein. In addition, the manufacturers PIN may also be marked. For packages where marking of the entire SMD PIN number is not feasible due to space limitations, the manufacturer has the option of not marking the “5962-“ on the device. For RHA product using this option, the RHA d

25、esignator shall still be marked. Marking for device classes Q and V shall be in accordance with MIL-PRF-38535. Marking for device class M shall be in accordance with MIL-PRF-38535, appendix A. 3.5.1 Certification/compliance mark. The certification mark for device classes Q and V shall be a “QML“ or

26、“Q“ as required in MIL-PRF-38535. The compliance mark for device class M shall be a “C“ as required in MIL-PRF-38535, appendix A. 3.6 Certificate of compliance. For device classes Q and V, a certificate of compliance shall be required from a QML-38535 listed manufacturer in order to supply to the re

27、quirements of this drawing (see 6.6.1 herein). For device class M, a certificate of compliance shall be required from a manufacturer in order to be listed as an approved source of supply in MIL-HDBK-103 (see 6.6.2 herein). The certificate of compliance submitted to DSCC-VA prior to listing as an app

28、roved source of supply for this drawing shall affirm that the manufacturers product meets, for device classes Q and V, the requirements of MIL-PRF-38535 and herein or for device class M, the requirements of MIL-PRF-38535, appendix A and herein. 3.7 Certificate of conformance. A certificate of confor

29、mance as required for device classes Q and V in MIL-PRF-38535 or for device class M in MIL-PRF-38535, appendix A shall be provided with each lot of microcircuits delivered to this drawing. 3.8 Notification of change for device class M. For device class M, notification to DSCC-VA of change of product

30、 (see 6.2 herein) involving devices acquired to this drawing is required for any change that affects this drawing. 3.9 Verification and review for device class M. For device class M, DSCC, DSCCs agent, and the acquiring activity retain the option to review the manufacturers facility and applicable r

31、equired documentation. Offshore documentation shall be made available onshore at the option of the reviewer. 3.10 Microcircuit group assignment for device class M. Device class M devices covered by this drawing shall be in microcircuit group number 77 (see MIL-PRF-38535, appendix A).Provided by IHSN

32、ot for ResaleNo reproduction or networking permitted without license from IHS-,-,-STANDARD MICROCIRCUIT DRAWING SIZE A 5962-93211 DEFENSE SUPPLY CENTER COLUMBUS COLUMBUS, OHIO 43218-3990 REVISION LEVEL B SHEET 5 DSCC FORM 2234 APR 97 TABLE I. Electrical performance characteristics. Test Symbol Condi

33、tions 1/ -55C TA +125C unless otherwise specified Group A subgroups Device type Limits 2/ Unit Min MaxLogical “1” strobe input voltage VIHVCC= 5 V, VOL 0.5 V, 3/ IOUT= 1.6 mA 1, 2, 3 01 3.5 V VCC= 10 V, VOL 0.5 V, 3/ IOUT= 1.6 mA 8 VCC= 15 V, VOL 0.5 V, 3/ IOUT= 1.6 mA 12.5 Logical “0” strobe input

34、voltage VILIOUT= -200 A, 3/ VOH= VCC= -1.2 V and 5 V 1, 2, 3 01 1.5 V VCC= 10 V, 3/ IOUT= -200 A 2 VCC= 15 V, 3/ IOUT= -200 A 2.5 Output short-circuit current IOSVCC= 15 V, VOUT= 0 V, VSTROBE= 0 V 1, 2, 3 01 -5 -40 mA Differential threshold voltage VTHVOUT VCC= 1.2 V, IOUT= -200 A, VCM= -10 V and +1

35、0 V 1, 2, 3 01 0.2 V VOUT VCC= 1.2 V, IOUT= -200 A, VCM= -15 V and +15 V 0.3 VOUT 0.5 V, IOUT= 1.6 mA, VCM= -10 V and +10 V -0.2 VOUT 0.5 V, IOUT= 1.6 mA, VCM= -15 V and +15 V -0.3 Line termination resistance RTTA= +25C 1 01 100 300 Data input current IINDVCM= 10 V 1, 2, 3 01 3.1 mA VCM= 0 V -0.5 CM

36、= -10 V -3.1 Input balance VTHBIOUT= 200 A, RS= 500 , VOUT VCC= -1.2 V 1, 2, 3 01 0.4 V IOUT= 1.6 mA, RS= 500 , VOUT 0.5 V -0.4 See footnotes at end of table. Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-STANDARD MICROCIRCUIT DRAWING SIZE A 5962-9

37、3211 DEFENSE SUPPLY CENTER COLUMBUS COLUMBUS, OHIO 43218-3990 REVISION LEVEL B SHEET 6 DSCC FORM 2234 APR 97 TABLE I. Electrical performance characteristics - continued. Test Symbol Conditions 1/ -55C TA +125C unless otherwise specified Group A subgroups Device type Limits 2/ Unit Min MaxPower suppl

38、y current ICCVCC= 5.5 V, VDIFF= -0.5 V, VCM= -15 V and 15 V, (both receivers) 1, 2, 3 01 15 mA VCC= 15 V, VDIFF= -0.5 V, VCM= -15 V and 15 V, (both receivers) 30 Logical “1” output voltage VOHVCC= 4.5 V, VDIFF= 1 V, IOUT= -200 A 1, 2, 3 01 3.3 V VCC= 15 V, VDIFF= 1 V, IOUT= -200 A 13.8 Logical “0” o

39、utput voltage VOLVCC= 4.5 V, VDIFF= -1 V, IOUT= 1.6 mA 1, 2, 3 01 0.5 V Logical “1” strobe input voltage IIN1VSTROBE= 15 V, VDIFF= 3 V 1, 2, 3 01 100 A Logical “0” strobe input voltage IIN0VSTROBE= 0 V, VDIFF= 3 V 1, 2, 3 01 -100 A Differential propagation 4/ delay time tPD0(D)Differential input to

40、“0” outputs, VCC= 5 V, CL= 50 pF, TA= +25C 9 01 100 ns tPD1(D)Differential input to “1” outputs, VCC= 5 V, CL= 50 pF, TA= +25C 100 Strobe propagation 4/ delay time tPD0(S)Strobe input to “0” output, VCC= 5 V, CL= 50 pF, TA= +25C 9 01 70 ns tPD1(S)Strobe input to “1” output, VCC= 5 V, CL= 50 pF, TA=

41、+25C 150 1/ Unless otherwise specified, VCCminimum = 4.5 V and VCCmaximum = 15 V. See figure 2. 2/ The limiting terms “min” (minimum) and “max” (maximum) shall be considered to apply to magnitudes only. Negative current shall be defined as conventional current flow out of a device terminal. 3/ Param

42、eter tested go-no-go only. 4/ See figure 3. Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-STANDARD MICROCIRCUIT DRAWING SIZE A 5962-93211 DEFENSE SUPPLY CENTER COLUMBUS COLUMBUS, OHIO 43218-3990 REVISION LEVEL B SHEET 7 DSCC FORM 2234 APR 97 Device

43、 type 01 Case outline C Terminal number Terminal symbol 1 -INPUT 1 2 TERMINATION 3 +INPUT 1 4 STROBE 5 RESPONSE TIME 6 OUTPUT 7 GND 8 OUTPUT 9 RESPONSE TIME 10 STROBE 11 +INPUT 2 12 TERMINATION 13 -INPUT 2 14 VCCFIGURE 1. Terminal connections. Provided by IHSNot for ResaleNo reproduction or networki

44、ng permitted without license from IHS-,-,-STANDARD MICROCIRCUIT DRAWING SIZE A 5962-93211 DEFENSE SUPPLY CENTER COLUMBUS COLUMBUS, OHIO 43218-3990 REVISION LEVEL B SHEET 8 DSCC FORM 2234 APR 97 Test conditions: tr= tf 10 ns, f = 1 MHz NOTE: Includes probe and jig capacitance FIGURE 2. Test circuit.

45、FIGURE 3. Timing waveforms. Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-STANDARD MICROCIRCUIT DRAWING SIZE A 5962-93211 DEFENSE SUPPLY CENTER COLUMBUS COLUMBUS, OHIO 43218-3990 REVISION LEVEL B SHEET 9 DSCC FORM 2234 APR 97 4. VERIFICATION 4.1 Sa

46、mpling and inspection. For device classes Q and V, sampling and inspection procedures shall be in accordance with MIL-PRF-38535 or as modified in the device manufacturers Quality Management (QM) plan. The modification in the QM plan shall not affect the form, fit, or function as described herein. Fo

47、r device class M, sampling and inspection procedures shall be in accordance with MIL-PRF-38535, appendix A. 4.2 Screening. For device classes Q and V, screening shall be in accordance with MIL-PRF-38535, and shall be conducted on all devices prior to qualification and technology conformance inspecti

48、on. For device class M, screening shall be in accordance with method 5004 of MIL-STD-883, and shall be conducted on all devices prior to quality conformance inspection. 4.2.1 Additional criteria for device class M. a. Burn-in test, method 1015 of MIL-STD-883. (1) Test condition A, B, C, or D. The test circuit shall be maintained by the manufacturer under document revision level control and shall be made available t