DLA SMD-5962-93207 REV C-2011 MICROCIRCUIT DIGITAL ADVANCED CMOS SERIALLY CONTROLLED ACCESS NETWORK D-TYPE FLIP-FLOP WITH THREE-STATE OUTPUTS TTL COMPATIBLE INPUTS MONOLITHIC SILIC.pdf
《DLA SMD-5962-93207 REV C-2011 MICROCIRCUIT DIGITAL ADVANCED CMOS SERIALLY CONTROLLED ACCESS NETWORK D-TYPE FLIP-FLOP WITH THREE-STATE OUTPUTS TTL COMPATIBLE INPUTS MONOLITHIC SILIC.pdf》由会员分享,可在线阅读,更多相关《DLA SMD-5962-93207 REV C-2011 MICROCIRCUIT DIGITAL ADVANCED CMOS SERIALLY CONTROLLED ACCESS NETWORK D-TYPE FLIP-FLOP WITH THREE-STATE OUTPUTS TTL COMPATIBLE INPUTS MONOLITHIC SILIC.pdf(30页珍藏版)》请在麦多课文档分享上搜索。
1、 REVISIONS LTR DESCRIPTION DATE (YR-MO-DA) APPROVED A Change in accordance with notice of revision 5962-R073-94 -jak 93-12-30 Monica L. Poelking B Change in accordance with notice of revision 5962-R237-94 -tvn 94-07-14 Monica L. Poelking C Add bottom brazed flat pack to figure 1. Update the boilerpl
2、ate paragraphs in accordance with the latest MIL-PRF-38535 requirements. - jak 11-11-01 Thomas M. Hess REV SHEET REV C C C C C C C C C C C C C C C SHEET 15 16 17 18 19 20 21 22 23 24 25 26 27 28 29 REV STATUS REV C C C C C C C C C C C C C C OF SHEETS SHEET 1 2 3 4 5 6 7 8 9 10 11 12 13 14 PMIC N/A P
3、REPARED BY Joseph A. Kerby DLA LAND AND MARITIME COLUMBUS, OHIO 43218-3990 http:/www.landandmaritime.dla.mil STANDARD MICROCIRCUIT DRAWING THIS DRAWING IS AVAILABLE FOR USE BY ALL DEPARTMENTS AND AGENCIES OF THE DEPARTMENT OF DEFENSE CHECKED BY Thanh V. Nguyen APPROVED BY Monica L. Poelking MICROCIR
4、CUIT, DIGITAL, ADVANCED CMOS, SERIALLY CONTROLLED ACCESS NETWORK, D-TYPE FLIP-FLOP WITH THREE-STATE OUTPUTS, TTL COMPATIBLE INPUTS, MONOLITHIC SILICON DRAWING APPROVAL DATE 93-11-24 AMSC N/A REVISION LEVEL C SIZE A CAGE CODE 67268 5962-93207 SHEET 1 OF 29 DSCC FORM 2233 APR 97 5962-E525-11 Provided
5、by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-STANDARD MICROCIRCUIT DRAWING SIZE A 5962-93207 DLA LAND AND MARITIME COLUMBUS, OHIO 43218-3990 REVISION LEVEL C SHEET 2 DSCC FORM 2234 APR 97 1. SCOPE 1.1 Scope. This drawing documents two product assurance cla
6、ss levels consisting of high reliability (device classes Q and M) and space application (device class V). A choice of case outlines and lead finishes are available and are reflected in the Part or Identifying Number (PIN). When available, a choice of Radiation Hardness Assurance (RHA) levels is refl
7、ected in the PIN. 1.2 PIN. The PIN is as shown in the following example: 5962 - 93207 01 M X A Federal stock class designator RHA designator (see 1.2.1) Device type (see 1.2.2) Device class designator Case outline (see 1.2.4) Lead finish (see 1.2.5) / (see 1.2.3) / Drawing number 1.2.1 RHA designato
8、r. Device classes Q and V RHA marked devices meet the MIL-PRF-38535 specified RHA levels and are marked with the appropriate RHA designator. Device class M RHA marked devices meet the MIL-PRF-38535, appendix A specified RHA levels and are marked with the appropriate RHA designator. A dash (-) indica
9、tes a non-RHA device. 1.2.2 Device type(s). The device type(s) identify the circuit function as follows: Device type Generic number Circuit function 01 SCAN18374T Serially controlled access network, D-type flip-flop with three-state outputs, TTL compatible inputs and outputs 1.2.3 Device class desig
10、nator. The device class designator is a single letter identifying the product assurance level as follows: Device class Device requirements documentation M Vendor self-certification to the requirements for MIL-STD-883 compliant, non-JAN class level B microcircuits in accordance with MIL-PRF-38535, ap
11、pendix A Q or V Certification and qualification to MIL-PRF-38535 1.2.4 Case outline(s). The case outline(s) are as designated in MIL-STD-1835 and as follows: Outline letter Descriptive designator Terminals Package style X GDFP1-F56 or figure 1 56 Flat package 1.2.5 Lead finish. The lead finish is as
12、 specified in MIL-PRF-38535 for device classes Q and V or MIL-PRF-38535, appendix A for device class M. Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-STANDARD MICROCIRCUIT DRAWING SIZE A 5962-93207 DLA LAND AND MARITIME COLUMBUS, OHIO 43218-3990 RE
13、VISION LEVEL C SHEET 3 DSCC FORM 2234 APR 97 1.3 Absolute maximum ratings. 1/ 2/ 3/ Supply voltage range (VCC) -0.5 V dc to +7.0 V dc DC input voltage range (VIN) -0.5 V dc to VCC + 0.5 V dc DC output voltage range (VOUT) . -0.5 V dc to VCC+ 0.5 V dc DC input clamp current (IIK) (VIN= -0.5 V and VCC
14、+ 0.5 V) 20 mA DC output clamp current (IOK) (VOUT= -0.5 V and VCC+ 0.5 V) . 20 mA DC output current (IOUT) per output pin 70 mA DC VCCor GND current (ICC, IGND) 1330 mA 4/ Storage temperature range (TSTG) . -65C to +150C Maximum power dissipation (PD) . 750 mW Lead temperature (soldering, 10 second
15、s) +300C Thermal resistance, junction-to-case (JC) See MIL-STD-1835 Junction temperature (TJ) +175C 1.4 Recommended operating conditions. 2/ 3/ Supply voltage range (VCC) +4.5 V dc to +5.5 V dc Input voltage range (VIN) +0.0 V dc to VCC Output voltage range (VOUT). +0.0 V dc to VCC Minimum high leve
16、l input voltage (VIH) . 2.0 V Maximum low level input voltage (VIL) - . 0.8 V Case operating temperature range (TC) . -55C to +125C Input edge rate (V/t) minimum: from VIN= 0.8 V to 2.0 V, 2.0 V to 0.8 V 125 mV/ns Maximum high level output current (IOH) . -24 mA Maximum low level output current (IOL
17、) . +48 mA _ 1/ Stresses above the absolute maximum rating may cause permanent damage to the device. Extended operation at the maximum levels may degrade performance and affect reliability. The maximum junction temperature may be exceeded for allowable short duration burn-in screening conditions in
18、accordance with method 5004 of MIL-STD-883. 2/ Unless otherwise noted, all voltages are referenced to GND. 3/ The limits for the parameters specified herein shall apply over the full specified VCCrange and case temperature range of -55C to +125C. 4/ This value represents the maximum total current fl
19、owing into or out of all VCCor GND pins. Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-STANDARD MICROCIRCUIT DRAWING SIZE A 5962-93207 DLA LAND AND MARITIME COLUMBUS, OHIO 43218-3990 REVISION LEVEL C SHEET 4 DSCC FORM 2234 APR 97 2. APPLICABLE DOCU
20、MENTS 2.1 Government specification, standards, and handbooks. The following specification, standards, and handbooks form a part of this drawing to the extent specified herein. Unless otherwise specified, the issues of these documents are those cited in the solicitation or contract. DEPARTMENT OF DEF
21、ENSE SPECIFICATION MIL-PRF-38535 - Integrated Circuits, Manufacturing, General Specification for. DEPARTMENT OF DEFENSE STANDARDS MIL-STD-883 - Test Method Standard Microcircuits. MIL-STD-1835 - Interface Standard Electronic Component Case Outlines. DEPARTMENT OF DEFENSE HANDBOOKS MIL-HDBK-103 - Lis
22、t of Standard Microcircuit Drawings. MIL-HDBK-780 - Standard Microcircuit Drawings. (Copies of these documents are available online at https:/assist.daps.dla.mil/quicksearch/ or from the Standardization Document Order Desk, 700 Robbins Avenue, Building 4D, Philadelphia, PA 19111-5094.) 2.2 Non-Gover
23、nment publications. The following document(s) form a part of this document to the extent specified herein. Unless otherwise specified, the issues of these documents are those cited in the solicitation or contract. JEDEC SOLID STATE TECHNOLOGY ASSOCIATION (JEDEC) JESD-20 - Standard for Description of
24、 54/74ACXXXX and 54/74ACTXXXX Advanced High-Speed CMOS Devices. (Copies of these documents are available online at http:/www.jedec.org or from JEDEC Solid State Technology Association, 3103 North 10th Street, Suite 240S, Arlington, VA 22201.) INSTITUTE OF ELECTRICAL AND ELECTRONICS ENGINEERS (IEEE)
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