DLA SMD-5962-93097 REV A-2006 MICROCIRCUIT DIGITAL ADVANCED CMOS PROGRAMMABLE VIDEO SYNC GENERATOR TTL COMPATIBLE INPUTS MONOLITHIC SILICON《硅单片 TTL兼容输入 可编程视频同步信号发生器 改进型氧化物半导体数字微型电路.pdf

《DLA SMD-5962-93097 REV A-2006 MICROCIRCUIT DIGITAL ADVANCED CMOS PROGRAMMABLE VIDEO SYNC GENERATOR TTL COMPATIBLE INPUTS MONOLITHIC SILICON《硅单片 TTL兼容输入 可编程视频同步信号发生器 改进型氧化物半导体数字微型电路.pdf》由会员分享，可在线阅读，更多相关《DLA SMD-5962-93097 REV A-2006 MICROCIRCUIT DIGITAL ADVANCED CMOS PROGRAMMABLE VIDEO SYNC GENERATOR TTL COMPATIBLE INPUTS MONOLITHIC SILICON《硅单片 TTL兼容输入 可编程视频同步信号发生器 改进型氧化物半导体数字微型电路.pdf（23页珍藏版）》请在麦多课文档分享上搜索。

1、 REVISIONS LTR DESCRIPTION DATE (YR-MO-DA) APPROVED A Update the boilerplate to current requirements as specified in MIL-PRF-38535. Editorial changes throughout. jak 06-11-27 Thomas M. Hess REV SHET REV A A A A A A A A SHEET 15 16 17 18 19 20 21 22 REV STATUS REV A A A A A A A A A A A A A A OF SHEET

2、S SHEET 1 2 3 4 5 6 7 8 9 10 11 12 13 14 PMIC N/A PREPARED BY Joseph A. Kerby STANDARD MICROCIRCUIT DRAWING CHECKED BY Thanh V. Nguyen DEFENSE SUPPLY CENTER COLUMBUS COLUMBUS, OHIO 43218-3990 http:/www.dscc.dla.mil THIS DRAWING IS AVAILABLE FOR USE BY ALL DEPARTMENTS APPROVED BY Monica L. Poelking A

3、ND AGENCIES OF THE DEPARTMENT OF DEFENSE DRAWING APPROVAL DATE 94-06-01 MICROCIRCUIT, DIGITAL, ADVANCED CMOS, PROGRAMMABLE VIDEO SYNC GENERATOR, TTL COMPATIBLE INPUTS, MONOLITHIC SILICON AMSC N/A REVISION LEVEL A SIZE A CAGE CODE 67268 5962-93097 SHEET 1 OF 22 DSCC FORM 2233 APR 97 5962-E648-06 Prov

4、ided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-STANDARD MICROCIRCUIT DRAWING SIZE A 5962-93097 DEFENSE SUPPLY CENTER COLUMBUS COLUMBUS, OHIO 43218-3990 REVISION LEVEL A SHEET 2 DSCC FORM 2234 APR 97 1. SCOPE 1.1 Scope. This drawing documents two product

5、 assurance class levels consisting of high reliability (device classes Q and M) and space application (device class V). A choice of case outlines and lead finishes are available and are reflected in the Part or Identifying Number (PIN). When available, a choice of Radiation Hardness Assurance (RHA)

6、levels is reflected in the PIN. 1.2 PIN. The PIN is as shown in the following example: 5962 - 93097 01 M R A Federal stock class designator RHA designator (see 1.2.1) Device type (see 1.2.2)Device class designatorCase outline (see 1.2.4) Lead finish (see 1.2.5) / (see 1.2.3) / Drawing number 1.2.1 R

7、HA designator. Device classes Q and V RHA marked devices meet the MIL-PRF-38535 specified RHA levels and are marked with the appropriate RHA designator. Device class M RHA marked devices meet the MIL-PRF-38535, appendix A specified RHA levels and are marked with the appropriate RHA designator. A das

8、h (-) indicates a non-RHA device. 1.2.2 Device type(s). The device type(s) identify the circuit function as follows: Device type Generic number Circuit function 01 54ACT715 Programmable video sync generator, TTL compatible inputs 02 1/ 54ACT715-R Programmable video sync generator, TTL compatible inp

9、uts 1.2.3 Device class designator. The device class designator is a single letter identifying the product assurance level as follows: Device class Device requirements documentation M Vendor self-certification to the requirements for MIL-STD-883 compliant, non-JAN class level B microcircuits in accor

10、dance with MIL-PRF-38535, appendix A Q or V Certification and qualification to MIL-PRF-38535 1.2.4 Case outline(s). The case outline(s) are as designated in MIL-STD-1835 and as follows: Outline letter Descriptive designator Terminals Package style R GDIP1-T20 or CDIP2-T20 20 Dual-in-line 2 CQCC1-N20

11、 20 Square leadless chip carrier 1.2.5 Lead finish. The lead finish is as specified in MIL-PRF-38535 for device classes Q and V or MIL-PRF-38535, appendix A for device class M. 1/ Device type 02 is the same as device type 01 in all respects except that device type 02 is mask programmed to default to

12、 a clock enable state.Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-STANDARD MICROCIRCUIT DRAWING SIZE A 5962-93097 DEFENSE SUPPLY CENTER COLUMBUS COLUMBUS, OHIO 43218-3990 REVISION LEVEL A SHEET 3 DSCC FORM 2234 APR 97 1.3 Absolute maximum ratings

13、. 1/ 2/ 3/ Supply voltage range (VCC) -0.5 V dc to +7.0 V dc DC input voltage (VIN) -0.5 V dc to VCC+ 0.5 V dc DC output voltage range (VOUT) . -0.5 V dc to VCC+ 0.5 V dc DC input clamp current (IIK) (VIN= -0.5 V and VCC+ 0.5 V) 20 mA DC output clamp current (IOK) (VOUT= -0.5 V and VCC+ 0.5 V) 20 mA

14、 DC output source or sink current (IOUT) 15 mA DC VCCor GND current (ICC, IGND) (per output pin). 20 mA Storage temperature range (TSTG) . -65C to +150C Maximum power dissipation (PD) 500 mW Lead temperature (soldering, 10 seconds). +300C Thermal resistance, junction-to-case (JC) . See MIL-STD-1835

15、Junction temperature (TJ). +175C 1.4 Recommended operating conditions. 2/ 3/ Supply voltage range (VCC) +4.5 V dc to +5.5 V dc Input voltage range (VIN) +0.0 V dc to VCCOutput voltage range (VOUT). +0.0 V dc to VCCMaximum low level input voltage (VIL) 0.8 V Minimum high level input voltage (VIH). 2.

16、0 V Case operating temperature range (TC) . -55C to +125C Minimum input edge rate (V/t): (from VIN= 0.8 V to 2.0 V, 2.0 V to 0.8 V) . 125 mV/ns Maximum high level output current (IOH) -8 mA Maximum low level output current (IOL) +8 mA 1/ Stresses above the absolute maximum rating may cause permanent

17、 damage to the device. Extended operation at the maximum levels may degrade performance and affect reliability. The maximum junction temperature may be exceeded for allowable short duration burn-in screening conditions in accordance with method 5004 of MIL-STD-883. 2/ Unless otherwise noted, all vol

18、tages are referenced to GND. 3/ The limits for the parameters specified herein shall apply over the full specified VCCrange and case temperature range of -55C to +125C. Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-STANDARD MICROCIRCUIT DRAWING SIZ

19、E A 5962-93097 DEFENSE SUPPLY CENTER COLUMBUS COLUMBUS, OHIO 43218-3990 REVISION LEVEL A SHEET 4 DSCC FORM 2234 APR 97 2. APPLICABLE DOCUMENTS 2.1 Government specification, standards, and handbooks. The following specification, standards, and handbooks form a part of this drawing to the extent speci

20、fied herein. Unless otherwise specified, the issues of these documents are those cited in the solicitation or contract. DEPARTMENT OF DEFENSE SPECIFICATION MIL-PRF-38535 - Integrated Circuits, Manufacturing, General Specification for. DEPARTMENT OF DEFENSE STANDARDS MIL-STD-883 - Test Method Standar

21、d Microcircuits. MIL-STD-1835 - Interface Standard Electronic Component Case Outlines. DEPARTMENT OF DEFENSE HANDBOOKS MIL-HDBK-103 - List of Standard Microcircuit Drawings. MIL-HDBK-780 - Standard Microcircuit Drawings. (Copies of these documents are available online at http:/assist.daps.dla.mil/qu

22、icksearch/ or http:/assist.daps.dla.mil or from the Standardization Document Order Desk, 700 Robbins Avenue, Building 4D, Philadelphia, PA 19111-5094.) 2.2 Non-Government publications. The following document(s) form a part of this document to the extent specified herein. Unless otherwise specified,

23、the issues of these documents are those cited in the solicitation or contract. ELECTRONIC INDUSTRIES ALLIANCE (EIA) JEDEC Standard No. 20 - Standard for Description of 54/74ACXXXX and 54/74ACTXXXX Advanced High-Speed CMOS Devices. (Copies of these documents are available online at http:/www.eia.org

24、or from the Electronic Industries Alliance, 2500 Wilson Boulevard, Arlington, VA 22201-3834.) 2.3 Order of precedence. In the event of a conflict between the text of this drawing and the references cited herein, the text of this drawing takes precedence. Nothing in this document, however, supersedes

25、 applicable laws and regulations unless a specific exemption has been obtained. 3. REQUIREMENTS 3.1 Item requirements. The individual item requirements for device classes Q and V shall be in accordance with MIL-PRF-38535 and as specified herein or as modified in the device manufacturers Quality Mana

26、gement (QM) plan. The modification in the QM plan shall not affect the form, fit, or function as described herein. The individual item requirements for device class M shall be in accordance with MIL-PRF-38535, appendix A for non-JAN class level B devices and as specified herein. 3.2 Design, construc

27、tion, and physical dimensions. The design, construction, and physical dimensions shall be as specified in MIL-PRF-38535 and herein for device classes Q and V or MIL-PRF-38535, appendix A and herein for device class M. 3.2.1 Case outlines. The case outlines shall be in accordance with 1.2.4 herein. 3

28、.2.2 Terminal connections. The terminal connections shall be as specified on figure 1. 3.2.3 Block diagram. The block diagram shall be as specified on figure 2. 3.2.4 Register descriptions. The register descriptions shall be as specified on figure 3. Provided by IHSNot for ResaleNo reproduction or n

29、etworking permitted without license from IHS-,-,-STANDARD MICROCIRCUIT DRAWING SIZE A 5962-93097 DEFENSE SUPPLY CENTER COLUMBUS COLUMBUS, OHIO 43218-3990 REVISION LEVEL A SHEET 5 DSCC FORM 2234 APR 97 3.2.5 Signal specifications. The signal specifications shall be as specified on figure 4. 3.2.6 Add

30、ressing logic. The addressing logic shall be as specified on figure 5 3.2.7 Switching waveforms and test circuit. The switching waveforms and test circuit shall be as specified on figure 6. 3.3 Electrical performance characteristics and postirradiation parameter limits. Unless otherwise specified he

31、rein, the electrical performance characteristics and postirradiation parameter limits are as specified in table I and shall apply over the full case operating temperature range. 3.4 Electrical test requirements. The electrical test requirements shall be the subgroups specified in table II. The elect

32、rical tests for each subgroup are defined in table I. 3.5 Marking. The part shall be marked with the PIN listed in 1.2 herein. In addition, the manufacturers PIN may also be marked. For packages where marking of the entire SMD PIN number is not feasible due to space limitations, the manufacturer has

33、 the option of not marking the “5962-“ on the device. For RHA product using this option, the RHA designator shall still be marked. Marking for device classes Q and V shall be in accordance with MIL-PRF-38535. Marking for device class M shall be in accordance with MIL-PRF-38535, appendix A. 3.5.1 Cer

34、tification/compliance mark. The certification mark for device classes Q and V shall be a “QML“ or “Q“ as required in MIL-PRF-38535. The compliance mark for device class M shall be a “C“ as required in MIL-PRF-38535, appendix A. 3.6 Certificate of compliance. For device classes Q and V, a certificate

35、 of compliance shall be required from a QML-38535 listed manufacturer in order to supply to the requirements of this drawing (see 6.6.1 herein). For device class M, a certificate of compliance shall be required from a manufacturer in order to be listed as an approved source of supply in MIL-HDBK-103

36、 (see 6.6.2 herein). The certificate of compliance submitted to DSCC-VA prior to listing as an approved source of supply for this drawing shall affirm that the manufacturers product meets, for device classes Q and V, the requirements of MIL-PRF-38535 and herein or for device class M, the requirement

37、s of MIL-PRF-38535, appendix A and herein. 3.7 Certificate of conformance. A certificate of conformance as required for device classes Q and V in MIL-PRF-38535 or for device class M in MIL-PRF-38535, appendix A shall be provided with each lot of microcircuits delivered to this drawing. 3.8 Notificat

38、ion of change for device class M. For device class M, notification to DSCC-VA of change of product (see 6.2 herein) involving devices acquired to this drawing is required for any change that affects this drawing. 3.9 Verification and review for device class M. For device class M, DSCC, DSCCs agent,

39、and the acquiring activity retain the option to review the manufacturers facility and applicable required documentation. Offshore documentation shall be made available onshore at the option of the reviewer. 3.10 Microcircuit group assignment for device class M. Device class M devices covered by this

40、 drawing shall be in microcircuit group number 40 (see MIL-PRF-38535, appendix A).Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-STANDARD MICROCIRCUIT DRAWING SIZE A 5962-93097 DEFENSE SUPPLY CENTER COLUMBUS COLUMBUS, OHIO 43218-3990 REVISION LEVEL

41、A SHEET 6 DSCC FORM 2234 APR 97 TABLE I. Electrical performance characteristics. Test and MIL-STD-883 test method 1/ Symbol Test conditions 2/ -55C TC +125C 4.5 V VCC 5.5 V unless otherwise specified Device type VCCGroup A subgroups Limits 3/ Unit Min Max 4.5 V 4.40 High level output voltage 3006 VO

42、H1For all inputs affecting output under test VIN= 2.0 V or 0.8 V For all other inputs VIN= VCCor GND IOH= -50 A All 5.5 V 1, 2, 3 5.40 4.5 V 3.86 5.5 V 1 4.86 4.5 V 3.70 VOH2For all inputs affecting output under test VIN= 2.0 V or 0.8 V For all other inputs VIN= VCCor GND IOH= -8 mA All 5.5 V 2, 3 4

43、.70 VOH34/ For all inputs affecting output under test VIN= 5.5 V or 0.0 V For all other inputs VIN= VCCor GND IOH= -32 mA All 5.5 V 1, 2, 3 3.85 V 4.5 V 0.10 VOL1For all inputs affecting output under test VIN= 2.0 V or 0.8 V For all other inputs VIN= VCCor GND IOL= 50 A All 5.5 V 1, 2, 3 0.10 4.5 V

44、0.36 5.5 V 1 0.36 4.5 V 0.50 VOL2For all inputs affecting output under test VIN= 2.0 V or 0.8 V For all other inputs VIN= VCCor GND IOL= 8 mA All 5.5 V 2, 3 0.50 Low level output voltage 3007 VOL34/ For all inputs affecting output under test VIN= 5.5 V or 0.0 V For all other inputs VIN= VCCor GND IO

45、L= 32 mA All 5.5 V 1, 2, 3 1.65 V See footnotes at end of table. Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-STANDARD MICROCIRCUIT DRAWING SIZE A 5962-93097 DEFENSE SUPPLY CENTER COLUMBUS COLUMBUS, OHIO 43218-3990 REVISION LEVEL A SHEET 7 DSCC FO

46、RM 2234 APR 97 TABLE I. Electrical performance characteristics - Continued. Test and MIL-STD-883 test method 1/ Symbol Test conditions 2/ -55C TC +125C 4.5 V VCC 5.5 V unless otherwise specified Device type VCCGroup A subgroups Limits 3/ Unit Min Max Positive input clamp voltage 3022 VIC+For input u

47、nder test IIN= 18 mA All 4.5 V1, 2, 3 5.7 V Negative input clamp voltage 3022 VIC-For input under test IIN= -18 mA All 4.5 V1, 2, 3 -1.2 V 1 0.1 Input current high 3010 IIHFor input under test, VIN= VCCFor all other inputs, VIN= VCCor GND All 5.5 V2, 3 1.0 A 1 -0.1 Input current low 3009 IILFor inpu

48、t under test, VIN= GND For all other inputs, VIN= VCCor GND All 5.5 V2, 3 -1.0 A 1 1.0 Quiescent supply current delta, TTL input levels 3005 ICC5/ For input under test, VIN= VCC- 2.1 V For all other inputs, VIN= VCCor GND All 5.5 V2, 3 1.6 mA 1 8.0 Quiescent supply current, outputs high 3005 ICCHAll 5.5 V2, 3 160.0A 1 8.0 Quiescent supply current, outputs low 3005 ICCLFor all inputs, VIN= VCCor GND All 5.5 V2, 3 160.0A Input capacitance 3012 CINSee 4.4.1d TC= +25C All 5.0 V4 10.0 pF Power dissipation capacitance CPD6/ See 4.4.1d TC= +25C All 5