DLA SMD-5962-90553 REV B-2012 MICROCIRCUIT DIGITAL HIGH SPEED CMOS 8-BIT SYNCHRONOUS BINARY DOWN COUNTER MONOLITHIC SILICON.pdf
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1、 REVISIONS LTR DESCRIPTION DATE (YR-MO-DA) APPROVED A Correct the logic diagram in figure 3. Add notes to figure 5, switching waveforms and test circuit. Update the boilerplate to current requirements as specified in MIL-PRF-38535. Editorial changes throughout. jak 06-04-28 Thomas M. Hess B Update b
2、oilerplate paragraphs to the current MIL-PRF-38535 requirements. - LTG 12-05-17 Thomas M. Hess REV SHEET REV SHEET REV STATUS REV B B B B B B B B B B B B OF SHEETS SHEET 1 2 3 4 5 6 7 8 9 10 11 12 PMIC N/A PREPARED BY Marcia B. Kelleher DLA LAND AND MARITIME COLUMBUS, OHIO 43218-3990 http:/www.landa
3、ndmaritime.dla.mil STANDARD MICROCIRCUIT DRAWING THIS DRAWING IS AVAILABLE FOR USE BY ALL DEPARTMENTS AND AGENCIES OF THE DEPARTMENT OF DEFENSE AMSC N/A CHECKED BY Thomas J. Ricciuti APPROVED BY Michael A. Frye MICROCIRCUIT, DIGITAL, HIGH SPEED CMOS, 8-BIT SYNCHRONOUS BINARY DOWN COUNTER, MONOLITHIC
4、 SILICON DRAWING APPROVAL DATE 90-10-23 REVISION LEVEL B SIZE A CAGE CODE 67268 5962-90553 SHEET 1 OF 12 DSCC FORM 2233 APR 97 5962-E302-12 Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-STANDARD MICROCIRCUIT DRAWING SIZE A 5962-90553 DLA LAND AND M
5、ARITIME COLUMBUS, OHIO 43218-3990 REVISION LEVEL B SHEET 2 DSCC FORM 2234 APR 97 1. SCOPE 1.1 Scope. This drawing describes device requirements for MIL-STD-883 compliant, non-JAN class level B microcircuits in accordance with MIL-PRF-38535, appendix A. 1.2 Part or Identifying Number (PIN). The compl
6、ete PIN is as shown in the following example: 5962-90553 01 E A Drawing number Device type (see 1.2.1) Case outline (see 1.2.2) Lead finish (see 1.2.3) 1.2.1 Device type(s). The device type(s) identify the circuit function as follows: Device type Generic number Circuit function 01 54HC40103 8-bit sy
7、nchronous binary down counter 1.2.2 Case outline(s). The case outline(s) are as designated in MIL-STD-1835 and as follows: Outline letter Descriptive designator Terminals Package style E GDIP1-T16 or CDIP2-T16 16 Dual-in-line 1.2.3 Lead finish. The lead finish is as specified in MIL-PRF-38535, appen
8、dix A. 1.3 Absolute maximum ratings. 1/ 2/ 3/ Supply voltage range (VCC) . -0.5 V dc to +7.0 V dc DC input voltage range (VIN) . -0.5 V dc to VCC + 0.5 V dc DC output voltage range (VOUT) -0.5 V dc to VCC+ 0.5 V dc DC input diode current (IIK) . 20 mA DC output diode current (per pin) (IOK) 20 mA DC
9、 drain current (per pin) (IOUT) 25 mA DC VCCor GND current (ICC, IGND) 50 mA Storage temperature range (TSTG) -65C to +150C Maximum power dissipation (PD) 500 mW 4/ Lead temperature (soldering, 10 seconds) . +300C Thermal resistance, junction-to-case (JC) See MIL-STD-1835 Junction temperature (TJ) .
10、 +175C 1.4 Recommended operating conditions. Supply voltage range (VCC) . +2.0 V dc to +6.0 V dc Input voltage range (VIN) . 0.0 V to VCC Output voltage range (VOUT) 0.0 V to VCCCase operating temperature range (TC) -55C to +125C Input rise or fall time (tr, tf): VCC= 2.0 V 0 to 1000 ns VCC= 4.5 V 0
11、 to 500 ns VCC= 6.0 V 0 to 400 ns Maximum CP frequency (fMAX): TC= +25C, VCC= 4.5 V dc . 15 MHz TC= -55C to +125C, VCC= 4.5 V dc . 10 MHz _ 1/ Stresses above the absolute maximum rating may cause permanent damage to the device. Extended operation at the maximum levels may degrade performance and aff
12、ect reliability. 2/ Unless otherwise specified, all voltages are referenced to ground. 3/ The limits for the parameters specified herein shall apply over the full specified VCCrange and case temperature range of -55C to +125C. 4/ For TA= +100C to +125C, derate linearly at 8 mW/C Provided by IHSNot f
13、or ResaleNo reproduction or networking permitted without license from IHS-,-,-STANDARD MICROCIRCUIT DRAWING SIZE A 5962-90553 DLA LAND AND MARITIME COLUMBUS, OHIO 43218-3990 REVISION LEVEL B SHEET 3 DSCC FORM 2234 APR 97 1.4 Recommended operating conditions Continued. Minimum pulse width, CP (tW1):
14、TC= +25C, VCC= 4.5 V dc . 33 ns TC= -55C to +125C, VCC= 4.5 V dc . 50 ns Minimum pulse width, PL, MR (tW2): TC= +25C, VCC= 4.5 V dc . 25 ns TC= -55C to +125C, VCC= 4.5 V dc . 38 ns Minimum removal time, MR to CP (trem): TC= +25C, VCC= 4.5 V dc . 10 ns TC= -55C to +125C, VCC= 4.5 V dc . 15 ns Minimum
15、 setup time, Pn to CP (ts1): TC= +25C, VCC= 4.5 V dc . 20 ns TC= -55C to +125C, VCC= 4.5 V dc . 30 ns Minimum setup time, PE to CP (ts2): TC= +25C, VCC= 4.5 V dc . 15 ns TC= -55C to +125C, VCC= 4.5 V dc . 22 ns Minimum setup time, TE to CP (ts3): TC= +25C, VCC= 4.5 V dc . 30 ns TC= -55C to +125C, VC
16、C= 4.5 V dc . 45 ns Minimum hold time, Pn to CP (th1): TC= +25C, VCC= 4.5 V dc . 5 ns TC= -55C to +125C, VCC= 4.5 V dc . 5 ns Minimum hold time, PE to CP (th2): TC= +25C, VCC= 4.5 V dc . 2 ns TC= -55C to +125C, VCC= 4.5 V dc . 2 ns Minimum hold time, TE to CP (th3): TC= +25C, VCC= 4.5 V dc . 0 ns TC
17、= -55C to +125C, VCC= 4.5 V dc . 0 ns 2. APPLICABLE DOCUMENTS 2.1 Government specification, standards, and handbooks. The following specification, standards, and handbooks form a part of this drawing to the extent specified herein. Unless otherwise specified, the issues of these documents are those
18、cited in the solicitation or contract. DEPARTMENT OF DEFENSE SPECIFICATION MIL-PRF-38535 - Integrated Circuits, Manufacturing, General Specification for. DEPARTMENT OF DEFENSE STANDARDS MIL-STD-883 - Test Method Standard Microcircuits. MIL-STD-1835 - Interface Standard Electronic Component Case Outl
19、ines. DEPARTMENT OF DEFENSE HANDBOOKS MIL-HDBK-103 - List of Standard Microcircuit Drawings. MIL-HDBK-780 - Standard Microcircuit Drawings. (Copies of these documents are available online at https:/assist.daps.dla.mil/quicksearch/ or from the Standardization Document Order Desk, 700 Robbins Avenue,
20、Building 4D, Philadelphia, PA 19111-5094.) 2.2 Non-Government publications. The following document(s) form a part of this document to the extent specified herein. Unless otherwise specified, the issues of these documents cited in the solicitation or contract. JEDEC SOLID STATE TECHNOLOGY ASSOCIATION
21、 (JEDEC) JEDEC Standard No. 7 - Standard for Description of 54/74HCXXXXX and 54/74HCTXXXXX Advanced High-Speed CMOS Devices. (Copies of these documents are available online at http:/www.jedec.org or from JEDEC Solid State Technology Association, 3103 North 10thStreet, Suite 240-S Arlington, VA 22201
22、). Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-STANDARD MICROCIRCUIT DRAWING SIZE A 5962-90553 DLA LAND AND MARITIME COLUMBUS, OHIO 43218-3990 REVISION LEVEL B SHEET 4 DSCC FORM 2234 APR 97 2.3 Order of precedence. In the event of a conflict betw
23、een the text of this drawing and the references cited herein, the text of this drawing takes precedence. Nothing in this document, however, supersedes applicable laws and regulations unless a specific exemption has been obtained. 3. REQUIREMENTS 3.1 Item requirements. The individual item requirement
24、s shall be in accordance with MIL-PRF-38535, appendix A for non-JAN class level B devices and as specified herein. Product built to this drawing that is produced by a Qualified Manufacturer Listing (QML) certified and qualified manufacturer or a manufacturer who has been granted transitional certifi
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