DLA SMD-5962-90509 REV A-2011 MICROCIRCUIT LINEAR LOW POWER BUFFER AMPLIFIER MONOLITHIC SILICON.pdf
《DLA SMD-5962-90509 REV A-2011 MICROCIRCUIT LINEAR LOW POWER BUFFER AMPLIFIER MONOLITHIC SILICON.pdf》由会员分享,可在线阅读,更多相关《DLA SMD-5962-90509 REV A-2011 MICROCIRCUIT LINEAR LOW POWER BUFFER AMPLIFIER MONOLITHIC SILICON.pdf(10页珍藏版)》请在麦多课文档分享上搜索。
1、 REVISIONS LTR DESCRIPTION DATE (YR-MO-DA) APPROVED A Update boilerplate paragraphs to current MIL-PRF-38535 requirements. - ro 11-08-16 C. SAFFLE REV SHET REV SHET REV STATUS REV A A A A A A A A A OF SHEETS SHEET 1 2 3 4 5 6 7 8 9 PMIC N/A PREPARED BY RICK C. OFFICER DLA LAND AND MARITIME COLUMBUS,
2、 OHIO 43218-3990 http:/www.landandmaritime.dla.mil STANDARD MICROCIRCUIT DRAWING THIS DRAWING IS AVAILABLE FOR USE BY ALL DEPARTMENTS AND AGENCIES OF THE DEPARTMENT OF DEFENSE CHECKED BY CHARLES E. BESORE APPROVED BY MICHAEL A. FRYE MICROCIRCUIT, LINEAR, LOW POWER BUFFER AMPLIFIER, MONOLITHIC SILICO
3、N DRAWING APPROVAL DATE 93-01-20 AMSC N/A REVISION LEVEL A SIZE A CAGE CODE 67268 5962-90509 SHEET 1 OF 9 DSCC FORM 2233 APR 97 5962-E259-11 Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-STANDARD MICROCIRCUIT DRAWING SIZE A 5962-90509 DLA LAND AND
4、MARITIME COLUMBUS, OHIO 43218-3990 REVISION LEVEL A SHEET 2 DSCC FORM 2234 APR 97 1. SCOPE 1.1 Scope. This drawing describes device requirements for MIL-STD-883 compliant, non-JAN class level B microcircuits in accordance with MIL-PRF-38535, appendix A. 1.2 Part or Identifying Number (PIN). The comp
5、lete PIN is as shown in the following example: 5962-90509 01 P A Drawing number Device type (see 1.2.1) Case outline(see 1.2.2) Lead finish(see 1.2.3)1.2.1 Device type(s). The device type(s) identify the circuit function as follows: Device type Generic number Circuit function 01 EL2002A Low power bu
6、ffer amplifier 02 EL2002 Low power buffer amplifier 1.2.2 Case outline(s). The case outline(s) are as designated in MIL-STD-1835 and as follows: Outline letter Descriptive designator Terminals Package style P GDIP1-T8 or CDIP2-T8 8 Dual-in-line 2 CQCC1-N20 20 Square leadless chip carrier 1.2.3 Lead
7、finish. The lead finish is as specified in MIL-PRF-38535, appendix A. 1.3 Absolute maximum ratings. Total supply voltage ( +VSto VS) . 36 V Supply voltage ( VS) . 18 V dc Input voltage ( VIN) 15 V dc or VS1/ Input current ( IIN) 50 mA 1/ Output short circuit duration Continuous 2/ Junction temperatu
8、re (TJ) . +175C Storage temperature range . -65C to +150C Lead temperature (soldering, 10 seconds) +300C Thermal resistance, junction-to-case (JC) . See MIL-STD-1835 3/ Thermal resistance, junction-to-ambient (JA) : 3/ Case P . +125C/W Case 2 . +100C/W _ 1/ If the input exceeds the ratings shown (or
9、 the supplies), or if the input to the output voltage exceeds 7.5 V, then the input current must be limited to 50 mA. 2/ A heat sinking is required to keep the junction temperature below the absolute maximum when the output is short circuited. 3/ The maximum power dissipation depends on package type
10、, ambient temperature, and heat sinking. Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-STANDARD MICROCIRCUIT DRAWING SIZE A 5962-90509 DLA LAND AND MARITIME COLUMBUS, OHIO 43218-3990 REVISION LEVEL A SHEET 3 DSCC FORM 2234 APR 97 1.4 Recommended op
11、erating conditions. Supply voltage ( VS) . 15 V dc Ambient operating temperature range (TA) . -55C to +125C 2. APPLICABLE DOCUMENTS 2.1 Government specification, standards, and handbooks. The following specification, standards, and handbooks form a part of this drawing to the extent specified herein
12、. Unless otherwise specified, the issues of these documents are those cited in the solicitation or contract. DEPARTMENT OF DEFENSE SPECIFICATION MIL-PRF-38535 - Integrated Circuits, Manufacturing, General Specification for. DEPARTMENT OF DEFENSE STANDARDS MIL-STD-883 - Test Method Standard Microcirc
13、uits. MIL-STD-1835 - Interface Standard Electronic Component Case Outlines. DEPARTMENT OF DEFENSE HANDBOOKS MIL-HDBK-103 - List of Standard Microcircuit Drawings. MIL-HDBK-780 - Standard Microcircuit Drawings. (Copies of these documents are available online at https:/assist.daps.dla.mil/quicksearch/
14、 or from the Standardization Document Order Desk, 700 Robbins Avenue, Building 4D, Philadelphia, PA 19111-5094.) 2.2 Order of precedence. In the event of a conflict between the text of this drawing and the references cited herein, the text of this drawing takes precedence. Nothing in this document,
15、however, supersedes applicable laws and regulations unless a specific exemption has been obtained. 3. REQUIREMENTS 3.1 Item requirements. The individual item requirements shall be in accordance with MIL-PRF-38535, appendix A for non-JAN class level B devices and as specified herein. Product built to
16、 this drawing that is produced by a Qualified Manufacturer Listing (QML) certified and qualified manufacturer or a manufacturer who has been granted transitional certification to MIL-PRF-38535 may be processed as QML product in accordance with the manufacturers approved program plan and qualifying a
17、ctivity approval in accordance with MIL-PRF-38535. This QML flow as documented in the Quality Management (QM) plan may make modifications to the requirements herein. These modifications shall not affect form, fit, or function of the device. These modifications shall not affect the PIN as described h
18、erein. A “Q“ or “QML“ certification mark in accordance with MIL-PRF-38535 is required to identify when the QML flow option is used. 3.2 Design, construction, and physical dimensions. The design, construction, and physical dimensions shall be as specified in MIL-PRF-38535, appendix A and herein. 3.2.
19、1 Case outlines. The case outlines shall be in accordance with 1.2.2 herein. 3.2.2 Terminal connections. The terminal connections shall be as specified on figure 1. 3.3 Electrical performance characteristics. Unless otherwise specified herein, the electrical performance characteristics are as specif
20、ied in table I and shall apply over the full ambient operating temperature range. 3.4 Electrical test requirements. The electrical test requirements shall be the subgroups specified in table II. The electrical tests for each subgroup are described in table I. Provided by IHSNot for ResaleNo reproduc
21、tion or networking permitted without license from IHS-,-,-STANDARD MICROCIRCUIT DRAWING SIZE A 5962-90509 DLA LAND AND MARITIME COLUMBUS, OHIO 43218-3990 REVISION LEVEL A SHEET 4 DSCC FORM 2234 APR 97 TABLE I. Electrical performance characteristics. Test Symbol Conditions -55C TA+125C Group A subgro
22、upsDevice type Limits 1/ Unit VS= 15 V, RS= 50 unless otherwise specified Min Max Offset voltage VOSVIN= 0 V, RL= 1 01 -15 +15 mV 2,3 -20 +20 1 02 -40 +40 2,3 -50 +50 Input current IINVIN= 0 V, RL= 1 01 -10 +10 A 2,3 -15 +15 1 02 -15 +15 2,3 -20 +20 Input resistance RINVIN= 12 V, RL= 100 1 All 1 M 2
23、,3 0.1Voltage gain AV1VIN= 12 V, RL= 1 All 0.990 V/V 2,3 0.985AV2VIN= 10 V, RL= 100 1 0.85 2,3 0.83AV3VIN= 3 V, RL= 100 , 1 0.83 VS= 5 V 2,3 0.80 Output voltage swing +VOVIN= +12 V, RL= 100 1 All +10 V 2,3 +9.5 -VOVIN= -12 V, RL= 100 1 -10 2,3 -9.5 Output resistance ROUTVIN= 2 V, RL= 100 1 All 13 2,
24、3 15Output current +IOUTVIN= +12 V, VOUT= +10 V 1 All +100 mA 2,3 +95 -IOUTVIN= -12 V, VOUT= -10 V 1 -100 2,3 -95 See footnotes at end of table. Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-STANDARD MICROCIRCUIT DRAWING SIZE A 5962-90509 DLA LAND
- 1.请仔细阅读文档,确保文档完整性,对于不预览、不比对内容而直接下载带来的问题本站不予受理。
- 2.下载的文档,不会出现我们的网址水印。
- 3、该文档所得收入(下载+内容+预览)归上传者、原创作者;如果您是本文档原作者,请点此认领!既往收益都归您。
下载文档到电脑,查找使用更方便
10000 积分 0人已下载
下载 | 加入VIP,交流精品资源 |
- 配套讲稿:
如PPT文件的首页显示word图标,表示该PPT已包含配套word讲稿。双击word图标可打开word文档。
- 特殊限制:
部分文档作品中含有的国旗、国徽等图片,仅作为作品整体效果示例展示,禁止商用。设计者仅对作品中独创性部分享有著作权。
- 关 键 词:
- DLASMD596290509REVA2011MICROCIRCUITLINEARLOWPOWERBUFFERAMPLIFIERMONOLITHICSILICONPDF

链接地址:http://www.mydoc123.com/p-699731.html