DLA SMD-5962-90507 REV A-2000 MICROCIRCUIT LINEAR TEMPERATURE TRANSDUCER MONOLITHIC SILICON《硅单片 温度传感器 线性微型电路》.pdf

《DLA SMD-5962-90507 REV A-2000 MICROCIRCUIT LINEAR TEMPERATURE TRANSDUCER MONOLITHIC SILICON《硅单片 温度传感器 线性微型电路》.pdf》由会员分享，可在线阅读，更多相关《DLA SMD-5962-90507 REV A-2000 MICROCIRCUIT LINEAR TEMPERATURE TRANSDUCER MONOLITHIC SILICON《硅单片 温度传感器 线性微型电路》.pdf（10页珍藏版）》请在麦多课文档分享上搜索。

1、REVISIONSLTR DESCRIPTION DATE (YR-MO-DA) APPROVEDA Drawing updated to reflect current requirements. - ro 00-07-18 R. MONNINREVSHEETREVSHEETREV STATUS REV AAAAAAAAAOF SHETS SHET 123456789PMIC N/A PREPARED BY MARCIA B. KELLEHERDEFENSE SUPPLY CENTER COLUMBUSSTANDARDMICROCIRCUITDRAWINGCHECKED BYRAJESH P

2、ITHADIACOLUMBUS, OHIO 43216THIS DRAWING IS AVAILABLEFOR USE BY ALLDEPARTMENTSAPPROVED BYMICHAEL A. FRYEMICROCIRCUIT, LINEAR, TEMPERATURETRANSDUCER, MONOLITHIC SILICONAND AGENCIES OF THEDEPARTMENT OF DEFENSEDRAWING APPROVAL DATE94-03-29AMSC N/AREVISION LEVELASIZEACAGE CODE672685962-90507SHEET1 OF 9DS

3、CC FORM 2233APR 97 5962-E405-00DISTRIBUTION STATEMENT A. Approved for public release; distribution is unlimited.Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-STANDARDMICROCIRCUIT DRAWINGSIZEA5962-90507DEFENSE SUPPLY CENTER COLUMBUSCOLUMBUS, OHIO 43

4、216-5000REVISION LEVELASHEET2DSCC FORM 2234APR 971. SCOPE1.1 Scope. This drawing describes device requirements for MIL-STD-883 compliant, non-JAN class level B microcircuits inaccordance with MIL-PRF-38535, appendix A.1.2 Part or Identifying Number (PIN). The complete PIN is as shown in the followin

5、g example:5962-90507 01 X X G7EG7EG7EG7EG7EG7EG7EG7EG7E G7E G7E G7E Drawing number Device type Case outline Lead finish(see 1.2.1) (see 1.2.2) (see 1.2.3)1.2.1 Device type(s). The device type(s) identify the circuit function as follows:Device type Generic number Circuit function01 LM134 Temperature

6、transducer02 LM134-3 Temperature transducer03 LM134-6 Temperature transducer1.2.2 Case outline(s). The case outline(s) are as designated in MIL-STD-1835 and as follows:Outline letter Descriptive designator Terminals Package styleX See figure 1 3 Can1.2.3 Lead finish. The lead finish is as specified

7、in MIL-PRF-38535, appendix A.1.3 Absolute maximum ratings.Forward voltage (V+ to V-):Device type 01 +40 V dcDevice type 02 and 03 +30 V dcReverse voltage (V+ to V-) .20 V dcR pin to V- voltage 5 V dcOperating temperature range .-55G71C to +150G71CSet current 10 mAPower dissipation (PD) .200 mWJuncti

8、on temperature (TJ) .150G71CStorage temperature range .-65G71C to +150G71CLead temperature (soldering, 10 seconds) .+300G71CThermal resistance, junction-to-ambient (G54JA) 440G71C/WThermal resistance, junction-to-case (G54JC) .80G71C/W1.4 Recommended operating conditions.Ambient operating temperatur

9、e range -55G71C to +150G71CProvided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-STANDARDMICROCIRCUIT DRAWINGSIZEA5962-90507DEFENSE SUPPLY CENTER COLUMBUSCOLUMBUS, OHIO 43216-5000REVISION LEVELASHEET3DSCC FORM 2234APR 972. APPLICABLE DOCUMENTS2.1 Governmen

10、t specification, standards, and handbooks. The following specification, standards, and handbooks form apart of this drawing to the extent specified herein. Unless otherwise specified, the issues of these documents are those listedin the issue of the Department of Defense Index of Specifications and

11、Standards (DoDISS) and supplement thereto, cited inthe solicitation.SPECIFICATIONDEPARTMENT OF DEFENSEMIL-PRF-38535 - Integrated Circuits, Manufacturing, General Specification for.STANDARDSDEPARTMENT OF DEFENSEMIL-STD-883 - Test Method Standard Microcircuits.MIL-STD-973 - Configuration Management.MI

12、L-STD-1835 - Interface Standard For Microcircuit Case Outlines.HANDBOOKSDEPARTMENT OF DEFENSEMIL-HDBK-103 - List of Standard Microcircuit Drawings (SMDs).MIL-HDBK-780 - Standard Microcircuit Drawings.(Unless otherwise indicated, copies of the specification, standards, and handbooks are available fro

13、m the StandardizationDocument Order Desk, 700 Robbins Avenue, Building 4D, Philadelphia, PA 19111-5094.)2.2 Order of precedence. In the event of a conflict between the text of this drawing and the references cited herein, the textof this drawing takes precedence. Nothing in this document, however, s

14、upersedes applicable laws and regulations unless aspecific exemption has been obtained.3. REQUIREMENTS3.1 Item requirements. The individual item requirements shall be in accordance with MIL-PRF-38535, appendix A for non-JAN class level B devices and as specified herein. Product built to this drawing

15、 that is produced by a Qualified ManufacturerListing (QML) certified and qualified manufacturer or a manufacturer who has been granted transitional certification to MIL-PRF-38535 may be processed as QML product in accordance with the manufacturers approved program plan and qualifyingactivity approva

16、l in accordance with MIL-PRF-38535. This QML flow as documented in the Quality Management (QM) planmay make modifications to the requirements herein. These modifications shall not affect form, fit, or function of the device. These modifications shall not affect the PIN as described herein. A “Q“ or

17、“QML“ certification mark in accordance with MIL-PRF-38535 is required to identify when the QML flow option is used.3.2 Design, construction, and physical dimensions. The design, construction, and physical dimensions shall be asspecified in MIL-PRF-38535, appendix A and herein.3.2.1 Case outline(s).

18、The case outline(s) shall be in accordance with 1.2.2 herein and figure 1.3.2.2 Terminal connections. The terminal connections shall be as specified on figure 1.3.3 Electrical performance characteristics. Unless otherwise specified herein, the electrical performance characteristics areas specified i

19、n table I and shall apply over the full ambient operating temperature range.Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-STANDARDMICROCIRCUIT DRAWINGSIZEA5962-90507DEFENSE SUPPLY CENTER COLUMBUSCOLUMBUS, OHIO 43216-5000REVISION LEVELASHEET4DSCC FO

20、RM 2234APR 97TABLE I. Electrical performance characteristics.Test SymbolConditions 1/-55G71C G64 TAG64 +125G71Cunless otherwise specifiedGroup AsubgroupsDevicetypeLimits UnitMin MaxSet current error, 2/V+ = 2.5 VG27ISET10 G50A G64 ISETG64 1 mA101 3%2,3 131 mA G64 ISETG64 5 mA152 G50A G64 ISETG64 10

21、G50A18100 G50A G64 ISETG64 1 mA,TJ= 25G71C102 1100 G50A G64 ISETG64 1 mA,TJ= 25G71C103 2Average change in set 3/current with inputvoltageG27ISET/G27VIN1.5 V G64 V+ G64 5 V,2 G50A G64 ISETG64 1 mA1 01 0.05 %/V5 V G64 V+ G64 VMAX,2 G50A G64 ISETG64 1 mA10.31.5 V G64 V+ G64 5 V,ISETG64 1 mA2,3 2.05 V G

22、64 V+ G64 30 V,ISETG64 1 mA2,3 1.01.5 V G64 V+ G64 5 V,100 G50A G64 ISETG64 1 mA102 0.55 V G64 V+ G64 30 V,100 G50A G64 ISETG64 1 mA31.5 V G64 V+ G64 5 V,100 G50A G64 ISETG64 1 mA103 0.15 V G64 V+ G64 30 V,100 G50A G64 ISETG64 1 mA5See footnotes at end of table.Provided by IHSNot for ResaleNo reprod

23、uction or networking permitted without license from IHS-,-,-STANDARDMICROCIRCUIT DRAWINGSIZEA5962-90507DEFENSE SUPPLY CENTER COLUMBUSCOLUMBUS, OHIO 43216-5000REVISION LEVELASHEET5DSCC FORM 2234APR 97TABLE I. Electrical performance characteristics Continued.Test SymbolConditions 1/-55G71C G64 TAG64 +

24、125G71Cunless otherwise specifiedGroup AsubgroupsDevicetypeLimits UnitMin MaxRatio of set currentto V- currentISET/ 10 G50A G64 ISETG64 1 mA1 011423IV2,3 12 262 G50A G64 ISETG64 10 G50A1143100 G50A G64 ISETG64 1 mA1 02,03 14 26Temperature dependenceof set currentTISET25 G50A G64 ISETG64 1 mA 4/ 5/1

25、01 0.96 1.04100 G50A G64 ISETG64 1 mA 4/ 5/1 02 0.98 1.02100 G50A G64 ISETG64 1 mA 4/ 5/1 03 0.97 1.03Equivalent temperatureerrorTE 5/ 102 G723G71C103 G7261/ Unless otherwise specified, tests are performed at TJ= 25G71C with pulse testing so that junction temperature doesnot change during test.2/ Se

26、t current is the current flowing into the V+ pin. IT is determined by: ISET= 67.7 mV/RSET(at 25G71C). Set currenterror is expressed as a percent deviation from this amount. ISETincreases at 0.336 %/G71C at TJ= 25G71C.3/ VMAX= 40 V for device type 01. VMAX= 30 V for device types 02 and 03.4/ ISETis d

27、irectly proportional to absolute temperature (G71K). ISETat any temperature can be calculated from:ISET= IO(T/TO) when IO is ISETmeasured at TO(G71K).5/ Guaranteed, if not tested, to the limits in table I.Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,

28、-,-STANDARDMICROCIRCUIT DRAWINGSIZEA5962-90507DEFENSE SUPPLY CENTER COLUMBUSCOLUMBUS, OHIO 43216-5000REVISION LEVELASHEET6DSCC FORM 2234APR 97Case outline XTerminalnumberTerminalsymbol1R2V+3V-Symbol Millimeters 1/ Inches 1/Min Max Min MaxA 2.159 2.667 0.085 0.105G49b1 0.406 0.483 0.016 0.019G49D 5.3

29、00 5.503 0.209 0.219G49D1 4.521 4.953 0.178 0.195G49e 2.540 BSC 0.100 BSCe1 1.270 BSC 0.050 BSCF - 0.762 - 0.030k 0.914 1.168 0.036 0.046k1 0.711 1.219 0.028 0.048L 12.700 - 0.500 -NOTE:1/ The U.S. government preferred system of measurement is the metric SI system. However, since this item wasorigin

30、ally designed using inch-pound units of measurement, in the event of conflict between the metric andinch-pound units, the inch-pound units shall take precedence.FIGURE 1. Case outline.Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-STANDARDMICROCIRCU

31、IT DRAWINGSIZEA5962-90507DEFENSE SUPPLY CENTER COLUMBUSCOLUMBUS, OHIO 43216-5000REVISION LEVELASHEET7DSCC FORM 2234APR 973.4 Electrical test requirements. The electrical test requirements shall be the subgroups specified in table II. The electricaltests for each subgroup are described in table I.3.5

32、 Marking. Marking shall be in accordance with MIL-PRF-38535, appendix A. The part shall be marked with the PINlisted in 1.2 herein. In addition, the manufacturers PIN may also be marked as listed in MIL-HDBK-103 (see 6.6 herein). Forpackages where marking of the entire SMD PIN number is not feasible

33、 due to space limitations, the manufacturer has theoption of not marking the “5962-“ on the device.3.6 Certificate of compliance. A certificate of compliance shall be required from a manufacturer in order to be listed as anapproved source of supply in MIL-HDBK-103 (see 6.6 herein). The certificate o

34、f compliance submitted to DSCC-VA prior tolisting as an approved source of supply shall affirm that the manufacturers product meets the requirements of MIL-PRF-38535, appendix A and the requirements herein.3.7 Certificate of conformance. A certificate of conformance as required in MIL-PRF-38535, app

35、endix A shall be providedwith each lot of microcircuits delivered to this drawing.3.8 Notification of change. Notification of change to DSCC-VA shall be required in accordance with MIL-PRF-38535,appendix A.3.9 Verification and review. DSCC, DSCCs agent, and the acquiring activity retain the option t

36、o review the manufacturersfacility and applicable required documentation. Offshore documentation shall be made available onshore at the option of thereviewer.4. QUALITY ASSURANCE PROVISIONS4.1 Sampling and inspection. Sampling and inspection procedures shall be in accordance with MIL-PRF-38535,appen

37、dix A.4.2 Screening. Screening shall be in accordance with method 5004 of MIL-STD-883, and shall be conducted on all devicesprior to quality conformance inspection. The following additional criteria shall apply:a. Burn-in test, method 1015 of MIL-STD-883.(1) Test condition A, B, C, or D. The test ci

38、rcuit shall be maintained by the manufacturer under document revisionlevel control and shall be made available to the preparing or acquiring activity upon request. The test circuit shallspecify the inputs, outputs, biases, and power dissipation, as applicable, in accordance with the intent specified

39、 intest method 1015 of MIL-STD-883.(2) TA= +125G71C, minimum.b. Interim and final electrical test parameters shall be as specified in table II herein, except interim electrical parametertests prior to burn-in are optional at the discretion of the manufacturer.4.3 Quality conformance inspection. Qual

40、ity conformance inspection shall be in accordance with method 5005 ofMIL-STD-883 including groups A, B, C, and D inspections. The following additional criteria shall apply.4.3.1 Group A inspection.a. Tests shall be as specified in table II herein.b. Subgroups 4, 5, 6, 7, 8, 9, 10, and 11 in table I,

41、 method 5005 of MIL-STD-883 shall be omitted.Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-STANDARDMICROCIRCUIT DRAWINGSIZEA5962-90507DEFENSE SUPPLY CENTER COLUMBUSCOLUMBUS, OHIO 43216-5000REVISION LEVELASHEET8DSCC FORM 2234APR 97TABLE II. Electric

42、al test requirements.MIL-STD-883 test requirements Subgroups(in accordance withMIL-STD-883, method 5005,table I)Interim electrical parameters(method 5004)1Final electrical test parameters(method 5004)1*,2,3Group A test requirements(method 5005)1,2,3Groups C and D end-pointelectrical parameters(metho

43、d 5005)1* PDA applies to subgroup 1.4.3.2 Groups C and D inspections.a. End-point electrical parameters shall be as specified in table II herein.b. Steady-state life test conditions, method 1005 of MIL-STD-883.(1) Test condition A, B, C, or D. The test circuit shall be maintained by the manufacturer

44、 under document revisionlevel control and shall be made available to the preparing or acquiring activity upon request. The test circuitshall specify the inputs, outputs, biases, and power dissipation, as applicable, in accordance with the intentspecified in test method 1005 of MIL-STD-883.(2) TA = +

45、125G71C, minimum.(3) Test duration: 1,000 hours, except as permitted by method 1005 of MIL-STD-883.5. PACKAGING5.1 Packaging requirements. The requirements for packaging shall be in accordance with MIL-PRF-38535, appendix A.6. NOTES6.1 Intended use. Microcircuits conforming to this drawing are inten

46、ded for use for Government microcircuit applications(original equipment), design applications, and logistics purposes.6.2 Replaceability. Microcircuits covered by this drawing will replace the same generic device covered by acontractor-prepared specification or drawing.6.3 Configuration control of S

47、MDs. All proposed changes to existing SMDs will be coordinated with the users of record forthe individual documents. This coordination will be accomplished in accordance with MIL-STD-973 using DD Form 1692,Engineering Change Proposal.Provided by IHSNot for ResaleNo reproduction or networking permitt

48、ed without license from IHS-,-,-STANDARDMICROCIRCUIT DRAWINGSIZEA5962-90507DEFENSE SUPPLY CENTER COLUMBUSCOLUMBUS, OHIO 43216-5000REVISION LEVELASHEET9DSCC FORM 2234APR 976.4 Record of users. Military and industrial users shall inform Defense Supply Center Columbus when a system applicationrequires configuration control and the applicable SMD. DSCC will maintain a record of users and this list will be used forcoordination and distribution of changes to the drawings. Users of drawings covering mi