DLA SMD-5962-90504 REV C-1997 MICROCIRCUIT DIGITAL CMOS BINARY FILTER AND TEMPLATE MATCHER MONOLITHIC SILICON《硅单片 二元滤波器及模板匹配器 氧化物半导体数字微型电路》.pdf

《DLA SMD-5962-90504 REV C-1997 MICROCIRCUIT DIGITAL CMOS BINARY FILTER AND TEMPLATE MATCHER MONOLITHIC SILICON《硅单片 二元滤波器及模板匹配器 氧化物半导体数字微型电路》.pdf》由会员分享，可在线阅读，更多相关《DLA SMD-5962-90504 REV C-1997 MICROCIRCUIT DIGITAL CMOS BINARY FILTER AND TEMPLATE MATCHER MONOLITHIC SILICON《硅单片 二元滤波器及模板匹配器 氧化物半导体数字微型电路》.pdf（27页珍藏版）》请在麦多课文档分享上搜索。

1、DEFENSE LOGISTICS AGENCY DEFENSE SUPPLY CENTER COLUMBUS 3990 EAST BROAD STREET COLUMBUS, OH 4321 6-5000 IN REPLY REFER TO: DSCC-VAC (Mr. Gauder/(DSN)850-0545/6 14-692-0545) SUBJECT: Notice of Revision (NOR) 5962-R30 1-97 for Standard Microcircuit Drawing (SMD) 5962-90504 Militaryhdustry Distribution

2、 The enclosed NOR is approved for use effective as of the date of the NOR. In accordance with MIL-STD-100 SMD holders should, as a minimum, handwrite those changes described in the NOR to sheet 1 of the subject SMD. After completion, the NOR should be attached to the subject SMD for future reference

3、. Those companies who were listed as approved sources of supply prior to this action have agreed to actions taken on devices for which they had previously provided DSCC a certificate of compliance. This is evidenced by an existing active current certificate of compliance on file at DSCC with a DSCC

4、record of verbal coordination. The certificate of compliance for these devices is considered concurrence with the new revision unless DSCC is otherwise notified. DSCC has received and accepted a certificate of compliance from Logic Devices, cage code 65896 for PINS 5962-9050401MXC, 5962-9050401MXA,

5、5962-9050402MXC and 5962-9050402MXA vendor similar part numbers L64230FMB75, L64230FMB75, L64230FMB60, and L64230FMB60 respectively. This action will be reflected in the next revision of MIL-HDBK-103. If you have comments or questions, please contact Larry T. Gauder at (DSN)850-0545/(614)692-0545. 1

6、 Encl / p MONICA L. POELKING / Chief, Custom Microelectroncs Team Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,- SMD-5962-90504 REV C m 999b OLL5719 491 m t 1 E 1. DATE (YYMMDD) Form Approved 97-05-1 9 OMB NO. 0704-0188 NOTICE OF REVISION (NOR) THI

7、S REVISION DESCRIBED BELOW HAS BEEN AUTHORIZED FOR THE DOCUMENT LISTED. Public reporbng burden for this collection is estimated to average 2 hours per response including the time for rewewin instrucons searchin existing data ACTIVITY NO sources, gaihenn and maintaining the data needed and completing

8、 and reviewing the collection of infonation Sen8comments rigarding 511s burden estimate or an oker as ect of this collection of infomation including su gestions for reduung this burden to Depariment of Defense Washin bon Headquarien 6ewces 6irectorate for Information Operations and Repois 1215 Jeffe

9、rson Daws Hi hway: Suite 1204, Arlington. VA22202dO2. and to the Gfce of Mana ement and Bud el Pa erwork Reducon Proled 07C401d Washin ton DC 20583 ISSUING CONTRACTING OFFICER FOR THE CONTRACT/ PROCURING ACTIVITY NUMBER LISTED IN ITEM 2 OF THIS FORM PLUSE DO AT RETURN vdu CMPLETED FORM TO EITLER OF

10、TSE ADBRESSED RETURN COMPLETED FORM TO THE GOVERNMENT I I 9. TITLE OF DOCUMENT MICROCIRCUIT, DIGITAL, CMOS, BINARY FILTER AND TEMPLATE MATCHER, MONOLITHIC SILICON IO. REVISION LElTER a. CURRENT b. NEW B C b. ADDRESS (Street, City, State, Zip Code) 4. ORIGINATOR a. TYPED NAME (First, Middle Initial,

11、Defense Supply Center Columbus 3990 East Broad Street Columbus, OH 43216-5000 Last) 11. ECP NO. 5962-R301-97 5962-90504 67268 b. ACTIVITY AUTHORIZED TO APPROVE CHANGE FOR GOVERNMENT c. TYPED NAME (First, Middle Initial, Last) I DSCC-VAC I Monica L. Poelking i 12. CONFIGURATION ITEM (OR SYSTEM) TO WH

12、ICH ECP APPLIES I All X a. (Xone) 13. DESCRIPTION OF REVISION Sheet 1: Revisions ltr colm; add ilC1i. Revisions description colm; add Thanges in accordance with NOR 5962-R301-97“. Revisions date colm; add 1197-05-191i. Revision level block; add ITii. Rev status of sheets; for sheet 1, 6, and 9 add I

13、iCli. (I) Existing document supplemented by the NOR may be used in manufacture. (2) Revised document must be received before manufacturer may incorporate this change. (3) Custodian of master document shall make above revision and furnish revised document. Sheet 6: TABLE I. Test colm 10s test, change

14、 as follous: IOutput short circuit current TABLE I. 10s test, Change for VO = 5.5 V, MAX limit from Il130 mAal to Il200 mAIi. Revision Level block; add liCii 10s test, Change for VO = 0.0 V, MAX limit from li-10O mA1I to ii-180 mAii. Sheet 9: TABLE I, add the following footnote; 116/ These parameter

15、s are guaranteed but not tested.“ Revision levei block; add ilC1l d. TITLE Chief, Custom Microelectronics 15a. ACTIVITY ACCOMPLISHING REVISION DSCC-VAC e. SIGNATURE f. DATE SIGNED (YYMMDD) Monica L. Poelking 97-05-1 9 b. REVISION COMPLETED (Signature) c. DATE SIGNED (YYMMDD) Larry T. Gauder 97-05-1

16、9 Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-= b 0053bL9 TT5 DEFENSE LGiStiCS AGENCY DEFENSE ELECTRONICS SUPPLY CENTER 1507 WILMINGTON PIKE DAYTON, OH 45444-5765 H REPLY REFER TD DESC-ELDC (Mr. Hess/(AV 986) 513-296-8526/tmh) - . 02 MAR 1994 SUB

17、JECT: Notice of Revision (NOR) 5962-R114-94 for Standardized Military Drawing (SMD) 5962-90504. Military/Industry Distribution The enclosed NOR is approved for use effective as of the date of the NOR. In accordance with MIL-STD-100 SMD holders should, as a minimum, handwrite those changes described

18、in the NOR to sheet 1 of the subject SMD. After completion, the NOR should be attached to the subject SMD for future reference. Those companies who were listed as approved sources of supply prior to this action have agreed to actions taken on devices for which they had previously provided DESC a cer

19、tificate of compliance. This is evidenced by an existing active current certificate of compliance on file at DESC along with a DESC record of verbal coordination. The certificate of compliance for these devices is considered concurrence with the new revision unless DESC is otherwise notified. If you

20、 have comments or questions, please contact Tom Hess at (AV)986-8526 /(513)296-8526. 1 Encl MONICA L. POELKING di add I1B8*. Revisions description colurn; add IlChanges in accordance with NOR 5962-R114-9411. Revisions date colum; add 1f94-02-0911. Revision level block; add ilii. Rev status of sheets

21、; For sheets 1, 3, 11 add 1811. Change paragraph 1.2.4 from: Y Sheet 3: C-G7 (132-pin, .96011 x .960“ x .14011), ceramic Leaded chip carrier e. SIGNATURE f. DATE SIGNED ( YY MMDD ) Monica L. Poelking 94-02-09 c. DATE SIGNED (YYMMDD) b. REVISION COMPLETED (Signature) Thomas M. Hess 94-02- 09 to: Y C-

22、G7 (132-pin, .96W x .96O8I x .14011), ceramic leaded chip carrier, product supplied to thio package conform to MIL-STD-1835 with the following exception, pin 1 location begins at the center a/ of the package instead of the corner as designated in MIL-STD-1835. Provided by IHSNot for ResaleNo reprodu

23、ction or networking permitted without license from IHS-,-,-I 4 NOTICE OF REVISION (NOR) (See MIL-STD-480 for instructions) This revision described below has been authorized for the document listed. D b 0053671 b53 D DATE (WIIIDD) Form Approved OM6 NO. 0704-0188 93-03-05 2. c add “A“. Revisions descr

24、iption column; add “Changes in accordance uith NOR 5962-R094-93“. Revisions date column; add “93-03-05“. Revision level block; add “A“. Rev status of sheets; For sheets 1, 6, 9 and 16, add “A“. Table I: Add footnote o/ reference to IDD under symbol column (i.e., IDD Add footnote e/ at end of table a

25、s follows: Il$/ Guranteed by design but not tested.“ Sheet 6: Sheet 9: e/). Sheet 16: Change paragraph 4.4.1 from “c. Subgroup 4 (GIN and Cg measurements) shall be measured only for the initial test and after process or design changes which may affect capacitance. input and all output terminals test

26、ed.“ Sample size is 15 devices with no failures, and all to “c. Subgroup 4 (C and Co measurements) shall be measured on each input/output representative buffer types, and only for the initial test and after process or design changes which may affect capacitance. A minimum sample size of 5 devices wi

27、th zero rejects shall be required.“ 11. THIS SECTION FOR GOVEWIIENT USE MLY a. CHECK ONE XIEXISTING DOCUMENT SUPPLEMENTED I REVISED DOCUMENT MUST BE 1 CUSTODIAN OF MASTER DOCUMENT BY THIS NOR MAY BE USED IN MANUFACTURE. b. ACTIVITY AUTHORIZED TO APPROVE CHANGE FOR GOVERNMENT DE S C - E C C 12. ACTIV

28、ITY ACCOIIPLISHIffi REVISIN DESC-ECC Form 1695m 88 Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-M 9999996 0053b72 59T M LTR DESCRIPTION DATE (YR-RO-DA) APPROVED SHEET 18 19 20 SHEET 15 16 17 21 REV STATUS OF SHEETS 4 5 6 7 8 PMIC NIA 9 10 11 12 13

29、 14 STANDARDIZED MILITARY DRAWING THIS DRAUING IS AVAILABLE FOR USE BY ALL DEPARTMENTS AND AGENCIES OF THE DEPARTMENT OF DEFENSE AMSC NIA DESC FORM 193 SHEET 123 PREPAR D Y * distribution is unlimited. 5962-E1581 Provided by IHSNot for ResaleNo reproduction or networking permitted without license fr

30、om IHS-,-,-9b 0053b73 42b STANDARD1 ZED SIZE HILITARY DRAWING a DEFENSE ELECTRONICS SUPPLY CETER DAPTON, OHIO 45444 1. SCOPE 1.7 m. This drawing forms a part of a one part - one part number documentation system (see 6.6 herein). Two product assurance classes consisting of military high reliability (

31、device classes 8, Q, and M) and space application (device classes s and V), and a choice of case outlines and lead finishes are available and are reflected in the Part Dr Identifying Number (PIN). Device class M microcircuits represent non-JAN class B microcircuits in accordance with 1.2.1 of MIL-ST

32、D-, “Provisions for the use of MIL-STD-883 in conjunction with corpliant non-JAW devices”. available, a choice of redietion hardness assurance (RHA) levels are reflected in the PIN. Uhen 1.2 m. The PIN shall be as shown in the following example: 5962-90504 REVISION LEVEL SHEET 2 o1 I I 5962 9o5fx -

33、l I I I M I I X X I I I l Lead I Case L Devi ce Devi ce i RHA i Federal stock class designator tYp+ class outline finish designator (See 1.2.1) (See 1.2.2) designator (See 1.2.4) (See 1.2.5) I (See 1.2.3) I Drawing number 1.2.1 Radiation hardness assurance (RHA) designator. Device classes Il, 8, and

34、 S RHA marked devices shall mt the Device classes Q and V RHA n1-H-38510 specified RHA levels and shall be marked with the appropriate RHA designator. aarked devices shall meet the MIL-1-38535 specified RHA levels and shall be marked with the appropriate RHA designator. A dash (-1 indicates a non-RH

35、A device. 1.2.2 Device typds). The device type(s) shall identify the circuit function as follows: Devi ce type Generic number Circuit function o1 L64230-12 o2 L43-16 1024 tap binary correlator and template aatcher (12 MHz) 1024 tap binary correlator and template matcher (16 MHz) 1.2.3 Device class d

36、esianator. The device class designator shall be a single letter identifying the product assurance level as follows: Device class Device requirements docmentation n Vendor self-certification to the rquirmnts for m-JAN class B microcircuits in accordance with 1.2.1 of MIL-STD-883 B or S Q or V Certifi

37、cation and qualification to MIL-M-38510 Certification and qualification to MIL-1-38535 Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-1.2.4 Case outline(s). For device classes M, B, and S, case outline(s) shall meet the rquirmnts in appendix C Of MI

38、L-H-38510 and as listed belou. MIL-1-38535, appendix C of MIL-M-38510, and as listed belov. For device classes Q and Y, case outline(s) shall wet the require-ts Of Outline letter Case outline X Y P-AH (ISS-pin, 1.680 x 1.68D“ x.345“), pin grid package C-G7 (132-pin, -960“ x .VIM“ x .140“), ceramic l

39、eaded chip carrier 1.2.5 Lead finish. The lead finish shall be as specified in MIL-H-38510 for classes M, 6, and S or MIL-1-38535 for classes Q and V. Finish letter for use in specifications when lead finishes A, B, and C are considered acceptable and interchagcsble Withwt shall not be- marked on th

40、e microcircuit or its packaging. lhe “X“ designation is preference. 1.3 Absolute maxinuni ratinus. I/ DE supply voltage Input voltage A e.g., Ias. Extcndcd I I 5962-90504 STANDARDIZED MILITARY DRAWING DEFENSE ELECTRONICS SUPPLY CENTER DAYTO, OHIO 45444 I I I DESC FORM 193A JUL 91 Provided by IHSNot

41、for ResaleNo reproduction or networking permitted without license from IHS-,-,-9999996 0053675 2T STANDARD1 ZED HILITARY DRAWING DEFENSE ELECTRONICS SUPPLY CETER DAYTON, OHIO 45444 DESC FORM 193A JUL 91 SIZE 5962-90504 A REVISION LEVEL SHEET Ir 2. APPLICABLE DOCUHENTS 2.1 toverment specifications, s

42、tandards, bulletin, and hwidbook. Unless otherwise specified, the following rpcifications, standards, bulletin, and handbook of the issue listed in that issue of the Department of Defense Index of Specifications and Standards specified in the solicitation, form a part of this drawing to the extent s

43、pecified herein. SPECIFICATIONS HILITARY HIL-H-38510 HlL- 1-38535 - STANDARDS HILITARY HJL-STD-W - HIL-STD-883 - BULLETIN HILITARY MIL-BUL-103 - HANDBaOK HILITARY NIL-HDBK-780 - Microcircuits, General Specification for. Integrated Circuits, Hanufacturing, General Specificstion for. Configuration Con

44、trol-Engineering Changes, Deviatiars and Waivers. Test nethods and Procedures for flicroelectronics. List of Standardized Hilitary Drawings (MOS). Standardized Hi litsry Drawings. (Copies of the specifications, standard!, bulletin, and handbook required by manufacturers in connection with specific a

45、cquisition functions should be obtained frw the contracting activity or as directed by the contracting activity.) 2.2 Order of precedence. In the event of a conflict between the text of this drawing an the references cited herein, the text of this drawing shall take precedence. 3. REQUIREMENTS 3.1 T

46、he individual it= requirements for device class I4 shall be in accordance with 1.2.1 of HIL-STD-883, “Provisions for the use of NIL-STD-883 in conjunction with COIpliant non-JAN devices“ and as specified herein. The individual it- requirements for device classes B and S shall be in accordance with H

47、IL-H-38510 and as specified herein. included in this SHD. HIL-1-38535, the device manufacturers Quality HaMgement (Pn) plan, and as specified herein. Item rcouirmnts. For device classes B and S, a full electrical chmracteririrtion table for each device type shall be The individual item requirements

48、for device classes Q and V shall be in accordance with 3.2 Desian. construction. and physical dimensions. The design, construction, and physical dimensions shall be as specified in MIL-il-38510 for device classea H, B, and S and HIL-1-38535 for device classes and V and herein. 3.2.1 Case outline(s).

49、 The case outlinds) shall be in accordance with 1.2.4. Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-9999936 0053bb 135 STANDARIZED SIZE MLITARY DRAWING A DEFENSE ELECTRONICS SUPPLY CENTER DAYTON, OHIO 45444 REVISION LEVEL 3.2-2 Terha1 connections. 3.2.3 Block and hic dimrams. 3.2.4 Radiation exDosure circuit. 3