DLA SMD-5962-87535 REV F-2008 MICROCIRCUIT HYBRID LINEAR DUAL REDUNDANT REMOTE TERMINAL UNIT (RTU)《远程终端设备(RTU)双冗余线性混合微电路》.pdf
《DLA SMD-5962-87535 REV F-2008 MICROCIRCUIT HYBRID LINEAR DUAL REDUNDANT REMOTE TERMINAL UNIT (RTU)《远程终端设备(RTU)双冗余线性混合微电路》.pdf》由会员分享,可在线阅读,更多相关《DLA SMD-5962-87535 REV F-2008 MICROCIRCUIT HYBRID LINEAR DUAL REDUNDANT REMOTE TERMINAL UNIT (RTU)《远程终端设备(RTU)双冗余线性混合微电路》.pdf(20页珍藏版)》请在麦多课文档分享上搜索。
1、 REVISIONS LTR DESCRIPTION DATE (YR-MO-DA) APPROVED A Page 5, table I: change test condition for IILtest. Pages 13 through 19, table III: change functions and descriptions for pins 25, 32, 38, 39, 56, 60, 62, and 74. Editorial changes throughout. 88-04-07 W. Heckman B Add device 02. Add vendor CAGE
2、88379. Add case outline Y (flat package). Editorial changes throughout. Changes reflect MIL-H-38534 processing. 90-04-13 W. Heckman C Made technical changes to table I. Add case outline Z (flat package). Editorial changes throughout. 92-02-18 G. A. Lude D Added device type 03. Figure 1; Made correct
3、ions to the height dimensions for case outlines Y and Z. Added Figure 2; Terminal connections table. Redrew entire document. -sld. 00-01-31 Raymond Monnin E Updated drawing to latest format. Changed the SMD Bulletin page to show the correct vendor similar pin for the device type 02. Added footnote f
4、or device type 01 in the SMD Bulletin that this device is no longer available. -sld 02-12-16 Raymond Monnin F Updated drawing. -gz 08-04-09 Robert M. Heber THE ORIGINAL FIRST SHEET OF THIS DRAWING HAS BEEN REPLACED REV SHEET REV F F F F F SHEET 15 16 17 18 19 REV STATUS REV F F F F F F F F F F F F F
5、 F OF SHEETS SHEET 1 2 3 4 5 6 7 8 9 10 11 12 13 14 PMIC N/A PREPARED BY Donald R. Osborne STANDARD MICROCIRCUIT DRAWING CHECKED BY D. A. DiCenzo DEFENSE SUPPLY CENTER COLUMBUS COLUMBUS, OHIO 43218-3990 http:/www.dscc.dla.mil THIS DRAWING IS AVAILABLE FOR USE BY ALL DEPARTMENTS APPROVED BY N. A. Hau
6、ck MICROCIRCUIT, HYBRID, LINEAR, DUAL REDUNDANT, REMOTE TERMINAL UNIT (RTU) AND AGENCIES OF THE DEPARTMENT OF DEFENSE DRAWING APPROVAL DATE 87-08-06 AMSC N/A REVISION LEVEL F SIZE A CAGE CODE 67268 5962-87535 SHEET 1 OF 19 DSCC FORM 2233 APR 97 5962-E236-08 Provided by IHSNot for ResaleNo reproducti
7、on or networking permitted without license from IHS-,-,-STANDARD MICROCIRCUIT DRAWING SIZE A 5962-87535 DEFENSE SUPPLY CENTER COLUMBUS COLUMBUS, OHIO 43218-3990 REVISION LEVEL F SHEET 2 DSCC FORM 2234 APR 97 1. SCOPE 1.1 Scope. This drawing describes device requirements for class H hybrid microcircu
8、its to be processed in accordance with MIL-PRF-38534 and a choice of case outlines and lead finishes are available and are reflected in the Part or Identifying Number (PIN). 1.2 PIN. The PIN shall be as shown in the following example: 5962-87535 01 X X Drawing number Device type Case outline Lead fi
9、nish (see 1.2.1) (see 1.2.2) (see 1.2.3) 1.2.1 Device type(s). The device type(s) identify the circuit function as follows: Device type Generic number Circuit function 01 BUS-65112 Dual redundant remote terminal (RTU) 02 2452 Dual redundant remote terminal (RTU) 03 CT2512 Dual redundant remote termi
10、nal (RTU) 1.2.2 Case outline(s). The case outline(s) are as designated in MIL-STD-1835 and as follows: Outline letter Descriptive designator Terminals Package style X See figure 1 78 Hybrid package Y See figure 1 82 Flat package Z See figure 1 82 Flat package 1.2.3 Lead finish. The lead finish shall
11、 be as specified in MIL-PRF-38534. 1.3 Absolute maximum ratings. 1/ Logic Supply voltage (VL). 5.5 V dc Positive supply voltage (VCC) . 18.0 V dc Negative supply voltage (VEE) -18.0 V dc Storage temperature range -65C to +150C Thermal rise, case to junction (TJ) . 13.9C Lead soldering temperature (1
12、0 seconds) . +300C Power dissipation (TC= +125C) Duty cycle dependent (see table I power supplies) 1.4 Recommended operating conditions. Logic Supply voltage range (VL). +4.5 V dc to +5.5 V dc Positive supply voltage range (VCC) . +14.25 V dc to +15.75 V dc Negative supply voltage (VEE) -14.25 V dc
13、to -15.75 V dc Case operating temperature range (TC). -55C to +125C Maximum differential input voltage. 40 Vp-p 1/ Stresses above the absolute maximum ratings may cause permanent damage to the device. Extended operation at the maximum levels may degrade performance and affect reliability. Provided b
14、y IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-STANDARD MICROCIRCUIT DRAWING SIZE A 5962-87535 DEFENSE SUPPLY CENTER COLUMBUS COLUMBUS, OHIO 43218-3990 REVISION LEVEL F SHEET 3 DSCC FORM 2234 APR 97 2. APPLICABLE DOCUMENTS 2.1 Government specification, standa
15、rds, and handbooks. The following specification, standards, and handbooks form a part of this drawing to the extent specified herein. Unless otherwise specified, the issues of these documents are those cited in the solicitation or contract. DEPARTMENT OF DEFENSE SPECIFICATION MIL-PRF-38534 - Hybrid
16、Microcircuits, General Specification for. DEPARTMENT OF DEFENSE STANDARDS MIL-STD-883 - Test Method Standard Microcircuits. MIL-STD-1553 - Interface Standard for Digital Time Division Command/Response Multiplex Data Bus. MIL-STD-1835 - Interface Standard for Electronic Component Case Outlines. DEPAR
17、TMENT OF DEFENSE HANDBOOKS MIL-HDBK-103 - List of Standard Microcircuit Drawings. MIL-HDBK-780 - Standard Microcircuit Drawings. (Copies of these documents are available online at http:/assist.daps.dla.mil/quicksearch/ or http:/assist.daps.dla.mil or from the Standardization Document Order Desk, 700
18、 Robbins Avenue, Building 4D, Philadelphia, PA 19111-5094.) 2.2 Order of precedence. In the event of a conflict between the text of this drawing and the references cited herein, the text of this drawing takes precedence. Nothing in this document, however, supersedes applicable laws and regulations u
19、nless a specific exemption has been obtained. 3. REQUIREMENTS 3.1 Item requirements. The individual item performance requirements for device class H shall be in accordance with MIL-PRF-38534. Compliance with MIL-PRF-38534 may include the performance of all tests herein or as designated in the device
20、 manufacturers Quality Management (QM) plan or as designated for the applicable device class. The manufacturer may eliminate, modify or optimize the tests and inspections herein, however the performance requirements as defined in MIL-PRF-38534 shall be met for the applicable device class. In additio
21、n, the modification in the QM plan shall not affect the form, fit, or function of the device for the applicable device class. 3.2 Design, construction, and physical dimensions. The design, construction, and physical dimensions shall be as specified in MIL-PRF-38534 and herein. 3.2.1 Case outline(s).
22、 The case outline(s) shall be in accordance with 1.2.2 herein and figure 1. 3.2.2 Terminal connections. The terminal connections shall be as specified on figure 2. 3.2.3 Block diagram. The block diagram shall be as specified on figure 3. 3.2.4 Pin functions. Pin functions shall be as specified in ta
23、ble III. 3.3 Electrical performance characteristics. Unless otherwise specified herein, the electrical performance characteristics are as specified in table I and shall apply over the full specified operating temperature range. 3.4 Electrical test requirements. The electrical test requirements shall
24、 be the subgroups specified in table II. The electrical tests for each subgroup are defined in table I. Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-STANDARD MICROCIRCUIT DRAWING SIZE A 5962-87535 DEFENSE SUPPLY CENTER COLUMBUS COLUMBUS, OHIO 4321
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