DLA SMD-5962-86842 REV F-2013 MICROCIRCUIT DIGITAL ADVANCED LOWPOWER SCHOTTKY TTL AND GATE MONOLITHIC SILICON.pdf
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1、 REVISIONS LTR DESCRIPTION DATE (YR-MO-DA) APPROVED A Change Table I, footnotes, tPLH, tPHL. Add figure 3. Editorial changes throughout. 88-04-04 M. A. Frye B Changes in accordance with NOR 5962-R201-92. -tvn 95-05-11 Tim Noh C Add “C” case. Revise per current boilerplate. -ljs 98-01-22 Raymond Monn
2、in D Update to current requirements. Editorial changes throughout. - gap 06-01-20 Raymond Monnin E Add device class V for case outline C. Editorial changes throughout. - gap 06-11-02 Raymond Monnin F Update drawing to current MIL-PRF-38535 requirements. - jt 13-02-27 C. SAFFLE THE ORIGINAL FIRST SHE
3、ET OF THIS DRAWING HAS BEEN REPLACED. REV SHEET REV SHEET REV STATUS REV F F F F F F F F F F OF SHEETS SHEET 1 2 3 4 5 6 7 8 9 10 PMIC N/A PREPARED BY Monica L. Poelking DLA LAND AND MARITIME COLUMBUS, OHIO 43218-3990 http:/www.landandmaritime.dla.mil STANDARD MICROCIRCUIT DRAWING THIS DRAWING IS AV
4、AILABLE FOR USE BY ALL DEPARTMENTS AND AGENCIES OF THE DEPARTMENT OF DEFENSE CHECKED BY Raymond Monnin APPROVED BY Michael A. Frye MICROCIRCUIT, DIGITAL, ADVANCED LOW-POWER SCHOTTKY TTL, AND GATE, MONOLITHIC SILICON DRAWING APPROVAL DATE 87-08-19 AMSC N/A REVISION LEVEL F SIZE A CAGE CODE 67268 5962
5、-86842 SHEET 1 OF 10 DSCC FORM 2233 APR 97 5962-E077-13 Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-STANDARD MICROCIRCUIT DRAWING SIZE A 5962-86842 DLA LAND AND MARITIME COLUMBUS, OHIO 43218-3990 REVISION LEVEL F SHEET 2 DSCC FORM 2234 APR 97 1.
6、SCOPE 1.1 Scope. This drawing documents two product assurance class levels consisting of high reliability (device classes Q and M) and space application (device class V). A choice of case outlines and lead finishes are available and are reflected in the Part or Identifying Number (PIN). When availab
7、le, a choice of Radiation Hardness Assurance (RHA) levels is reflected in the PIN. 1.2 PIN. The PIN is as shown in the following examples. For device classes M and Q: 5962 - 86842 01 C A Federal stock class designator RHA designator (see 1.2.1) Device type (see 1.2.2) Case outline (see 1.2.4) Lead f
8、inish (see 1.2.5) / / Drawing number For device class V: 5962 - 86842 01 V C A Federal stock class designator RHA designator (see 1.2.1) Device type (see 1.2.2) Device class designator Case outline (see 1.2.4) Lead finish (see 1.2.5) / (see 1.2.3) / Drawing number 1.2.1 RHA designator. Device classe
9、s Q and V RHA marked devices meet the MIL-PRF-38535 specified RHA levels and are marked with the appropriate RHA designator. Device class M RHA marked devices meet the MIL-PRF-38535, appendix A specified RHA levels and are marked with the appropriate RHA designator. A dash (-) indicates a non-RHA de
10、vice. 1.2.2 Device type. The device type identify the circuit function as follows: Device type Generic number Circuit function 01 54ALS08 Quadruple two-input positive AND gate 1.2.3 Device class designator. The device class designator is a single letter identifying the product assurance level as lis
11、ted below. Since the device class designator has been added after the original issuance of this drawing, device classes M and Q designators will not be included in the PIN and will not be marked on the device. Device class Device requirements documentation M Vendor self-certification to the requirem
12、ents for MIL-STD-883 compliant, non-JAN class level B microcircuits in accordance with MIL-PRF-38535, appendix A Q or V Certification and qualification to MIL-PRF-38535 Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-STANDARD MICROCIRCUIT DRAWING SIZ
13、E A 5962-86842 DLA LAND AND MARITIME COLUMBUS, OHIO 43218-3990 REVISION LEVEL F SHEET 3 DSCC FORM 2234 APR 97 1.2.4 Case outlines. The case outlines are as designated in MIL-STD-1835 and as follows: Outline letter Descriptive designator Terminals Package style C GDIP1-T14 or CDIP2-T14 14 Dual-in-lin
14、e D GDFP1-F14 or CDFP2-F14 14 Flat package 2 CQCC1-N20 20 Square chip carrier 1.2.5 Lead finish. The lead finish is as specified in MIL-PRF-38535 for device classes Q and V or MIL-PRF-38535, appendix A for device class M. 1.3 Absolute maximum ratings. 1/ Supply voltage range (VCC) -0.5 V dc minimum
15、to 7.0 V dc maximum Input voltage range (VI) -1.5 V dc at -18 mA to 7.0 V dc Storage temperature range -65C to +150C Maximum power dissipation (PD) per device 2/ 22 mW Lead temperature (soldering, 10 seconds) . +300C Thermal resistance, junction-to-case (JC) . See MIL-STD 1835 Junction temperature (
16、TJ) . 175C Operating free-air temperature range . -55C to +125C 1.4 Recommended operating conditions. Supply voltage range (VCC) +4.5 V dc minimum to +5.5 V dc maximum Minimum high level input voltage (VIH) . +2.0 V Maximum low level input voltage (VIL) TC= +125C 0.7 V dc TC= -55C . 0.8 V dc TC= +25
17、C 0.8 V dc Case operating temperature range (TC) . -55C to +125C 2. APPLICABLE DOCUMENTS 2.1 Government specification, standards, and handbooks. The following specification, standards, and handbooks form a part of this drawing to the extent specified herein. Unless otherwise specified, the issues of
18、 these documents are those cited in the solicitation or contract. DEPARTMENT OF DEFENSE SPECIFICATION MIL-PRF-38535 - Integrated Circuits, Manufacturing, General Specification for. DEPARTMENT OF DEFENSE STANDARDS MIL-STD-883 - Test Method Standard Microcircuits. MIL-STD-1835 - Interface Standard Ele
19、ctronic Component Case Outlines. DEPARTMENT OF DEFENSE HANDBOOKS MIL-HDBK-103 - List of Standard Microcircuit Drawings. MIL-HDBK-780 - Standard Microcircuit Drawings. (Copies of these documents are available online at https:/assist.dla.mil/quicksearch/ or from the Standardization Document Order Desk
20、, 700 Robbins Avenue, Building 4D, Philadelphia, PA 19111-5094.) _ 1/ Stresses above the absolute maximum rating may cause permanent damage to the device. Extended operation at the maximum levels may degrade performance and affect reliability. 2/ Maximum power dissipation is defined as VCCx ICC, and
21、 must withstand the added PDdue to short circuit test; e.g., IOS. Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-STANDARD MICROCIRCUIT DRAWING SIZE A 5962-86842 DLA LAND AND MARITIME COLUMBUS, OHIO 43218-3990 REVISION LEVEL F SHEET 4 DSCC FORM 2234
22、APR 97 2.2 Order of precedence. In the event of a conflict between the text of this drawing and the references cited herein, the text of this drawing takes precedence. Nothing in this document, however, supersedes applicable laws and regulations unless a specific exemption has been obtained. 3. REQU
23、IREMENTS 3.1 Item requirements. The individual item requirements for device classes Q and V shall be in accordance with MIL-PRF-38535 and as specified herein or as modified in the device manufacturers Quality Management (QM) plan. The modification in the QM plan shall not affect the form, fit, or fu
24、nction as described herein. The individual item requirements for device class M shall be in accordance with MIL-PRF-38535, appendix A for non-JAN class level B devices and as specified herein. 3.2 Design, construction, and physical dimensions. The design, construction, and physical dimensions shall
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