DLA SMD-5962-86841 REV D-2006 MICROCIRCUIT DIGITAL BIPOLAR ADVANCED LOW POWER SCHOTTKY TTL AND GATES MONOLITHIC SILICON《硅单块 和门高级低功率肖脱基晶体管-晶体管逻辑电路或门 双极数字微型电路》.pdf

《DLA SMD-5962-86841 REV D-2006 MICROCIRCUIT DIGITAL BIPOLAR ADVANCED LOW POWER SCHOTTKY TTL AND GATES MONOLITHIC SILICON《硅单块 和门高级低功率肖脱基晶体管-晶体管逻辑电路或门 双极数字微型电路》.pdf》由会员分享，可在线阅读，更多相关《DLA SMD-5962-86841 REV D-2006 MICROCIRCUIT DIGITAL BIPOLAR ADVANCED LOW POWER SCHOTTKY TTL AND GATES MONOLITHIC SILICON《硅单块 和门高级低功率肖脱基晶体管-晶体管逻辑电路或门 双极数字微型电路》.pdf（11页珍藏版）》请在麦多课文档分享上搜索。

1、 REVISIONS LTR DESCRIPTION DATE (YR-MO-DA) APPROVED A Table I, change tPLHand footnotes. Add Figure 3. Editorial changes throughout. 88-04-18 M. A. Fyre B Changes IAW NOR 5962-R340-92. -tvn 92-10-05 Monica L. Poelking C Add “C” case. Revise per new boilerplate. Editorial changes throughout. -les 98-

2、01-21 Raymond Monnin D Update to current requirements. Editorial changes throughout. gap 06-01-18 Raymond Monnin The original first page of this drawing has been replaced. REV SHET REV SHET REV STATUS REV D D D D D D D D D D OF SHEETS SHEET 1 2 3 4 5 6 7 8 9 10 PMIC N/A PREPARED BY Monica L. Poelkin

3、g DEFENSE SUPPLY CENTER COLUMBUS STANDARD MICROCIRCUIT DRAWING CHECKED BY Raymond Monnin COLUMBUS, OHIO 43218-3990 http:/www.dscc.dla.mil THIS DRAWING IS AVAILABLE FOR USE BY ALL DEPARTMENTS APPROVED BY Michael A. Frye MICROCIRCUIT, DIGITAL, BIPOLAR, ADVANCED LOW POWER SCHOTTKY TTL, AND GATES, AND A

4、GENCIES OF THE DEPARTMENT OF DEFENSE DRAWING APPROVAL DATE 87-08-13 MONOLITHIC SILICON AMSC N/A REVISION LEVEL D SIZE A CAGE CODE 67268 5962-86841 SHEET 1 OF 10 DSCC FORM 2233 APR 97 5962-E137-06 Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-STANDA

5、RD MICROCIRCUIT DRAWING SIZE A 5962-86841 DEFENSE SUPPLY CENTER COLUMBUS COLUMBUS, OHIO 43218-3990 REVISION LEVEL D SHEET 2 DSCC FORM 2234 APR 97 1. SCOPE 1.1 Scope. This drawing describes device requirements for MIL-STD-883 compliant, non-JAN class level B microcircuits in accordance with MIL-PRF-3

6、8535, appendix A. 1.2 Part or Identifying Number (PIN). The complete PIN is as shown in the following example: 5962-86841 01 C X Drawing number Device type (see 1.2.1) Case outline(see 1.2.2) Lead finish(see 1.2.3)1.2.1 Device type(s). The device type(s) identify the circuit function as follows: Dev

7、ice type Generic number Circuit function 01 54ALS11A Triple, 3-input positive AND gates 1.2.2 Case outline(s). The case outline(s) are as designated in MIL-STD-1835 and as follows: Outline letter Descriptive designator Terminals Package style C GDIP1-T14 or CDIP2-T14 14 Dual-in-line D GDFP1-F14 or C

8、DFP2-F14 14 Flat package 2 CQCC1-N20 20 Square chip carrier 1.2.3 Lead finish. The lead finish is as specified in MIL-PRF-38535, appendix A. 1.3 Absolute maximum ratings. Supply voltage range . -0.5 V dc minimum to 7.0 V dc maximum Input voltage range -1.5 V dc at -18 mA to 7.0 V dc Storage temperat

9、ure range -65C to +150C Maximum power dissipation (PD) 1/ 16.5 mW Lead temperature (soldering, 10 seconds) +300C Thermal resistance, junction-to-case (JC) . See MIL-STD-1835 Junction temperature (TJ) +175C 1.4 Recommended operating conditions. Supply voltage range (VCC) . +4.5 V dc minimum to +5.5 V

10、 dc maximum Minimum high level input voltage (VIH) . 2.0 V dc Maximum low level input voltage (VIL): TC= +125C . 0.7 V dc C= -55C 0.8 V dc TC= +25C . 0.8 V dc Case operating temperature range (TC) . -55C to +125C _ 1/ Maximum power dissipation is defined as VCCx ICC, and must withstand the added PDd

11、ue to short circuit test, e.g., IO. Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-STANDARD MICROCIRCUIT DRAWING SIZE A 5962-86841 DEFENSE SUPPLY CENTER COLUMBUS COLUMBUS, OHIO 43218-3990 REVISION LEVEL D SHEET 3 DSCC FORM 2234 APR 97 2. APPLICABLE

12、DOCUMENTS 2.1 Government specification, standards, and handbooks. The following specification, standards, and handbooks form a part of this drawing to the extent specified herein. Unless otherwise specified, the issues of these documents are those cited in the solicitation or contract. DEPARTMENT OF

13、 DEFENSE SPECIFICATION MIL-PRF-38535 - Integrated Circuits, Manufacturing, General Specification for. DEPARTMENT OF DEFENSE STANDARDS MIL-STD-883 - Test Method Standard Microcircuits. MIL-STD-1835 - Interface Standard Electronic Component Case Outlines. DEPARTMENT OF DEFENSE HANDBOOKS MIL-HDBK-103 -

14、 List of Standard Microcircuit Drawings. MIL-HDBK-780 - Standard Microcircuit Drawings. (Copies of these documents are available online at http:/assist.daps.dla.mil;quicksearch/ or www.dodssp.daps.mil or from the Standardization Document Order Desk, 700 Robbins Avenue, Building 4D, Philadelphia, PA

15、19111-5094.) 2.2 Order of precedence. In the event of a conflict between the text of this drawing and the references cited herein, the text of this drawing takes precedence. Nothing in this document, however, supersedes applicable laws and regulations unless a specific exemption has been obtained. 3

16、. REQUIREMENTS 3.1 Item requirements. The individual item requirements shall be in accordance with MIL-PRF-38535, appendix A for non-JAN class level B devices and as specified herein. Product built to this drawing that is produced by a Qualified Manufacturer Listing (QML) certified and qualified man

17、ufacturer or a manufacturer who has been granted transitional certification to MIL-PRF-38535 may be processed as QML product in accordance with the manufacturers approved program plan and qualifying activity approval in accordance with MIL-PRF-38535. This QML flow as documented in the Quality Manage

18、ment (QM) plan may make modifications to the requirements herein. These modifications shall not affect form, fit, or function of the device. These modifications shall not affect the PIN as described herein. A “Q“ or “QML“ certification mark in accordance with MIL-PRF-38535 is required to identify wh

19、en the QML flow option is used. 3.2 Design, construction, and physical dimensions. The design, construction, and physical dimensions shall be as specified in MIL-PRF-38535, appendix A and herein. 3.2.1 Terminal connections. The terminal connections shall be as specified on figure 1. 3.2.2 Truth tabl

20、e(s). The truth table(s) shall be as specified on figure 2. 3.2.3 Logic diagram(s). The logic diagram(s) shall be as specified on figure 3. 3.2.4 Switching waveform and test circuit. The switching waveform and test circuit shall be as specified on figure 4. 3.2.5 Case outline(s). The case outline(s)

21、 shall be in accordance with 1.2.2 herein. 3.3 Electrical performance characteristics. Unless otherwise specified herein, the electrical performance characteristics are as specified in table I and shall apply over the full case operating temperature range. 3.4 Electrical test requirements. The elect

22、rical test requirements shall be the subgroups specified in table II. The electrical tests for each subgroup are described in table I. Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-STANDARD MICROCIRCUIT DRAWING SIZE A 5962-86841 DEFENSE SUPPLY CENT

23、ER COLUMBUS COLUMBUS, OHIO 43218-3990 REVISION LEVEL D SHEET 4 DSCC FORM 2234 APR 97 3.5 Marking. Marking shall be in accordance with MIL-PRF-38535, appendix A. The part shall be marked with the PIN listed in 1.2 herein. In addition, the manufacturers PIN may also be marked. For packages where marki

24、ng of the entire SMD PIN number is not feasible due to space limitations, the manufacturer has the option of not marking the “5962-“ on the device. 3.5.1 Certification/compliance mark. A compliance indicator “C” shall be marked on all non-JAN devices built in compliance to MIL-PRF-38535, appendix A.

25、 The compliance indicator “C” shall be replaced with a “Q“ or “QML“ certification mark in accordance with MIL-PRF-38535 to identify when the QML flow option is used. 3.6 Certificate of compliance. A certificate of compliance shall be required from a manufacturer in order to be listed as an approved

26、source of supply in MIL-HDBK-103 (see 6.6 herein). The certificate of compliance submitted to DSCC-VA prior to listing as an approved source of supply shall affirm that the manufacturers product meets the requirements of MIL-PRF-38535, appendix A and the requirements herein. 3.7 Certificate of confo

27、rmance. A certificate of conformance as required in MIL-PRF-38535, appendix A shall be provided with each lot of microcircuits delivered to this drawing. 3.8 Notification of change. Notification of change to DSCC-VA shall be required for any change that affects this drawing. 3.9 Verification and rev

28、iew. DSCC, DSCCs agent, and the acquiring activity retain the option to review the manufacturers facility and applicable required documentation. Offshore documentation shall be made available onshore at the option of the reviewer. 4. VERIFICATION 4.1 Sampling and inspection. Sampling and inspection

29、procedures shall be in accordance with MIL-PRF-38535, appendix A. 4.2 Screening. Screening shall be in accordance with method 5004 of MIL-STD-883, and shall be conducted on all devices prior to quality conformance inspection. The following additional criteria shall apply: a. Burn-in test, method 101

30、5 of MIL-STD-883. (1) Test condition A, B, C, or D. The test circuit shall be maintained by the manufacturer under document revision level control and shall be made available to the preparing or acquiring activity upon request. The test circuit shall specify the inputs, outputs, biases, and power di

31、ssipation, as applicable, in accordance with the intent specified in test method 1015 of MIL-STD-883. (2) TA= +125C, minimum. b. Interim and final electrical test parameters shall be as specified in table II herein, except interim electrical parameter tests prior to burn-in are optional at the discr

32、etion of the manufacturer. Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-STANDARD MICROCIRCUIT DRAWING SIZE A 5962-86841 DEFENSE SUPPLY CENTER COLUMBUS COLUMBUS, OHIO 43218-3990 REVISION LEVEL D SHEET 5 DSCC FORM 2234 APR 97 TABLE I. Electrical per

33、formance characteristics. 1/ 2/ Test Symbol Conditions -55C TC +125C Group A subgroups Limits Unit unless otherwise specified Min Max High level output voltage VOHVIH= 2.0 V, VCC= 4.5 V, VIL= 0.8 V 1, 3 2.5 V IOH= -0.4 mA 3/ 4/ VIL= 0.7 V 2 Low level output voltage VOLVIH= 2.0 V, VCC= 4.5 V, VIL= 0.

34、8 V 1, 3 0.4 V IOL= 4.0 mA 5/ 4/ VIL= 0.7 V 2 Input clamp voltage VICVCC= 4.5 V IIN= -18 mA 1, 2, 3 -1.5 V High level input current IIH1VCC= 5.5 V, VIN= 2.7 V All other inputs = 0.0 V 1, 2, 3 20 A IIH2VCC= 5.5 V, VIN= 7.0 V All other inputs = 0.0 V 1, 2, 3 100 A Low level input current IILVCC= 5.5 V

35、, VIN= 0.4 V All other inputs = 4.5 V 1, 2, 3 -0.1 mA Output current IOVCC= 5.5 V VOUT= 2.25 V 6/ 1, 2, 3 -20 -112 mA High level supply current ICCHVCC= 5.5 V VIN 0.4 V (All inputs) 1, 2, 3 1.8 mA Low level supply current ICCLVCC= 5.5 V VIN 0.4 V (All inputs) 1, 2, 3 3.0 mA Functional tests See 4.3.

36、1c 7/ 7, 8 Propagation delay time, A, B, C, to Y tPLHVCC= 4.5 V to 5.5 V CL= 50 pF 9, 10, 11 2 12.5 ns tPHLRL= 500 8/ See figures 3 9, 10, 11 2 14 ns 1/ Unused inputs that do not directly control the pin under test must be 2.5 V or 0.4 V. 2/ The unused inputs shall not exceed 5.5 V or go less than 0

37、.0 V. No inputs shall be floated. 3/ One input to gate under test must be = VIH, the other inputs shall be 2.0 V. 4/ All outputs must be tested. In the case where only one input at VILmaximum or VIHminimum produces the proper output state, the test must be performed with each input being selected as

38、 the VILmaximum or VIHminimum input. 5/ One input to gate under test must be = VIL, the other inputs shall be 2.0 V. 6/ The output conditions have been chosen to produce a current that closely approximates one-half of the true short circuit output current, IOS. Not more than one output will be teste

39、d at a time and the duration of the test condition shall not exceed 1 second. 7/ Functional tests shall be conducted at input test conditions of GND VIL VOLand VOH VIH VCC. 8/ Propagation delay limits are based on single output switching. Unused inputs = 3.5 V or 0.3 V. Provided by IHSNot for Resale

40、No reproduction or networking permitted without license from IHS-,-,-STANDARD MICROCIRCUIT DRAWING SIZE A 5962-86841 DEFENSE SUPPLY CENTER COLUMBUS COLUMBUS, OHIO 43218-3990 REVISION LEVEL D SHEET 6 DSCC FORM 2234 APR 97 Device type 01 Case outlines C and D 2 Terminal number Terminal symbol 1 1A NC

41、2 1B 1A 3 2A 1B 4 2B 2A 5 2C NC 6 2Y 2B 7 GND NC 8 3Y 2C 9 3A 2Y 10 3B GND 11 3C NC 12 1Y 3Y 13 1C 3A 14 VCC3B 15 - - - NC 16 - - - 3C 17 - - - NC 18 - - - 1Y 19 - - - 1C 20 - - - VCCFIGURE 1. Terminal connections. Provided by IHSNot for ResaleNo reproduction or networking permitted without license

42、from IHS-,-,-STANDARD MICROCIRCUIT DRAWING SIZE A 5962-86841 DEFENSE SUPPLY CENTER COLUMBUS COLUMBUS, OHIO 43218-3990 REVISION LEVEL D SHEET 7 DSCC FORM 2234 APR 97 (each gate) Inputs Output A B C Y H H H H L X X L X L X L X X L L H = High voltage level L = Low voltage level X = Irrelevant FIGURE 2.

43、 Truth table. FIGURE 3. Logic diagram. Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-STANDARD MICROCIRCUIT DRAWING SIZE A 5962-86841 DEFENSE SUPPLY CENTER COLUMBUS COLUMBUS, OHIO 43218-3990 REVISION LEVEL D SHEET 8 DSCC FORM 2234 APR 97 NOTES: 1. C

44、Lincludes probe and jig capacitance. 2. All input pulses have the following characteristics: PRR 10 MHz, duty cycle = 50%, tr= tf= 3 ns 1 ns. 3. The outputs are measured one at a time with one input transition per measurement. FIGURE 4. Switching waveform and test circuit. Provided by IHSNot for Res

45、aleNo reproduction or networking permitted without license from IHS-,-,-STANDARD MICROCIRCUIT DRAWING SIZE A 5962-86841 DEFENSE SUPPLY CENTER COLUMBUS COLUMBUS, OHIO 43218-3990 REVISION LEVEL D SHEET 9 DSCC FORM 2234 APR 97 TABLE II. Electrical test requirements. MIL-STD-883 test requirements Subgro

46、ups (in accordance with MIL-STD-883, method 5005, table I) Interim electrical parameters (method 5004) - - - Final electrical test parameters (method 5004) 1*, 2, 3, 7, 8A, 8B, 9, 10, 11 Group A test requirements (method 5005) 1, 2, 3, 7, 8A, 8B, 9, 10, 11 Groups C and D end-point electrical paramet

47、ers (method 5005) 1, 2, 3 * PDA applies to subgroup 1. 4.3 Quality conformance inspection. Quality conformance inspection shall be in accordance with method 5005 of MIL-STD-883 including groups A, B, C, and D inspections. The following additional criteria shall apply. 4.3.1 Group A inspection. a. Te

48、sts shall be as specified in table II herein. b. Subgroups 4, 5, and 6 in table I, method 5005 of MIL-STD-883 shall be omitted. c. Subgroups 7, 8A, and 8B shall include verification of the truth table. 4.3.2 Groups C and D inspections. a. End-point electrical parameters shall be as specified in table II herein. b. Steady-state life test conditions, method 1005 of MIL-STD-883. (1) Test condition A, B, C, or D. The test circuit shall be maintained by the manufacturer under docume