DLA SMD-5962-80013 REV T-2011 MICROCIRCUIT HYBRID LINEAR OPERATIONAL AMPLIFIER THICK FILM.pdf
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1、 REVISIONS LTR DESCRIPTION DATE (YR-MO-DA) APPROVED A Change TAto TC; Minor corrections to table I; rewrite para 3.7; Change vendor. 82-03-30 N. A. Hauck B Reinstate vendor, FSCM 27014. 82-05-14 W. E. Shoup C Modify para 3.7; general update. 83-08-03 N. A. Hauck D Add vendors FSCMs 63071 and 64762.
2、Remove vendor FSCM 27014. Editorial changes throughout. 84-12-14 N. A. Hauck E Add vendor FSCM 27014. 85-12-03 N. A. Hauck F Convert to military format. Change CAGE to 67268. Add vendors CAGES 23223 and 34031. 88-01-14 W. Heckman G Made technical change to 1.3. Removed CAGE 63071. Made editorial cha
3、nges throughout. Changed to reflect MIL-H-38534 processing. 90-01-08 W. Heckman H Corrections to table I. Update document. Editorial changes throughout. 92-06-26 G. A. Lude J Changes in accordance with NOR 5962-R195-93. 93-06-22 K. A. Cottongim K Changes in accordance with NOR 5962-R266-94. 94-08-17
4、 K. A. Cottongim L Changes in accordance with NOR 5962-R102-96. 96-04-15 K. A. Cottongim M Changes IAW NOR 5962-R195-93, 5962-R266-94, and 5962-R102-96. Entire document redrawn. 96-08-02 Raymond Monnin N Remove CAGE codes 23223 and 64762. Changes to table I. 98-06-22 K. A. Cottongim P Updated drawin
5、g to the latest requirements. -sld 05-04-04 Raymond Monnin R Table I, supply voltage rejection ratios test, Group A subgroups column, add “1, 2, 3 or“. Output voltage swing (maximum) test: Delete “(maximum)“ and for the Group A subgroups column, add “or 4, 5, 6“. 06-03-27 Raymond Monnin T Add device
6、 type 02. Table I, add note 3 to SVRR(), CMRR, VOP, AVand remove note 3 from AVS(). Table II, correct the subgroups for Final electrical parameters and Group A test requirements. -gz 11-02-10 Charles F. Saffle THE ORIGINAL FIRST SHEET OF THIS DRAWING HAS BEEN REPLACED. CURRENT CAGE CODE 67268 REV SH
7、EET REV SHEET REV STATUS REV T T T T T T T T T OF SHEETS SHEET 1 2 3 4 5 6 7 8 9 PMIC N/A PREPARED BY C. R. Jackson DLA LAND AND MARITIME STANDARD MICROCIRCUIT DRAWING CHECKED BY William E. Shoup COLUMBUS, OHIO 43218-3990 http:/www.dscc.dla.mil THIS DRAWING IS AVAILABLE FOR USE BY ALL DEPARTMENTS AP
8、PROVED BY N.A Hauck MICROCIRCUIT, HYBRID, LINEAR, OPERATIONAL AMPLIFIER, THICK FILM AND AGENCIES OF THE DEPARTMENT OF DEFENSE DRAWING APPROVAL DATE 80-12-22 AMSC N/A REVISION LEVEL T SIZE A CAGE CODE 14933 80013 SHEET 1 OF 9 DSCC FORM 2233 APR 97 5962-E078-11Provided by IHSNot for ResaleNo reproduct
9、ion or networking permitted without license from IHS-,-,-STANDARD MICROCIRCUIT DRAWING SIZE A 80013 DLA LAND AND MARITIME COLUMBUS, OHIO 43218-3990 REVISION LEVEL T SHEET 2 DSCC FORM 2234 APR 97 1. SCOPE 1.1 Scope. This drawing describes device requirements for class H hybrid microcircuits to proces
10、sed in accordance with MIL-PRF-38534. 1.2 PIN. The PIN shall be as shown in the following example: 80013 01 Z C Drawing number Device type Case outline Lead finish (see 1.2.1) (see 1.2.2) (see 1.2.3) 1.2.1 Device types. The device types identify the circuit function as follows: Device type Generic n
11、umber Circuit function 01 FLH0032G, MSK 0032B Operational amplifier 02 MSK 0032B Operational amplifier 1.2.2 Case outline. The case outline are as designated in MIL-STD-1835 and as follows: Outline letter Descriptive designator Terminals Package style Z See figure 1 12 Can 1.2.3 Lead finish. The lea
12、d finish shall be as specified in MIL-PRF-38534. 1.3 Absolute maximum ratings. 1/ Supply voltage range 18 V dc maximum Input voltage range . 18 V dc Maximum power dissipation (PD) TA= +25C . 1.5 W 2/ 3/ Storage temperature range -65C to +150C Lead temperature (soldering, 10 seconds) . +300C Junction
13、 temperature(TJ) +150C 1.4 Recommended operating conditions. Supply voltage (VS) . 15 V dc Ambient operating temperature range (TA) . -55C to +125C 2. APPLICABLE DOCUMENTS 2.1 Government specification, standards, and handbooks. The following specification, standards, and handbooks form a part of thi
14、s drawing to the extent specified herein. Unless otherwise specified, the issues of these documents are those cited in the solicitation or contract. DEPARTMENT OF DEFENSE SPECIFICATIONS MIL-PRF-38534 - Hybrid Microcircuits, General Specification for. 1/ Stresses above the absolute maximum ratings ma
15、y cause permanent damage to the device. Extended operation at the maximum levels may degrade performance and affect reliability. 2/ No heat sink. 3/ Derate at 10 mW per C. Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-STANDARD MICROCIRCUIT DRAWING
16、SIZE A 80013 DLA LAND AND MARITIME COLUMBUS, OHIO 43218-3990 REVISION LEVEL T SHEET 3 DSCC FORM 2234 APR 97 DEPARTMENT OF DEFENSE STANDARDS MIL-STD-883 - Test Method Standard Microcircuits. MIL-STD-1835 - Interface Standard Electronic Component Case Outlines. DEPARTMENT OF DEFENSE HANDBOOKS MIL-HDBK
17、-103 - List of Standard Microcircuit Drawings. MIL-HDBK-780 - Standard Microcircuit Drawings. (Copies of these documents are available online at https:/assist.daps.dla.mil/quicksearch/ or from the Standardization Document Order Desk, 700 Robbins Avenue, Building 4D, Philadelphia, PA 19111-5094.) 2.2
18、 Order of precedence. In the event of a conflict between the text of this drawing and the references cited herein, the text of this drawing takes precedence. Nothing in this document, however, supersedes applicable laws and regulations unless a specific exemption has been obtained. 3. REQUIREMENTS 3
19、.1 Item requirements. The individual item performance requirements for device class H shall be in accordance with MIL-PRF-38534. Compliance with MIL-PRF-38534 may include the performance of all tests herein or as designated in the device manufacturers Quality Management (QM) plan or as designated fo
20、r applicable device class. The manufacturer may eliminate, modify or optimize the tests and inspections herein, however the performance requirements as defined in MIL-PRF-38534 shall be met for the applicable device class. In addition, the modification in the QM plan shall not affect the form, fit,
21、or function of the device for the applicable device class. 3.2 Design, construction, and physical dimensions. The design, construction, and physical dimensions shall be as specified in MIL-PRF-38534 and herein. 3.2.1 Case outline. The case outline shall be in accordance with 1.2.2 herein and figure
22、1. 3.2.2 Terminal connections. The terminal connections shall be as specified on figure 2. 3.3 Electrical performance characteristics. Unless otherwise specified herein, the electrical performance characteristics are as specified in table I and shall apply over the full specified operating temperatu
23、re range. 3.4 Electrical test requirements. The electrical test requirements shall be the subgroups specified in table II. The electrical tests for each subgroup are defined in table I. 3.5 Marking of devices. Marking of devices shall be in accordance with MIL-PRF-38534. The device shall be marked w
24、ith the PIN listed in 1.2 herein. In addition, the manufacturers vendor similar PIN may also be marked. 3.6 Data. In addition to the general performance requirements of MIL-PRF-38534, the manufacturer of the device described herein shall maintain the electrical test data (variables format) from the
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