DLA SMD-5962-78019 REV F-2012 MICROCIRCUIT LINEAR DUAL HIGH SPEED VOLTAGE COMPARATOR MONOLITHIC SILICON.pdf

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1、 REVISIONS LTR DESCRIPTION DATE (YR-MO-DA) APPROVED A Change to approved source. Table I changes; burn-in and life test condition changes. 84-08-27 M. A. FRYE B Page 4 change test condition RS, VCC, and VINfor CMR test. Page 5 delete footnote 4 for tPLH, tPHL. Page 5 add special subgroup 12 for tS.

2、Page 5 footnote 5 change 500 LFPM to 500 LFPM. Editorial changes throughout. 85-07-12 M. A. FRYE C Pages 4 and 5, table I: change test conditions for VIO, IIO, IIB, CMR and PSRR. Add footnote for VIO/ T. Page 8, table II: change subgroups for final electrical, groups A, C, and D test. Guarantee subg

3、roups 10 and 11. Add subgroup 12. Page 9, 6.8: change similar vendor type. Editorial changes throughout. 86-05-15 M. A. FRYE D Change to standardized military drawing format. Change CAGE code to 67268. Add device types 02 and 03. Add vendor CAGE 34031. Delete latch setup time test. Change test condi

4、tions for IIOand IIB. Add maximum and minimum temperature testing to CMRR and PSRR. Change footnote 2/ for 1.3. Add footnotes 3/ and 4/ to 1.4. Add case outline 2. Add footnotes 4/, 5/, and 6/ to table I. Add latch enable voltage to the recommended operating conditions. Add latch enable propagation

5、delay to table I to be tested. Editorial changes throughout. 89-05-09 M. A. FRYE E Drawing updated to reflect current requirements. - ro 06-10-03 R. MONNIN F Update drawing as part of five year review. -rrp 12-01-17 C. SAFFLE CURRENT CAGE CODE 67268 THE ORIGINAL FIRST SHEET OF THIS DRAWING HAS BEEN

6、REPLACED. REV SHEET REV SHEET REV STATUS REV F F F F F F F F F F OF SHEETS SHEET 1 2 3 4 5 6 7 8 9 10 PMIC N/A PREPARED BY JOE W. DENNIS DLA LAND AND MARITIME COLUMBUS, OHIO 43218-3990 http:/www.landandmaritime.dla.mil STANDARD MICROCIRCUIT DRAWING THIS DRAWING IS AVAILABLE FOR USE BY ALL DEPARTMENT

7、S AND AGENCIES OF THE DEPARTMENT OF DEFENSE CHECKED BY C.R. JACKSON APPROVED BY N. A. HAUCK MICROCIRCUIT, LINEAR, DUAL, HIGH SPEED, VOLTAGE COMPARATOR, MONOLITHIC SILICON DRAWING APPROVAL DATE 79-01-25 AMSC N/A REVISION LEVEL F SIZE A CAGE CODE 14933 78019 SHEET 1 OF 10 DSCC FORM 2233 APR 97 5962-E1

8、34-12 Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-STANDARD MICROCIRCUIT DRAWING SIZE A 78019 DLA LAND AND MARITIME COLUMBUS, OHIO 43218-3990 REVISION LEVEL F SHEET 2 DSCC FORM 2234 APR 97 1. SCOPE 1.1 Scope. This drawing describes device requirem

9、ents for MIL-STD-883 compliant, non-JAN class level B microcircuits in accordance with MIL-PRF-38535, appendix A. 1.2 Part or Identifying Number (PIN). The complete PIN is as shown in the following example: 78019 01 E A Drawing number Device type (see 1.2.1) Case outline (see 1.2.2) Lead finish (see

10、 1.2.3) 1.2.1 Device type(s). The device type(s) identify the circuit function as follows: Device type Generic number Circuit function 01 AM687 Dual, voltage comparator 02 AM6687 Dual, voltage comparator 03 AD96687 Dual, voltage comparator 1.2.2 Case outline(s). The case outline(s) are as designated

11、 in MIL-STD-1835 and as follows: Outline letter Descriptive designator Terminals Package style E GDIP1-T16 or CDIP2-T16 16 Dual in line 2 CQCC1-N20 20 Square leadless chip carrier 1.2.3 Lead finish. The lead finish is as specified in MIL-PRF-38535, appendix A. 1.3 Absolute maximum ratings. 1/ Supply

12、 voltage range (VCC): Device types 01 and 02 . -7 V dc to +7 V dc Device type 03 -6.5 V dc to +6.5 V dc Input voltage range (VI): Device types 01 and 02 . -4 V dc to +4 V dc Device type 03 -5 V dc to +5 V dc 2/ Storage temperature range . -65C to +150C Maximum power dissipation (PD): Device types 01

13、 and 02 . 450 mW Device type 03 500 mW Output current (IO) 30 mA Lead temperature (soldering, 10 seconds) . +300C Junction temperature (TJ) . +175C Differential input voltage (VID): Device types 01 and 02 . -6 V dc to +6 V dc Device type 03 -5.5 V dc to +5.5 V dc Thermal resistance, junction-to-case

14、 (JC) . See MIL-STD-1835 Thermal resistance, junction-to-ambient (JA): Case E 93C/W Case 2 . 82C/W _ 1/ The device performance shall not be impaired when subjected to maximum rating conditions. 2/ VI VCC. Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,

15、-,-STANDARD MICROCIRCUIT DRAWING SIZE A 78019 DLA LAND AND MARITIME COLUMBUS, OHIO 43218-3990 REVISION LEVEL F SHEET 3 DSCC FORM 2234 APR 97 1.4 Recommended operating conditions. Supply voltage (VCC) +VCC= +5.0 V dc, -VCC= -5.2 V dc Minimum operating voltage (+VCCto VCC) 9.7 V dc 3/ Latch enable vol

16、tage: VIH-1.1 V VIL. -1.5 V Ambient operating temperature range (TA) . -55C to +125C 4/ 2. APPLICABLE DOCUMENTS 2.1 Government specification, standards, and handbooks. The following specification, standards, and handbooks form a part of this drawing to the extent specified herein. Unless otherwise s

17、pecified, the issues of these documents are those cited in the solicitation or contract. DEPARTMENT OF DEFENSE SPECIFICATION MIL-PRF-38535 - Integrated Circuits, Manufacturing, General Specification for. DEPARTMENT OF DEFENSE STANDARDS MIL-STD-883 - Test Method Standard Microcircuits. MIL-STD-1835 -

18、 Interface Standard Electronic Component Case Outlines. DEPARTMENT OF DEFENSE HANDBOOKS MIL-HDBK-103 - List of Standard Microcircuit Drawings. MIL-HDBK-780 - Standard Microcircuit Drawings. (Copies of these documents are available online at https:/assist.daps.dla.mil/quicksearch/ or from the Standar

19、dization Document Order Desk, 700 Robbins Avenue, Building 4D, Philadelphia, PA 19111-5094.) 2.2 Order of precedence. In the event of a conflict between the text of this drawing and the references cited herein, the text of this drawing takes precedence. Nothing in this document, however, supersedes

20、applicable laws and regulations unless a specific exemption has been obtained. 3. REQUIREMENTS 3.1 Item requirements. The individual item requirements shall be in accordance with MIL-PRF-38535, appendix A for non-JAN class level B devices and as specified herein. Product built to this drawing that i

21、s produced by a Qualified Manufacturer Listing (QML) certified and qualified manufacturer or a manufacturer who has been granted transitional certification to MIL-PRF-38535 may be processed as QML product in accordance with the manufacturers approved program plan and qualifying activity approval in

22、accordance with MIL-PRF-38535. This QML flow as documented in the Quality Management (QM) plan may make modifications to the requirements herein. These modifications shall not affect form, fit, or function of the device. These modifications shall not affect the PIN as described herein. A “Q“ or “QML

23、“ certification mark in accordance with MIL-PRF-38535 is required to identify when the QML flow option is used. 3.2 Design, construction, and physical dimensions. The design, construction, and physical dimensions shall be as specified in MIL-PRF-38535, appendix A and herein. _ 3/ The information is

24、provided under the recommended operating conditions for design references only. Device is guaranteed to function at 9.7 V dc. However, this parameter is not tested. 4/ Devices require a thermal equilibrium to be established with transverse airflow of 500 LFPM. Provided by IHSNot for ResaleNo reprodu

25、ction or networking permitted without license from IHS-,-,-STANDARD MICROCIRCUIT DRAWING SIZE A 78019 DLA LAND AND MARITIME COLUMBUS, OHIO 43218-3990 REVISION LEVEL F SHEET 4 DSCC FORM 2234 APR 97 TABLE I. Electrical performance characteristics. Test Symbol Conditions 1/ 2/ 3/ -55C TA +125C unless o

26、therwise specified Group A subgroups Device type Limits Unit Min Max Input offset voltage VIORS= 100 , VCM= 0 V dc 1 All 2.0 mV 2,3 3.0 Input offset voltage 4/ VIO/ 1,2,3 01 10 temperature T 02 15.0 coefficient 03 20 Input offset current IIORS= 100 , VCM= 0 V dc, VCM= 2.7 V dc, 1,2 01 1.0 A VCM= -3.

27、3 V dc, TA= +25C, +125C 02 1.5 RS= 100 , VCM= 0 V dc, VCM= 0.5 V dc, TA= +25C 1 03 1.0 RS= 100 , VCM= 0 V dc, VCM= 2.7 V dc, 3 01 1.6 VCM= -3.3 V dc, TA= -55C 02 3.0 RS= 100 , VCM= 0 V dc, VCM= 0.5 V dc, TA= -55C, +125C 2,3 03 1.2 See footnotes at end of table. Provided by IHSNot for ResaleNo reprod

28、uction or networking permitted without license from IHS-,-,-STANDARD MICROCIRCUIT DRAWING SIZE A 78019 DLA LAND AND MARITIME COLUMBUS, OHIO 43218-3990 REVISION LEVEL F SHEET 5 DSCC FORM 2234 APR 97 TABLE I. Electrical performance characteristics Continued. Test Symbol Conditions 1/ 2/ 3/ -55C TA +12

29、5C unless otherwise specified Group A subgroups Device type Limits Unit Min Max Input bias current IIBRS= 100 , VCM= 0 V dc, VCM= 2.7 V dc, 1,2 01 10 A VCM= -3.3 V dc, TA= +25C, +125C 02 15 RS= 100 , VCM= 0 V dc, VCM= 0.5 V dc, TA= +25C 1 03 10 RS= 100 , VCM= 0 V dc, VCM= 2.7 V dc, 3 01 16 VCM= -3.3

30、 V dc, TA= -55C 02 30 RS= 100 , VCM= 0 V dc, VCM= 0.5 V dc, TA= -55C, +125C 2,3 03 16 Input voltage range VCM1,2,3 01,02 -3.3 2.7 V 03 -2.5 +5.0 Input voltage common mode rejection ratio CMRR -3.3 V VCM 2.7 V, RS= 100 4,5,6 01,02 80 dB -2.5 V VCM 5 V, RS= 100 03 80 Power supply rejection ratio PSRR

31、RS= 100 , VS= 5% 4,5,6 All 60 dB High level output voltage VOHTA= +25C 1 01,02 -.960 -.810 V TA= +125C 2 -.850 -.620 TA= -55C 3 -1.10 -.920 1,2,3 03 -1.10 Low level output voltage VOLTA= +25C 1 01,02 -1.85 -1.65 V TA= +125C 2 -1.81 -1.57 TA= -55C 3 -1.91 -1.69 1,2,3 03 -1.50 See footnotes at end of

32、table. Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-STANDARD MICROCIRCUIT DRAWING SIZE A 78019 DLA LAND AND MARITIME COLUMBUS, OHIO 43218-3990 REVISION LEVEL F SHEET 6 DSCC FORM 2234 APR 97 TABLE I. Electrical performance characteristics Continued

33、. Test Symbol Conditions 1/ 2/ 3/ -55C TA +125C unless otherwise specified Group A subgroups Device type Limits Unit Min Max Positive supply current +ICC1,2,3 01,02 32 mA 03 18 Negative supply current -ICC1,2,3 01,02 44 mA 03 36 Propagation delay time tPD TA= +25C and 5/ TA= -55C 9,11 01 10 ns TA= +

34、125C 5/ 10 20 TA= +25C and 6/ TA= -55C 9,11 02 4.0 TA= +125C 6/ 10 1.5 6.0 TA= +25C and 6/ TA= -55C 9,11 03 1.5 3.5 TA= +125C 6/ 10 1.5 6.0 Propagation delay time, latch enable to output tPD (E) TA= +25C and TA= -55C 9,11 01,02 8 ns TA= +125C 10 12.5 TA= +25C 9 03 3.5 TA= +125C and TA= -55C 10,11 7

35、1/ Unless otherwise specified, +VCC= +5.0 V, -VCC= -5.2 V, VT= -2.0 V dc, and RL= 50 . 2/ Devices require a thermal equilibrium to be established with transverse airflow of 500 LFPM. 3/ Production pulse tests devices at correlated temperatures of -35C and +150C to compensate for high power steady st

36、ate operation for device type 01. 4/ Guaranteed, if not tested. 5/ 100 mV step input with 5 mV overdrive, tPD+ on output Q, tPD- on output of Q . 6/ 100 mV step input with 10 mV overdrive, tPD+ on output Q, tPD- on output of Q . Provided by IHSNot for ResaleNo reproduction or networking permitted wi

37、thout license from IHS-,-,-STANDARD MICROCIRCUIT DRAWING SIZE A 78019 DLA LAND AND MARITIME COLUMBUS, OHIO 43218-3990 REVISION LEVEL F SHEET 7 DSCC FORM 2234 APR 97 Device types 01, 02, 03 03 Case outlines E 2 Terminal number Terminal symbol 1 OUTPUT A NC 2 OUTPUT A OUTPUT A 3 GROUND OUTPUT A 4 LATC

38、H ENABLE A GROUND 5 LATCH ENABLE A LATCH ENABLE A 6 -VCCNC 7 INVERTING INPUT A LATCH ENABLE A 8 NONINVERTING INPUT A -VCC9 NONINVERTING INPUT B INVERTING INPUT A 10 INVERTING INPUT B NONINVERTING INPUT A 11 +VCCNC 12 LATCH ENABLE B NONINVERTING INPUT B 13 LATCH ENABLE B INVERTING INPUT B 14 GROUND +

39、VCC15 OUTPUT B LATCH ENABLE B 16 OUTPUT B NC 17 - LATCH ENABLE B 18 - GROUND 19 - OUTPUT B 20 - OUTPUT B NC = No connection FIGURE 1. Terminal connections. Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-STANDARD MICROCIRCUIT DRAWING SIZE A 78019 DLA

40、 LAND AND MARITIME COLUMBUS, OHIO 43218-3990 REVISION LEVEL F SHEET 8 DSCC FORM 2234 APR 97 3.2.1 Case outlines. The case outlines shall be in accordance with 1.2.2 herein. 3.2.2 Terminal connections. The terminal connections shall be as specified on figure 1. 3.3 Electrical performance characterist

41、ics. Unless otherwise specified herein, the electrical performance characteristics are as specified in table I and shall apply over the full ambient operating temperature range. 3.4 Electrical test requirements. The electrical test requirements shall be the subgroups specified in table II. The elect

42、rical tests for each subgroup are described in table I. 3.5 Marking. Marking shall be in accordance with MIL-PRF-38535, appendix A. The part shall be marked with the PIN listed in 1.2 herein. In addition, the manufacturers PIN may also be marked. 3.5.1 Certification/compliance mark. A compliance ind

43、icator “C” shall be marked on all non-JAN devices built in compliance to MIL-PRF-38535, appendix A. The compliance indicator “C” shall be replaced with a “Q“ or “QML“ certification mark in accordance with MIL-PRF-38535 to identify when the QML flow option is used. 3.6 Certificate of compliance. A ce

44、rtificate of compliance shall be required from a manufacturer in order to be listed as an approved source of supply in MIL-HDBK-103 (see 6.6 herein). The certificate of compliance submitted to DLA Land and Maritime -VA prior to listing as an approved source of supply shall affirm that the manufactur

45、ers product meets the requirements of MIL-PRF-38535, appendix A and the requirements herein. 3.7 Certificate of conformance. A certificate of conformance as required in MIL-PRF-38535, appendix A shall be provided with each lot of microcircuits delivered to this drawing. 3.8 Notification of change. N

46、otification of change to DLA Land and Maritime -VA shall be required for any change that affects this drawing. 3.9 Verification and review. DLA Land and Maritime, DLA Land and Maritimes agent, and the acquiring activity retain the option to review the manufacturers facility and applicable required d

47、ocumentation. Offshore documentation shall be made available onshore at the option of the reviewer. 4. VERIFICATION 4.1 Sampling and inspection. Sampling and inspection procedures shall be in accordance with MIL-PRF-38535, appendix A. 4.2 Screening. Screening shall be in accordance with method 5004

48、of MIL-STD-883, and shall be conducted on all devices prior to quality conformance inspection. The following additional criteria shall apply: a. Burn-in test, method 1015 of MIL-STD-883. (1) Test condition A, B, C, or D. The test circuit shall be maintained by the manufacturer under document revision level control and shall be made available to the preparing or acquiring activity upon request. The test circuit shall specify